Patents by Inventor Ryota Toyama

Ryota Toyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230151250
    Abstract: The present invention relates to an adhesive sheet laminate which comprises a substrate layer composed of a thermoplastic resin composition (A) containing a polypropylene-based resin as a main component, an adhesive layer composed of a thermoplastic resin composition (B) containing a specific thermoplastic resin (b) as a main component and having a melt flow rate of 0.1 to 30 g/10 min, and a release layer composed of a thermoplastic resin composition (C) containing a specific thermoplastic resin (c) as a main component and having a melt flow rate of 0.1 to 30 g/10 min, and which has a tensile elastic modulus of 2000 MPa or more.
    Type: Application
    Filed: March 17, 2021
    Publication date: May 18, 2023
    Applicant: YUPO CORPORATION
    Inventors: Ryota TOYAMA, Hiroshi KOIKE
  • Publication number: 20220267564
    Abstract: To suppress a decrease over time in the adhesion of ink to a thermoplastic resin film, provided is a thermoplastic resin film containing an inorganic filler, wherein at least one surface of the thermoplastic resin film satisfies the following formula (1) and formula (2): 0.8?S1/S0?1.0??(1) 3.0?S0??(2) wherein S0 represents an oxygen atom concentration (atm %) before a washing treatment (A) is carried out, S1 represents the oxygen atom concentration (atm %) after the washing treatment (A) is carried out, the oxygen atom concentration is a ratio of the number of oxygen atoms to a sum of the number of oxygen atoms and the number of carbon atoms measured by XPS (X-ray photoelectron spectroscopy) (number of oxygen atoms/(number of oxygen atoms+number of carbon atoms)), and the washing treatment (A) is a washing treatment carried out using distilled water.
    Type: Application
    Filed: July 29, 2020
    Publication date: August 25, 2022
    Applicant: YUPO CORPORATION
    Inventors: Ryota TOYAMA, Hiroshi KOIKE, Yutaro SUGAMATA
  • Publication number: 20220119682
    Abstract: A recording paper includes: a laminated resin film including a substrate composed of a thermoplastic resin film and an underlayer disposed on at least one side of the substrate and composed of a thermoplastic resin composition; and a resin coating disposed facing the underlayer of the laminated resin film, wherein the underlayer has an indentation modulus of 50 to 1200 MPa, the resin coating contains a resin that is a reaction product of a cationic water-soluble polymer and a silane coupling agent, a content of a silane coupling agent component is 15 to 60 parts by mass with respect to 100 parts by mass of the cationic water-soluble polymer component in the resin coating, the resin coating is free from thermoplastic resin particles, and a content of an inorganic filler is 9 parts by mass or less with respect to 100 parts by mass of the cationic water-soluble polymer component in the resin coating.
    Type: Application
    Filed: January 10, 2020
    Publication date: April 21, 2022
    Applicant: YUPO CORPORATION
    Inventors: Yutaro SUGAMATA, Ryota TOYAMA
  • Publication number: 20210075169
    Abstract: An IC socket incudes a socket body having a housing portion for accommodating an IC package; a contact pin electrically connected to a solder ball of the IC package; an operating member provided movably up and down on the socket body; and a pad which is opened and closed by an up and down movement of the operating member and covers an upper side of the IC package in a closed state. The housing portion is provided with an annular portion surrounding a side periphery of an accommodating area of the IC package, an accommodating space for the electric component is formed when the pad is closed and abuts the annular portion, and the pad is configured to be spaced upwardly from an upper surface of the IC package which is accommodated in the accommodating space when the pad is closed and abuts the annular portion.
    Type: Application
    Filed: December 13, 2018
    Publication date: March 11, 2021
    Applicant: ENPLAS CORPORATION
    Inventors: Ryota Toyama, Katsuya Tsuneoka