Abstract: A semiconductor device configures one arm of an upper-lower arm circuit, and includes: a semiconductor element that includes a first main electrode and a second main electrode, wherein a main current between the first main electrode and the second main electrode; and multiple main terminals that include a first main terminal connected to the first main electrode and a second main terminal connected to the second main electrode. The first main terminal and the second main terminal are placed adjacent to each other; A lateral surface of the first main terminal and a lateral surface of the second main terminal face each other in one direction orthogonal to a thickness direction of the semiconductor element.

Abstract: An electric power conversion device includes: a cooler that includes a flow path through which a refrigerant flows, a first surface, and a second surface opposite to the first surface in a thickness direction; and multiple power modules that include a semiconductor device configuring an upper-lower arm circuit, and a capacitor connected to the upper-lower arm circuit in parallel. The capacitor and the semiconductor device are arranged in the thickness direction. The multiple power modules are placed on both of the first surface and the second surface of the cooler.

Abstract: A power module is applied to an electric power conversion device in which multiple upper-lower arm circuits are connected to an electric power line in parallel. The power module includes the multiple upper-lower arm circuits; a capacitor connected to each of the multiple upper-lower arm circuits in parallel; an upper wiring that connects an upper arm and a positive electrode terminal of the capacitor; a lower wiring that connects a lower arm and a negative electrode of the capacitor; an upper electric power wiring that is an electric power wiring connected to the electric power line and connects a high potential line of the electric power line and the upper wiring; and a lower electric power wiring that is an electric power wiring connected to the electric power line and connects a lower potential line of the electric power line and the lower wiring.

Abstract: A semiconductor device includes a first semiconductor module and a second semiconductor module. The first semiconductor module configures an upper arm, and includes first semiconductor elements connected in parallel to each other, a sealing resin body, and a positive electrode terminal. The second semiconductor module configures a lower arm, and includes second semiconductor elements connected in parallel to each other, a sealing resin body, and a negative electrode terminal. The first and second semiconductor modules are aligned in an alignment direction. At least one of the first and second semiconductor modules has a relay terminal for electrically relaying electrodes on a low potential side of the first semiconductor elements and electrodes on a high potential side of the second semiconductor elements.

Abstract: A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the accommodation step, the two individual conductive members are sandwiched in the facing orientation thereof by outer support members abutting outer surfaces of the conductive members, and inner support members abutting inner surfaces of the conductive members. Outer recesses are formed in the outer surfaces by the outer support members, and inner recesses are formed in the inner surfaces by the inner support members. The outer recesses are deeper in the Z direction than the inner recesses.

Abstract: A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part for sealing the pair of conductive members. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the sealing step, the conductive members are sealed with a resin injected into a die while a force is applied by the resin to the individual conductive members in directions to approach each other in a facing orientation of the pair of conductive members.

Abstract: Performed are an accommodation step of accommodating a pair of conductive members in a die, a sealing step of injecting a resin to seal the conductive members, and an extraction step of extracting a conductive member module. In the sealing step, the conductive members are sealed while a force is applied by the resin injected into the die to the individual conductive members in directions away from each other, and the individual conductive members are supported by support members disposed outside.

Abstract: An electric power conversion apparatus includes at least one semiconductor module, a capacitor, a pair of positive and negative busbars and an insulator. The positive busbar includes a positive busbar base protruding from the capacitor in a Y direction and at least one positive busbar terminal extending perpendicular to an X direction. The negative busbar includes a negative busbar base protruding from the capacitor in the Y direction and at least one negative busbar terminal extending perpendicular to the X direction. The positive and negative busbar bases are arranged to have their major surfaces facing each other in a Z direction. The positive and negative busbar terminals at least partially overlap each other in the X direction with the insulator interposed therebetween. The at least one semiconductor module has a pair of positive and negative power terminals connected respectively to the positive and negative busbar terminals.

Abstract: A rotating electric machine includes a field that includes a magnet unit having a plurality of magnetic poles, an armature including a multi-phase armature coil, and an electric power conversion device that is configured to perform electric power conversion and supply electric power resulting from the electric power conversion to the armature. Moreover, one of the field and the armature is configured as a rotor while the other is configured as a stator. The electric power conversion device includes at least one band-shaped busbar through which electric current flows during the electric power conversion. The at least one busbar has a cross section where a thickness in a lateral direction of the cross section at one end of the cross section in a longitudinal direction of the cross section is smaller than a thickness in the lateral direction at the other end of the cross section in the longitudinal direction.

Abstract: A reactor cooling structure includes: a plurality of reactors that are stacked on one another, each reactor including a coil configured to produce magnetic flux when energized; and a cooling mechanism that cools the plurality of reactors, wherein each of the reactors has an exterior member that has: heat radiation surfaces respectively on both sides of the corresponding one of the reactors in a stacking direction of the stacked reactors i.e. a first direction, the heat radiation surfaces of the exterior member of each of the reactors being arranged to cool the coil of the corresponding one of the reactors; the cooling mechanism includes a cooling flow path for directly cooling the first and second heat radiation surfaces of the exterior member of each of the reactors by a refrigerant.

Abstract: A power conversion device provided with a switching circuit unit including a plurality of upper-arm switching elements connected to positive electrode wiring and a plurality of lower-arm switching elements connected to negative electrode wiring. The power conversion device includes a first semiconductor module incorporating a plurality of the upper-arm switching elements connected together in parallel, a second semiconductor module incorporating a plurality of the lower-arm switching elements connected together in parallel, and a third semiconductor module incorporating the upper-arm switching elements connected together in series and the lower-arm switching elements connected together in series.

