Patents by Inventor Ryouichi NAKAI

Ryouichi NAKAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220009134
    Abstract: A method of producing a hard coating layer-laminated mold resin comprising a transfer material preparation step, a resin preparation step, a disposition step, and a transfer step. In the transfer material preparation step, a transfer material including a substrate sheet and a protective layer is prepared. The protective layer includes a cured and/or half-cured product of an active energy ray-curable resin and has a thermally reactive group and a polysiloxane chain. In the resin preparation step, mold resin in a thermally uncured and/or half-cured state is prepared. In the disposition step, the transfer material is disposed so that the protective layer is exposed. In the transfer step, the mold resin and the protective layer are brought into contact and heated to chemically bond them, and the mold layer is cured, and the protective layer is cured to form the hard coating layer.
    Type: Application
    Filed: November 26, 2019
    Publication date: January 13, 2022
    Applicants: Harima Chemicals, Incorporated, Hamamatsu Photonics K.K.
    Inventors: Ryouichi NAKAI, Yutaka KITAJIMA, Hisaya SUGIURA, Takayuki IKEYA
  • Publication number: 20210387386
    Abstract: A multi-layered sheet includes a substrate sheet and a thermally curable layer that is disposed on a surface of the substrate sheet and can be disposed on at least a part of a surface of a mold resin, wherein the thermally curable layer is an uppermost layer of the multi-layered sheet, the thermally curable layer includes a product of active energy ray-curable resin cured or half-cured by active energy ray, and the thermally curable layer has: a thermally reactive group that can react and thermally cure with a material component of the mold resin; and a polysiloxane chain.
    Type: Application
    Filed: November 26, 2019
    Publication date: December 16, 2021
    Applicant: Harima Chemicals, Incorporated
    Inventors: Ryouichi NAKAI, Yutaka KITAJIMA, Soichi SHIKANO