Patents by Inventor Ryou Kouno

Ryou Kouno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Etchant composition and method for etching
    Patent number: 11512397
    Abstract: An etchant composition that is capable of batch etching treatment of a tungsten film and a titanium nitride film and a method for etching using said etchant composition are provided. The etching composition of the present invention is an etchant composition comprising nitric acid and water for batch etching treatment of a tungsten film and a titanium nitride film.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: November 29, 2022
    Assignee: KANTO KAGAKU KABUSHIKI KAISHA
    Inventors: Ryou Kouno, Takuo Ohwada
  • ETCHANT COMPOSITION AND METHOD FOR ETCHING
    Publication number: 20210123142
    Abstract: An etchant composition that is capable of batch etching treatment of a tungsten film and a titanium nitride film and a method for etching using said etchant composition are provided. The etching composition of the present invention is an etchant composition comprising nitric acid and water for batch etching treatment of a tungsten film and a titanium nitride film.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 29, 2021
    Inventors: Ryou KOUNO, Takuo OHWADA
  • ETCHANT COMPOSITIONS AND METHOD FOR ETCHING
    Publication number: 20190301026
    Abstract: An etchant composition that is capable of batch etching treatment of a tungsten film and a titanium nitride film and a method for etching using said etchant composition are provided. The etching composition of the present invention is an etchant composition comprising nitric acid and water for batch etching treatment of a tungsten film and a titanium nitride film.
    Type: Application
    Filed: July 7, 2017
    Publication date: October 3, 2019
    Inventors: Ryou Kouno, Takuo Ohwada
  • Etching solution composition for metal thin film consisting primarily of copper
    Patent number: 8580136
    Abstract: The problem of the present invention is to provide an etching solution composition that can etch with high accuracy a metal-laminated film pattern comprising thin films of copper and a copper alloy, can form an excellent pattern shape, and has practically excellent and stable characteristics with long solution life, and to provide an etching method using such etching solution composition. The present invention relates to an etching method for etching a metal-laminated film having a layer consisting of copper and a layer consisting of a copper alloy containing copper, using an etching solution composition comprising phosphoric acid, nitric acid, acetic acid and water, as well as to said etching solution composition.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: November 12, 2013
    Assignee: Kanto Kagaku Kabushiki Kaisha
    Inventors: Kenji Ohshiro, Ryou Kouno, Hideki Takahashi
  • ETCHING SOLUTION COMPOSITION FOR METAL THIN FILM CONSISTING PRIMARILY OF COPPER
    Publication number: 20120187087
    Abstract: The problem of the present invention is to provide an etching solution composition that can etch with high accuracy a metal-laminated film pattern comprising thin films of copper and a copper alloy, can form an excellent pattern shape, and has practically excellent and stable characteristics with long solution life, and to provide an etching method using such etching solution composition. The present invention relates to an etching method for etching a metal-laminated film having a layer consisting of copper and a layer consisting of a copper alloy containing copper, using an etching solution composition comprising phosphoric acid, nitric acid, acetic acid and water, as well as to said etching solution composition.
    Type: Application
    Filed: January 25, 2012
    Publication date: July 26, 2012
    Applicant: Kanto kagaku Kabushiki Kaisha
    Inventors: Kenji Ohshiro, Ryou Kouno, Hideki Takahashi