Abstract: A liquid ejecting head comprising: a head body that ejects liquid droplets from a liquid ejecting surface; a wiring substrate electrically connected to the head body; a holder member to which the head bodies are fixed, and that includes a flow channel to the head bodies, and a wiring through hole through which the wiring substrate passes; a circuit substrate that includes a connection portion electrically connected to the wiring substrate, and a substrate that arranges the connection portion on both surfaces thereof and stands in a direction intersecting the liquid ejecting surface; a set of a first correction plate facing each other with respect to each of both surfaces of the substrate of the circuit substrate for correcting the holder member; and a cover member that accommodates the circuit substrate fixed to the holder member and the first correction plate.

Abstract: A flow path structure which forms a flow path of liquid, includes: a light absorbing member (first substrate) having absorbing properties with respect to laser light; a light transmitting member (second substrate) which is joined to the light absorbing member and has transmitting properties with respect to the laser light; a first flow path (flow path) which is surrounded by a welding interface between the light absorbing member and the light transmitting member; and a second flow path which is formed in a flow path pipe (flow path pipe) which protrudes from a front surface opposite of the welding interface in the light transmitting member, and communicates with the first flow path, in which the flow path pipe is included in a region of the first flow path in a plan view from a direction orthogonal to the welding interface.

Abstract: A wall-shaped enclosure that forms a space which can accommodate a head chip is formed in a projecting manner at a lower end of a lower case member. Since a cylindrical thick part is formed at the lower end of the lower case member, the lower case member is unlikely to be bent, particularly around the wall-shaped enclosure and a part where the wall-shaped enclosure is disposed. The head chip that is disposed in the space of the lower case member which is unlikely to be bent is unlikely to be subjected to an external force, and the cover member absorbs torsion generated between the head chip and the lower case member so that the head chip is even more unlikely to be subjected to the external force.

Abstract: A valve includes a seat having a through hole through which ink flows and a valve body that is configured to be in contact with the seat to close the through hole such that the valve is in a closed state and to be separate from the seat to open the through hole such that the valve is in an open state. At least one of the seat and the valve body is configured to move relative to the other of the seat and the valve body while the valve is in the closed state.

Abstract: A wall-shaped enclosure that forms a space which can accommodate a head chip is formed in a projecting manner at a lower end of a lower case member. Since a cylindrical thick part is formed at the lower end of the lower case member, the lower case member is unlikely to be bent, particularly around the wall-shaped enclosure and a part where the wall-shaped enclosure is disposed. The head chip that is disposed in the space of the lower case member which is unlikely to be bent is unlikely to be subjected to an external force, and the cover member absorbs torsion generated between the head chip and the lower case member so that the head chip is even more unlikely to be subjected to the external force.

Abstract: A flexible cable includes a portion that is covered by a solder resist and an exposed portion that is not covered by the solder resist, in which the exposed portion contains a wiring terminal and at least continues to a position closer to an outside than an opening of a wiring member insertion side of a wiring vacant portion in a state in which the wiring terminal portion is connected to an element terminal of a piezoelectric element side and in which the wiring vacant portion is filled with an electrically insulating filling material in a state of covering a joining portion between the element terminal and the wiring terminal within the wiring vacant portion, and in a state in which a protective substrate, which forms the wiring vacant portion by partitioning, and the exposed portion of the flexible cable are not in contact with one another.

Abstract: A valve includes a seat having a through hole through which ink flows and a valve body that is configured to be in contact with the seat to close the through hole such that the valve is in a closed state and to be separate from the seat to open the through hole such that the valve is in an open state. At least one of the seat and the valve body is configured to move relative to the other of the seat and the valve body while the valve is in the closed state.

Abstract: A flow channel structure includes a first flow channel chamber to which an ink is supplied, a first sealing body that configures a wall face of the first flow channel chamber, a valve body that controls flow and blocking of the ink in accordance with deformation of the first sealing body, a second flow channel chamber that communicates with the first flow channel chamber, and a second sealing body that configures a wall face of the second flow channel chamber, in which the rigidity of the second sealing body is greater than the rigidity of the first sealing body.

Abstract: A common liquid chamber that communicates with a plurality of pressure chambers includes at least one inflow port into which a liquid flows, a plurality of supply openings, arranged in a row, for supplying the liquid to each of the pressure chambers, and a slanted surface that, when viewed from a second direction that is orthogonal to an arrangement direction in which the supply openings are arranged and that follows a substrate in which the common liquid chamber is formed, is slanted so that the slanted surface overlaps with the arrangement of some of the supply openings including supply openings located at ends of the arrangement direction and approaches the arrangement of the supply openings at the end areas of the arrangement direction. At least part of the inflow port is located within the range of the arrangement of the stated some of the supply openings when viewed from the second direction.

Abstract: A cover member is fixed to a head chip in an area in the vicinity of a nozzle plate but does not constitute a communication path, and thus causes no liquid leakage. The head chip discharges droplets of a discharge liquid that is supplied via the communication path which is formed from nozzles thereof without depending on the cover member. A surface of the nozzle plate is positioned on a side further apart from a printing medium than from a surface of the cover member and is surrounded. As a result, abutting of the printing medium against a side surface of the nozzle plate is avoided.

Abstract: A liquid ejecting head comprising: a head body that ejects liquid droplets from a liquid ejecting surface; a wiring substrate electrically connected to the head body; a holder member to which the head bodies are fixed, and that includes a flow channel to the head bodies, and a wiring through hole through which the wiring substrate passes; a circuit substrate that includes a connection portion electrically connected to the wiring substrate, and a substrate that arranges the connection portion on both surfaces thereof and stands in a direction intersecting the liquid ejecting surface; a set of a first correction plate facing each other with respect to each of both surfaces of the substrate of the circuit substrate for correcting the holder member; and a cover member that accommodates the circuit substrate fixed to the holder member and the first correction plate.

