Abstract: The present invention provides a resin molded product production method that can reduce the molding defects even when resin-molding is performed in a state where a chip is temporarily bonded to a carrier via a temporary bonding sheet. The method for producing a resin molded product obtained by subjecting an object to be molded being a chip 21 temporarily bonded to a carrier 11 via a temporary bonding sheet 12 to transfer molding, including the step of: resin-molding the object to be molded by transfer molding using a molding die 1000, wherein the resin-molding is performed in a state where a gap G is formed so that the temporary bonding sheet 12 disposed in the molding die 1000 and a surface facing the temporary bonding sheet 12 on a side where the chip 21 is temporarily bonded do not come into contact with each other.