Abstract: A vehicle control device mounted on a vehicle includes one or more processors to detect an object around the vehicle based on external environment information and generate three-dimensional object information and information on a plurality of split regions, and set a damage degree to each of the plurality of split regions depending on an estimated magnitude of damage at an estimated time of collision of the vehicle. The one or more processors record information on a plurality of host vehicle split regions, and a host vehicle damage degree set to each of the plurality of host vehicle split regions depending on an estimated magnitude of damage at an estimated time of collision of the object and control travel of the vehicle to minimize a collision damage degree corresponding to the damage degree and a product of the damage degree and the host vehicle damage degree.

Abstract: Provided is a thermal bonding sheet including: a sinter precursor layer including sinterable particles; and a close adhesion layer superposed on one surface of the sinter precursor layer. The close adhesion layer includes an organic binder and the sinterable particles, a content percentage of the sinterable particles in the close adhesion layer is 5 volume % or more and 40 volume % or less, and a particle size distribution measured for the sinterable particles included in the close adhesion layer has at least two peaks.

Abstract: Provided is a signal processing device capable of more surely keeping a vehicle-to-vehicle distance between a leading vehicle and a host vehicle in traveling by following, by more accurately determining a cause for losing track of the leading vehicle by an external environment sensor as compared to conventional signal processing devices. The integration unit 12 performs integration processing of the external environment information acquired by the external environment sensor 1 mounted on the host vehicle V and the host vehicle travel information acquired by the vehicle sensor 6. The behavior prediction unit 9 predicts the behavior at a future time of the host vehicle V and another vehicle detected by the external environment sensor 1, based on the integration result from the integration unit 12. The road shape acquisition unit 10 obtains the road shape information (gradient information) on the traveling road surface of the host vehicle V and the other vehicle at the future time.

Abstract: A sinter bonding sheet roll according to the present invention includes a first substrate and a sinter bonding layer laminated on the first substrate, and is formed by winding, in a length direction, a sinter bonding sheet that is formed into a band shape, in which the sinter bonding layer includes sinterable particles containing a conductive metal, and an organic binder, and is directly laminated on the first substrate or is indirectly laminated on the first substrate via a second substrate interposed therebetween, and a longitudinal dimension L1 of the first substrate is larger than any of a longitudinal dimension LS of the sinter bonding layer and a longitudinal dimension L2 of the second substrate.

Abstract: Provided is a sinter bonding sheet including a sinter bonding layer that includes: sinterable particles containing a conductive metal; and an organic binder, in which a maximum size among sizes of cavities observed in an observation image of a surface of the sinter bonding layer at a magnification of 100 times is 100 ?m or less.

Abstract: A sinter bonding sheet includes a sinter bonding layer that includes sinterable particles containing a conductive metal, and an organic binder, in which the sinter bonding layer has a first adhesive surface for being adhered to an adherend and a second adhesive surface for being adhered to another adherend, and when the value of the minimum load reached during an unloading step in a load-displacement measurement according to the nanoindentation method to the first adhesive surface is b1, and the value of the minimum load reached during the unloading step in the load-displacement measurement according to the nanoindentation method to the second adhesive surface is b2, b1 satisfies ?100 ?N?b1??35 ?N and b2 satisfies ?100 ?N?b2??35 ?N.

Abstract: The present invention is a laminate including a base sheet and a metal particle-containing layer laminated on the base sheet, and including metal particles. The base sheet has a contact surface in contact with the metal particle-containing layer, and a Young's modulus of the base sheet at 23° C., which is obtained by measuring the contact surface using a nano-indentation method, is 0.01 to 10 GPa.

Abstract: It is possible to reduce inadvertent vehicle behavior during autonomous driving.

Abstract: To provide a sheet for sintering bonding and the same with a base material suited for lamination and integration and also suited for realizing satisfactory operational efficiency in a sintering process in a process of producing semiconductor devices that go through sintering bonding of semiconductor chips. A sheet for sintering bonding 10 of the present invention comprises an electrically conductive metal containing sinterable particle and a binder component. In this sheet, the minimum load, reached during an unloading process in load-displacement measurement according to a nanoindentation method, is ?100 to ?30 ?N. Alternatively, the ratio of the minimum load to a maximum load, reached during a load applying process in the above measurement, is ?0.2 to ?0.06. A sheet body X, a sheet for sintering bonding with a base material of the present invention, has a laminated structure comprising a base material B and the sheet 10.

Abstract: Provided is a vehicle control device capable of more reliably avoiding a collision between an obstacle and a vehicle or reducing a collision damage by more accurately estimating a type and a risk of the obstacle than a conventional vehicle control device. A vehicle control device 100 is a control device mounted on a vehicle V, and includes a three-dimensional object information generation unit 121, a damage degree map generation unit 122, and a travel control unit 123. The three-dimensional object information generation unit 121 detects an object around the vehicle V and generates three-dimensional object information based on external environment information output from the external sensor V1 mounted on the vehicle V.

