Abstract: Disclosed is a method for producing element chips. The method includes: a preparing step of preparing a substrate 10 that is held on a holding sheet 22 that is supported by a frame 21, the substrate including element regions and dicing regions; a protective film forming step of forming a protective film 15 so as to cover the frame 21, the holding sheet 22, and the substrate 10; a patterning step of removing a part of the protective film 15 so as to expose the dicing regions of the substrate 10; a plasma dicing step including a process that uses a plasma that contains fluorine, the plasma dicing step being a step of individualizing the substrate 10 into a plurality of element chips; and a fluorine removing step of removing, together with the protective film 15, fluorine attached to the protective film 15 in the plasma dicing step.

Abstract: The disclosed element chip manufacturing method includes: a first step of imparting hydrophilicity to a first surface 11 of a substrate 1, the first surface 11 including element regions 11A and dicing regions 11B defining the element regions 11A; a second step of applying a raw material liquid containing a water-soluble resin onto the first surface 11, to form a water-soluble resin layer 20 on the first surface 11; a third step of applying a laser beam to the water-soluble resin layer 20 covering the dicing regions 11B, to form openings 20a that expose the dicing regions 11B, in the water-soluble resin layer 20; a fourth step of etching the dicing regions 11B exposed at the openings 20a, with plasma, to obtain element chips 30; and a fifth step of removing the water-soluble resin layer 20 by bringing the element chips 30 into contact with a water-containing cleaning liquid.

Abstract: A print head includes: an integrated circuit apparatus that switches whether or not to supply drive signals to a plurality of piezoelectric elements, and includes a first circuit block that switches whether or not to supply the drive signal, a second circuit block that switches whether or not to supply the drive signal, a third circuit block that switches whether or not to supply the drive signal, a fourth circuit block, and a first buffer area, a second buffer area, and a third buffer area in which no circuit element is located, in which the first buffer area is located between the first circuit block and the fourth circuit block, the second buffer area is located between the second circuit block and the fourth circuit block, and the third buffer area is located between the third circuit block and the fourth circuit block.

Abstract: Disclosed is a method for producing element chips. The method includes: a preparing step of preparing a substrate 10 that is held on a holding sheet 22 that is supported by a frame 21, the substrate including element regions and dicing regions; a protective film forming step of forming a protective film 15 so as to cover the frame 21, the holding sheet 22, and the substrate 10; a patterning step of removing a part of the protective film 15 so as to expose the dicing regions of the substrate 10; a plasma dicing step including a process that uses a plasma that contains fluorine, the plasma dicing step being a step of individualizing the substrate 10 into a plurality of element chips; and a fluorine removing step of removing, together with the protective film 15, fluorine attached to the protective film 15 in the plasma dicing step.

Abstract: A print head includes: an integrated circuit apparatus that switches whether or not to supply drive signals to a plurality of piezoelectric elements, and includes a first circuit block that switches whether or not to supply the drive signal, a second circuit block that switches whether or not to supply the drive signal, a third circuit block that switches whether or not to supply the drive signal, a fourth circuit block, and a first buffer area, a second buffer area, and a third buffer area in which no circuit element is located, in which the first buffer area is located between the first circuit block and the fourth circuit block, the second buffer area is located between the second circuit block and the fourth circuit block, and the third buffer area is located between the third circuit block and the fourth circuit block.

Abstract: A head unit control circuit controls a head unit. The head unit includes: an ejector, a determination circuit, and an ejection limit circuit. The injector includes a displaceable piezoelectric element. The piezoelectric element is displaced by changing a drive signal potential. The determination circuit determines whether the piezoelectric element has a predetermined electrical storage capability. The ejection limit circuit stops the drive signal to limit the ejection of the liquid based on the determination. The head unit control circuit supplies an instruction signal, a first designation signal, and a second designation signal to the head unit. The instruction signal instructs the head unit to execute the determination. The determination circuit executes the determination during a period in which the first designation signal is set to a high level, the second designation signal is set to a low level, and the instruction signal is supplied.

