Patents by Inventor Ryotaro MIYAGAWA

Ryotaro MIYAGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240090806
    Abstract: A wearable computing device includes a housing having a wrist-side face configured to sit against a wrist of a user of the wearable computing device when being worn by the user, an electronic display arranged within the housing, a plurality of biometric sensor electrodes positioned on the wrist-side face so as to maintain skin contact with the user when being worn on the wrist by the user, and at least one driver communicatively coupled to the plurality of biometric sensor electrodes. Each of the plurality of biometric sensor electrodes continuously measures, at least, one or more parameters indicative of electrical impedance of the user at a location of the skin contact.
    Type: Application
    Filed: August 23, 2021
    Publication date: March 21, 2024
    Inventors: Lindsey Sunden, Daniel Steven Howe, Conrad Guanchung Wang, Ryotaro Miyagawa, Seamus David Thomson, David Duncanson Gutschick
  • Patent number: 10070553
    Abstract: A connector replacement method in a network element chassis includes obtaining physical access to a backplane in the network element chassis, while the network element chassis is deployed; powering down backplane connectors for replacement while other backplane connectors remained powered; removing the powered down backplane connectors with a connector removal tool; inserting a new set of backplane connectors in place of the removed, powered down backplane connectors with a connector insertion tool; and powering up the new set of backplane connectors.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: September 4, 2018
    Assignee: Ciena Corporation
    Inventors: Cindy Lee, Ryotaro Miyagawa, Trevor Meunier, Michael Reginald Bishop, Peter Saturley
  • Publication number: 20170244211
    Abstract: A connector replacement method in a network element chassis includes obtaining physical access to a backplane in the network element chassis, while the network element chassis is deployed; powering down backplane connectors for replacement while other backplane connectors remained powered; removing the powered down backplane connectors with a connector removal tool; inserting a new set of backplane connectors in place of the removed, powered down backplane connectors with a connector insertion tool; and powering up the new set of backplane connectors.
    Type: Application
    Filed: February 24, 2016
    Publication date: August 24, 2017
    Inventors: Cindy LEE, Ryotaro MIYAGAWA, Trevor MEUNIER, Michael Reginald BISHOP, Peter SATURLEY
  • Patent number: 9077074
    Abstract: An antenna includes a first portion and a second portion soldered together. The first portion includes conductive traces applied to a first device part. The conductive traces may wrap from one side of the first device part to another side. A second device part is attached to the first device part to enclose a speaker. The second portion of the antenna comprises FPC attached to the second device part. A section of the FPC portion of the antenna extends beyond an edge of the second part and folds over onto solder applied to a section of first portion of the antenna on the first device part. The solder may be melted to attach the first portion of the antenna on the first device part to the second portion of the antenna on the second device part.
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: July 7, 2015
    Assignee: BlackBerry Limited
    Inventors: Ryotaro Miyagawa, Kevin Edward Booth
  • Publication number: 20140104113
    Abstract: An antenna includes a first portion and a second portion soldered together. The first portion includes conductive traces applied to a first device part. The conductive traces may wrap from one side of the first device part to another side. A second device part is attached to the first device part to enclose a speaker. The second portion of the antenna comprises FPC attached to the second device part. A section of the FPC portion of the antenna extends beyond an edge of the second part and folds over onto solder applied to a section of first portion of the antenna on the first device part. The solder may be melted to attach the first portion of the antenna on the first device part to the second portion of the antenna on the second device part.
    Type: Application
    Filed: October 11, 2012
    Publication date: April 17, 2014
    Applicant: Research in Motion Limited
    Inventors: Ryotaro MIYAGAWA, Kevin Edward Booth