Abstract: To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound body 1 according to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding core 2 into a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material 11; and a sheet for sintering bonding 10, comprising an electrically conductive metal containing sinterable particle and a binder component.

Abstract: A manufacturing method includes the step of forming a diced semiconductor wafer (10) including semiconductor chips (11) from a semiconductor wafer (W) typically on a dicing tape (T1). The diced semiconductor wafer (10) on the dicing tape (T1) is laminated with a sinter-bonding sheet (20). The semiconductor chips (11) each with a sinter-bonding material layer (21) derived from the sinter-bonding sheet (20) are picked up typically from the dicing tape (T1). The semiconductor chips (11) each with the sinter-bonding material layer are temporarily secured through the sinter-bonding material layer (21) to a substrate. Through a heating process, sintered layers are formed from the sinter-bonding material layers (21) lying between the temporarily secured semiconductor chips (11) and the substrate, to bond the semiconductor chips (11) to the substrate.

Abstract: A semiconductor device manufacturing method includes a preparation step and a sinter bonding step. In the preparation step, a sinter-bonding work having a multilayer structure including a substrate, semiconductor chips, and sinter-bonding material layers is prepared. The semiconductor chips are disposed on, and will bond to, one side of the substrate. Each sinter-bonding material layer contains sinterable particles and is disposed between each semiconductor chip and the substrate. In the sinter bonding step, a cushioning sheet having a thickness of 5 to 5000 ?m and a tensile elastic modulus of 2 to 150 MPa is placed on the sinter-bonding work, the resulting stack is held between a pair of pressing faces, and, in this state, the sinter-bonding work between the pressing faces undergoes a heating process while being pressurized in its lamination direction, to form a sintered layer from each sinter-bonding material layer.

Abstract: A manufacturing method includes the step of laminating a sheet assembly onto chips arranged on a processing tape, where the sheet assembly has a multilayer structure including a base and a sinter-bonding sheet and is laminated so that the sinter-bonding sheet faces the chips, and subsequently removing the base B from the sinter-bonding sheet. The chips on the processing tape are picked up each with a portion of the sinter-bonding sheet adhering to the chip, to give sinter-bonding material layer-associated chips. The sinter-bonding material layer-associated chips are temporarily secured through the sinter-bonding material layer to a substrate. The sinter-bonding material layers lying between the temporarily secured chips and the substrate are converted through a heating process into sintered layers, to bond the chips to the substrate.

Abstract: It is possible to reduce inadvertent vehicle behavior during autonomous driving.

Abstract: The present invention provides a method for producing a semiconductor device, including: a semiconductor chip-mounting step of subsequently pressing a plurality of semiconductor chips by a first pressing member to respectively bond the plurality of semiconductor chips to a plurality of mounting areas provided on a substrate, wherein the bonding is performed in a state where adhesive sheets are respectively interposed between the plurality of semiconductor chips and the plurality of mounting areas, each of the adhesive sheets includes sinterable metal particles that can be sintered by heating at a temperature of 400° C. or less, and the first pressing member is heated to a temperature, at which the sinterable metal particles can be sintered.

Abstract: The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 ?m or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).

Abstract: The present invention is a laminate including a base sheet and a metal particle-containing layer laminated on the base sheet, and including metal particles. The base sheet has a contact surface in contact with the metal particle-containing layer, and a Young's modulus of the base sheet at 23° C., which is obtained by measuring the contact surface using a nano-indentation method, is 0.01 to 10 GPa.

Abstract: A semiconductor device manufacturing method includes a preparation step and a sinter bonding step. In the preparation step, a sinter-bonding work having a multilayer structure including a substrate, semiconductor chips, and sinter-bonding material layers is prepared. The semiconductor chips are disposed on, and will bond to, one side of the substrate. Each sinter-bonding material layer contains sinterable particles and is disposed between each semiconductor chip and the substrate. In the sinter bonding step, a cushioning sheet having a thickness of 5 to 5000 ?m and a tensile elastic modulus of 2 to 150 MPa is placed on the sinter-bonding work, the resulting stack is held between a pair of pressing faces, and, in this state, the sinter-bonding work between the pressing faces undergoes a heating process while being pressurized in its lamination direction, to form a sintered layer from each sinter-bonding material layer.

Abstract: A manufacturing method includes the step of laminating a sheet assembly onto chips arranged on a processing tape, where the sheet assembly has a multilayer structure including a base and a sinter-bonding sheet and is laminated so that the sinter-bonding sheet faces the chips, and subsequently removing the base B from the sinter-bonding sheet. The chips on the processing tape are picked up each with a portion of the sinter-bonding sheet adhering to the chip, to give sinter-bonding material layer-associated chips. The sinter-bonding material layer-associated chips are temporarily secured through the sinter-bonding material layer to a substrate. The sinter-bonding material layers lying between the temporarily secured chips and the substrate are converted through a heating process into sintered layers, to bond the chips to the substrate.