Abstract: A piezoelectric print head includes a piezoelectric element; a nozzle that ejects liquid when the piezoelectric element is driven; a transmission gate that switches between supply and non-supply of a driving signal for driving the piezoelectric element to the piezoelectric element; a history-information memory that holds history information indicating history of ON or OFF of the transmission gate; and a switch-operation stop controller that stops a switch operation that causes the transmission gate to be turned OFF from ON or to be turned ON from OFF, in accordance with the history information.

Abstract: A piezoelectric print head includes a piezoelectric element; a nozzle that ejects liquid when the piezoelectric element is driven; a transmission gate that switches between supply and non-supply of a driving signal for driving the piezoelectric element to the piezoelectric element; a history-information memory that holds history information indicating history of ON or OFF of the transmission gate; and a switch-operation stop controller that stops a switch operation that causes the transmission gate to be turned OFF from ON or to be turned ON from OFF, in accordance with the history information.

Abstract: A head unit includes a discharge section, a determination circuit, and a discharge limitation circuit. The discharge section is equipped with a piezoelectric element that is configured to be displaced in accordance with changes in potential of a drive signal when the drive signal is supplied. The discharge section is configured to discharge a liquid in accordance with displacement of the piezoelectric element. The determination circuit is configured to determine whether or not the piezoelectric element has a predetermined power storage capability. The discharge limitation circuit is configured to stop supply of the drive signal to the piezoelectric element and limit discharging of liquid from the discharge section when a result of determination is negative.

Abstract: A head unit control circuit controls a head unit. The head unit includes: an ejector, a determination circuit, and an ejection limit circuit. The injector includes a displaceable piezoelectric element. The piezoelectric element is displaced by changing a drive signal potential. The determination circuit determines whether the piezoelectric element has a predetermined electrical storage capability. The ejection limit circuit stops the drive signal to limit the ejection of the liquid based on the determination. The head unit control circuit supplies an instruction signal, a first designation signal, and a second designation signal to the head unit. The instruction signal instructs the head unit to execute the determination. The determination circuit executes the determination during a period in which the first designation signal is set to a high level, the second designation signal is set to a low level, and the instruction signal is supplied.

Abstract: A liquid discharge apparatus includes a controller, a drive signal generation unit, a discharge unit, a residual vibration detection unit, and an amplification unit, in which the controller generates discharge control data for controlling discharge of liquid and controls an amplification rate of an amplification unit, the drive signal generation unit generates and outputs a drive signal including a plurality of waveforms driving the discharge unit, the discharge unit discharges the liquid by applying a waveform assigned by the discharge control data among the plurality of waveforms included in the drive signal, the residual vibration detection unit detects residual vibration of the discharge unit and outputs a residual vibration signal indicating the residual vibration, after the discharge unit is driven by the drive signal, and the amplification unit amplifies the residual vibration signal with the amplification rate controlled by the controller and outputs the amplified signal.

Abstract: A head unit includes a discharge section, a determination circuit, and a discharge limitation circuit. The discharge section is equipped with a piezoelectric element that is configured to be displaced in accordance with changes in potential of a drive signal when the drive signal is supplied. The discharge section is configured to discharge a liquid in accordance with displacement of the piezoelectric element. The determination circuit is configured to determine whether or not the piezoelectric element has a predetermined power storage capability. The discharge limitation circuit is configured to stop supply of the drive signal to the piezoelectric element and limit discharging of liquid from the discharge section when a result of determination is negative.

Abstract: A liquid discharge apparatus includes a controller, a drive signal generation unit, a discharge unit, a residual vibration detection unit, and an amplification unit, in which the controller generates discharge control data for controlling discharge of liquid and controls an amplification rate of an amplification unit, the drive signal generation unit generates and outputs a drive signal including a plurality of waveforms driving the discharge unit, the discharge unit discharges the liquid by applying a waveform assigned by the discharge control data among the plurality of waveforms included in the drive signal, the residual vibration detection unit detects residual vibration of the discharge unit and outputs a residual vibration signal indicating the residual vibration, after the discharge unit is driven by the drive signal, and the amplification unit amplifies the residual vibration signal with the amplification rate controlled by the controller and outputs the amplified signal.

