Abstract: A vehicle includes a fatigue state detector, an information provider, and a processor. The fatigue state detector is configured to detect a fatigue degree of an occupant of the vehicle. The information provider is configured to provide various pieces of information related to traveling of the vehicle to the occupant. The processor is configured to change a frequency of providing the various pieces of the information by the information provider, depending on the fatigue degree of the occupant.

Abstract: A payment terminal includes a magnetic card reader slot having a magnetic head, an IC card reader slot configured to be front of a user, and a first board with a touch area for a contactless payment arranged diagonally upward toward the user. The magnetic card reader slot is arranged toward the user obliquely upward with respect to a direction parallel to the plane. The magnetic card reader slot and the IC card reader slot are arranged, so that a swipe direction of the magnetic card into the magnetic card reader slot and an insertion direction of an IC card into the IC card reader slot are substantially perpendicular to each other. The magnetic card reader slot, the IC card reader slot, and the first board are arranged in this order from the plane in a height direction.

Abstract: A substrate transport method is employed in a substrate processing system including a plurality of processing chambers, a load lock chamber, a vacuum transport device provided in a vacuum transport chamber connecting the load lock chamber and the plurality of processing chambers and configured to simultaneously transport a plurality of substrates, and an atmospheric transport device provided in an atmospheric transport chamber and configured to transport a substrate from a carrier to the load lock chamber. The substrate transport method includes acquiring in advance a relative positional error for a case where the plurality of substrates are transported from the load lock chamber to the plurality of processing chambers and placed on a stage in the plurality of processing chambers, and placing the plurality of substrates on a stage in the load lock chamber, based on a transport path of the plurality of substrates and the relative positional error.

Abstract: A substrate processing system comprising: a first chamber comprising loading tables, on which a plurality of substrates are to be loaded; a second chamber comprising loading tables, on which a plurality of substrates are to be loaded; a first transfer device comprising a plurality of blades configured to hold a plurality of substrates in a lengthwise direction thereof, and configured to transfer a plurality of substrates loaded on the loading tables of the first chamber to the loading tables of the second chamber with the substrates held at the same height; a substrate sensor provided on paths, along which the blades enter the second chamber, and configured to detect a substrate held by the blades; and a controller configured to control the first transfer device.

Abstract: A substrate processing system comprising: a first chamber comprising loading tables, on which a plurality of substrates are to be loaded; a second chamber comprising loading tables, on which a plurality of substrates are to be loaded; a first transfer device comprising a plurality of blades configured to hold a plurality of substrates in a lengthwise direction thereof, and configured to transfer a plurality of substrates loaded on the loading tables of the first chamber to the loading tables of the second chamber with the substrates held at the same height; a substrate sensor provided on paths, along which the blades enter the second chamber, and configured to detect a substrate held by the blades; and a controller configured to control the first transfer device.

Abstract: A method of cleaning a thin film forming apparatus wherein a process for supplying a film forming gas into a reaction tube of the thin film forming apparatus to form a thin film on an object to be processed is repeated more than one time and then a cleaning gas is supplied into the reaction tube to remove extraneous particles attached to an interior of the apparatus, the method comprising: a first cleaning process including supplying a first cleaning gas into the reaction tube to remove the extraneous particles attached to the interior of the apparatus when a first cleaning start conditions is satisfied; and a second cleaning process including performing a cleaning process that is different from the first cleaning process when a second cleaning start condition that is different from the first cleaning start condition is satisfied.

Abstract: A method of cleaning a thin film forming apparatus wherein a process for supplying a film forming gas into a reaction tube of the thin film forming apparatus to form a thin film on an object to be processed is repeated more than one time and then a cleaning gas is supplied into the reaction tube to remove extraneous particles attached to an interior of the apparatus, the method comprising: a first cleaning process including supplying a first cleaning gas into the reaction tube to remove the extraneous particles attached to the interior of the apparatus when a first cleaning start conditions is satisfied; and a second cleaning process including performing a cleaning process that is different from the first cleaning process when a second cleaning start condition that is different from the first cleaning start condition is satisfied.