Patents by Inventor Ryoto KAWAMURA

Ryoto KAWAMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240018312
    Abstract: The invention provides a method for enhancing adhesion strength to an adhesive without any loss of mechanical strength of a resin molded article. In particular, the invention provides a method for enhancing adhesion strength of a resin molded article made of a resin composition including a liquid crystal polymer resin and an inorganic filling agent, to an adhesive, in which an amorphous resin is further compounded into the resin composition, and an amount of compounding of the liquid crystal polymer resin, an amount of compounding of the amorphous resin, and an amount of compounding of the inorganic filling agent are respectively regulated to 50-99 parts by mass, 1-50 parts by mass, and 0.1-120 parts by mass, based on 100 parts by mass in total of the liquid crystal polymer resin and the amorphous resin.
    Type: Application
    Filed: October 27, 2021
    Publication date: January 18, 2024
    Applicant: ENEOS Corporation
    Inventors: Ryoto KAWAMURA, Ayaka SEICHI