Patents by Inventor Ryouichi Narushima

Ryouichi Narushima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper clad laminate, multilayer printed circuit board and their processing method
    Patent number: 5569545
    Abstract: A copper clad laminate having a bonded side ensuring powerful adhesion between the copper foil and insulating layer, without providing protrusions on the copper foil or making roughing treatment or black treatment, by designing such a configuration that the copper foil has a metal layer on the side to be bonded with the insulating layer and the metal layer and insulating layer are cross-linked with each other by chemical bonds through sulfur atoms. Further, there is provided a multilayer printed circuit board which has a bonded side ensuring a powerful adhesion of the circuit copper foil and insulating layer, by designing such a configuration that the alternating metal layers and insulating layers are cross-linked with each other by chemical bonds through sulfur atoms.
    Type: Grant
    Filed: December 28, 1994
    Date of Patent: October 29, 1996
    Assignee: Nippon Denkai Ltd.
    Inventors: Hitoshi Yokono, Haruki Yokono, Masahiro Mikamo, Ryouichi Narushima, Takuya Iida, Yasuhiro Endo