Abstract: A liquid discharge head of the invention includes a drive substrate, a flexible wiring substrate mounted in a standing state with respect to the drive substrate, and a semiconductor device which is mounted on the flexible wiring substrate and which has a pair of long sides in a direction crossing a direction in which the flexible wiring substrate stands. A plurality of output electrodes respectively electrically connected to the electrodes of the drive substrate are arranged on and along the long side of the semiconductor device facing the drive substrate. A plurality of input electrodes are arranged on and along the long side opposite to the long side of the semiconductor device facing the drive substrate. A circuit that drives the drive element is provided in a region between two certain input electrodes of the semiconductor device.

Abstract: A liquid discharge head of the invention includes a drive substrate, a flexible wiring substrate mounted in a standing state with respect to the drive substrate, and a semiconductor device which is mounted on the flexible wiring substrate and which has a pair of long sides in a direction crossing a direction in which the flexible wiring substrate stands. A plurality of output electrodes respectively electrically connected to the electrodes of the drive substrate are arranged on and along the long side of the semiconductor device facing the drive substrate. A plurality of input electrodes are arranged on and along the long side opposite to the long side of the semiconductor device facing the drive substrate. A circuit that drives the drive element is provided in a region between two certain input electrodes of the semiconductor device.

Abstract: A substrate placement process uses a tray in which a plurality of substrate receiving holes are provided to receive substrates and which has substrate support portions protruding from inner walls of the substrate receiving holes. The tray is placed onto a tray support portion of a substrate stage and places substrates onto substrate holding portions, respectively, so that edge portions of the substrates projected beyond end edges of the substrate holding portions and are apart from the substrate support portions. The first plasma processing process reduces internal pressure of a chamber and supplies a process gas thereto to fulfill plasma processing for the individual substrates.

Abstract: A process for, with use of a tray in which substrate receiving holes are provided and which has substrate support portions protruding from inner walls of the substrate receiving holes, placing the tray onto a tray support portion of a substrate stage and placing substrates onto the substrate holding portions, so that edge portions of the substrates projected out of end edges of the substrate holding portions and the substrate support portions are separated; a process for reducing pressure in a chamber and supplying a process gas thereto to fulfill plasma processing for the substrates; and a process for, with the tray and the substrates placed on the substrate stage, reducing the pressure in the chamber and supplying a process gas to fulfill plasma processing so that by-products stuck to edge portions of the substrates and the substrate support portions are removed.

Abstract: A plasma-processing apparatus providing a resin mold domed enough to allow no bonding wires to be exposed is presented. The plasma-processing apparatus cleans a board including a chip mounted thereon and a disposing area for a pad formed around the chip. The apparatus includes a chamber for accommodating the board; an electrode mounted to the chamber for generating plasma in the chamber with a voltage applied thereto, a table for supporting the board in the chamber, and a masking member which is provided above the board. The masking member has an opening for exposing the chip and the disposing area to the plasma.

Abstract: A plasma processing apparatus and a method of plasma processing using the same obviate a problem in which an excessive amount of processing gas is supplied momentarily during an initial stage of the gas supply. In the process of supplying gas, a main controller outputs to a mass flow controller a flow-rate setting command signal preset for “zero flow” prior to opening a gas shut-off valve, which opens/closes a gas supply passage, and another flow-rate setting command signal set for “a specific flow rate” only after the gas shut-off valve is opened.

Abstract: A plasma processing apparatus and a method of plasma processing using the same obviate a problem in which an excessive amount of processing gas is supplied momentarily during an initial stage of the gas supply. In the process of supplying gas, a main controller outputs to a mass flow controller a flow-rate setting command signal preset for “zero flow” prior to opening a gas shut-off valve, which opens/closes a gas supply passage, and another flow-rate setting command signal set for “a specific flow rate” only after the gas shut-off valve is opened.