Abstract: A power conversion apparatus has a positive electrode bus bar and a negative electrode bus bar. The power conversion apparatus has a first semiconductor module incorporating an upper-arm switching element and including a positive electrode terminal and a second semiconductor module incorporating a lower-arm switching element and including a negative electrode terminal. The first semiconductor module and the second semiconductor module are placed such that the positive electrode terminal and the negative electrode terminal face each other in a direction orthogonal to a protruding direction. The positive electrode bus bar and the negative electrode bus bar respectively have coexisting parts placed together between the positive electrode terminal and the negative electrode terminal as seen in the protruding direction of power terminals. The coexisting parts are at least partially placed in a space between the positive electrode terminal and the negative electrode terminal.

Abstract: An electrical power conversion apparatus includes a high-voltage bus bar, a low-voltage bus bar, and a relay bus bar which are integrated together in the form of a bus bar assembly. The high-voltage bus bar includes semiconductor-side high-voltage terminals and capacitor-side high-voltage terminals. The low-voltage bus bar includes semiconductor-side low-voltage terminals and capacitor-side low-voltage terminals. The relay bus bar includes a reactor-side relay terminal and a capacitor-side relay terminal 532. The capacitor-side high-voltage terminals, the capacitor-side low-voltage terminals, and the capacitor-side relay terminal are arranged in the form of a terminal array. The capacitor-side high-voltage terminals and the capacitor-side low-voltage terminals are arranged adjacent each other. The capacitor-side relay terminal is located at an end of an array of the capacitor-side high-voltage terminals and the capacitor-side low-voltage terminals.

Abstract: In a power converter, a semiconductor module incorporates therein a semiconductor element that constitutes a power converter circuit. The semiconductor module has a power terminal extending therefrom, and the power terminal has opposing first and second terminal surfaces. The power converter includes a capacitor electrically connected to the semiconductor module. The power converter includes a busbar. The busbar includes a capacitor-connection terminal connected to the capacitor, and at least first and second semiconductor-connection terminals that are at least partly joined to the respective first and second terminal surfaces of the power terminal.

Abstract: A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electronic component comes into contact with the abutting surface. A pressurizing member pressurizes the semiconductor module in a first direction extending from the semiconductor module to the electronic component. The electronic component includes a part body and a wing portion and the wing portion protrudes from the part body at least either one side of both sides thereof with respect to a second direction perpendicular to the first direction, and comes into contact with the abutting surface from a semiconductor module side with respect to the first direction.

Abstract: A semiconductor device includes a first semiconductor module and a second semiconductor module. The first semiconductor module configures an upper arm, and includes first semiconductor elements connected in parallel to each other, a sealing resin body, and a positive electrode terminal. The second semiconductor module configures a lower arm, and includes second semiconductor elements connected in parallel to each other, a sealing resin body, and a negative electrode terminal. The first and second semiconductor modules are aligned in an alignment direction. At least one of the first and second semiconductor modules has a relay terminal for electrically relaying electrodes on a low potential side of the first semiconductor elements and electrodes on a high potential side of the second semiconductor elements.

Abstract: In an electric power conversion apparatus, a semiconductor module-cooler unit includes a semiconductor module and a cooler that has cooling pipes stacked with the semiconductor module in a stacking direction. A flow path forming component includes an electronic component main body and has an in-component flow path formed therein. A case receives both the semiconductor module-cooler unit and the flow path forming component therein. A pressure-applying member is arranged in the case to apply pressure to the semiconductor module-cooler unit from a rear side toward a front side in the stacking direction. Moreover, the flow path forming component is fixed to the case. The pressure-applying member, the semiconductor module-cooler unit and the flow path forming component are arranged in alignment with each other in the stacking direction. An in-cooler flow path formed in the cooler and the in-component flow path are fluidically connected with each other in the stacking direction.

Abstract: A power conversion apparatus includes a semiconductor module, an electronic component, a cooling member, a casing and a pressurizing member. The electronic component includes a load application part that receives a load caused by pressurizing force on a surface in a pressurizing member side with respect to the lamination direction; a load supporting part that comes into contact with a contact part of the casing on a surface opposite to the pressurizing member side with respect to the lamination direction; and a fastening part fastened to a casing fastening part. The load supporting part is disposed between the load application part and the fastening part; moment of force around the load supporting part is produced in the electronic component by the load applied to the load application part; and the moment causes the electronic component to be pressed towards a pressed part of the casing.

Abstract: In a power converter, a semiconductor module incorporates therein a semiconductor element that constitutes a power converter circuit. The semiconductor module has a power terminal extending therefrom, and the power terminal has opposing first and second terminal surfaces. The power converter includes a capacitor electrically connected to the semiconductor module. The power converter includes a busbar. The busbar includes a capacitor-connection terminal connected to the capacitor, and at least first and second semiconductor-connection terminals that are at least partly joined to the respective first and second terminal surfaces of the power terminal.

Abstract: An electrical power conversion apparatus includes a high-voltage bus bar, a low-voltage bus bar, and a relay bus bar which are integrated together in the form of a bus bar assembly. The high-voltage bus bar includes semiconductor-side high-voltage terminals and capacitor-side high-voltage terminals. The low-voltage bus bar includes semiconductor-side low-voltage terminals and capacitor-side low-voltage terminals. The relay bus bar includes a reactor-side relay terminal and a capacitor-side relay terminal 532. The capacitor-side high-voltage terminals, the capacitor-side low-voltage terminals, and the capacitor-side relay terminal are arranged in the form of a terminal array. The capacitor-side high-voltage terminals and the capacitor-side low-voltage terminals are arranged adjacent each other. The capacitor-side relay terminal is located at an end of an array of the capacitor-side high-voltage terminals and the capacitor-side low-voltage terminals.