Abstract: A liquid ejecting head may include a first flow path, a linking flow path that is provided on a downstream side of the first flow path and is connected to the first flow path, and a second flow path that is connected to the linking flow path. The first flow path, the linking flow path, and the second flow path are provided in a portion between a liquid receiving portion and a filter. The second flow path includes wall portions that partition a central flow path and external flow paths which are provided on both external sides of the central flow path. The linking flow path includes an inclined portion which is formed in a width direction and extends in a portion between the first flow path and the second flow path.

Abstract: A liquid ejecting head includes a flow path portion that has a first communication path, a case member that has a second communication path, a seal member that is pinched between the case member and the flow path portion, and a cover member to which a head chip that discharges the liquid from a nozzle communicating with the second communication path is set. An opening that has a predetermined space formed inside is formed on a recording medium side of the case member. The cover member covers the opening in a state where the head chip is arranged in the predetermined space and the nozzle is exposed to an outside. The seal member allows the first communication path and the second communication path to be connected in a liquid-tight manner and seals the predetermined space on a case member side.

Abstract: A liquid ejecting head includes a head chip that ejects ink from a liquid ejecting surface. An inlet is disposed on the side opposite to the liquid ejecting surface. The liquid ejecting head includes an upstream flow path member, a downstream flow path member with an accommodating space that accommodates the head chip, a wiring member that is connected to a piezoelectric actuator in the head chip, and a wiring substrate. A first insertion hole, into which the wiring member is inserted, is disposed in the wiring substrate, a second insertion hole that is open to the accommodating space and the wiring substrate side for the wiring member to be inserted is formed in the downstream flow path member, and the wiring member is inserted into the first insertion hole and the second insertion hole to be bonded to the upstream flow path member side of the wiring substrate.

Abstract: A liquid ejecting head includes a head chip that ejects ink from a liquid ejecting surface. An inlet is disposed on the side opposite to the liquid ejecting surface. The liquid ejecting head includes an upstream flow path member, a downstream flow path member with an accommodating space that accommodates the head chip, a wiring member that is connected to a piezoelectric actuator in the head chip, and a wiring substrate. A first insertion hole, into which the wiring member is inserted, is disposed in the wiring substrate, a second insertion hole that is open to the accommodating space and the wiring substrate side for the wiring member to be inserted is formed in the downstream flow path member, and the wiring member is inserted into the first insertion hole and the second insertion hole to be bonded to the upstream flow path member side of the wiring substrate.

Abstract: A liquid ejecting head may include a first flow path, a linking flow path that is provided on a downstream side of the first flow path and is connected to the first flow path, and a second flow path that is connected to the linking flow path. The first flow path, the linking flow path, and the second flow path are provided in a portion between a liquid receiving portion and a filter. The second flow path includes wall portions that partition a central flow path and external flow paths which are provided on both external sides of the central flow path. The linking flow path includes an inclined portion which is formed in a width direction and extends in a portion between the first flow path and the second flow path.

Abstract: A common liquid chamber that communicates with a plurality of pressure chambers includes at least one inflow port into which a liquid flows, a plurality of supply openings, arranged in a row, for supplying the liquid to each of the pressure chambers, and a slanted surface that, when viewed from a second direction that is orthogonal to an arrangement direction in which the supply openings are arranged and that follows a substrate in which the common liquid chamber is formed, is slanted so that the slanted surface overlaps with the arrangement of some of the supply openings including supply openings located at ends of the arrangement direction and approaches the arrangement of the supply openings at the end areas of the arrangement direction. At least part of the inflow port is located within the range of the arrangement of the stated some of the supply openings when viewed from the second direction.

Abstract: A flexible cable includes a portion that is covered by a solder resist and an exposed portion that is not covered by the solder resist, in which the exposed portion contains a wiring terminal and at least continues to a position closer to an outside than an opening of a wiring member insertion side of a wiring vacant portion in a state in which the wiring terminal portion is connected to an element terminal of a piezoelectric element side and in which the wiring vacant portion is filled with an electrically insulating filling material in a state of covering a joining portion between the element terminal and the wiring terminal within the wiring vacant portion, and in a state in which a protective substrate, which forms the wiring vacant portion by partitioning, and the exposed portion of the flexible cable are not in contact with one another.

Abstract: A wall-shaped enclosure that forms a space which can accommodate a head chip is formed in a projecting manner at a lower end of a lower case member. Since a cylindrical thick part is formed at the lower end of the lower case member, the lower case member is unlikely to be bent, particularly around the wall-shaped enclosure and a part where the wall-shaped enclosure is disposed. The head chip that is disposed in the space of the lower case member which is unlikely to be bent is unlikely to be subjected to an external force, and the cover member absorbs torsion generated between the head chip and the lower case member so that the head chip is even more unlikely to be subjected to the external force.

Abstract: A cover member is fixed to a head chip in an area in the vicinity of a nozzle plate but does not constitute a communication path, and thus causes no liquid leakage. The head chip discharges droplets of a discharge liquid that is supplied via the communication path which is formed from nozzles thereof without depending on the cover member. A surface of the nozzle plate is positioned on a side further apart from a printing medium than from a surface of the cover member and is surrounded. As a result, abutting of the printing medium against a side surface of the nozzle plate is avoided.