Patents by Inventor Ryouichi YOSHIMOTO

Ryouichi YOSHIMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame
    Patent number: 10727171
    Abstract: A lead frame includes a plurality of leads formed from a metal plate having a front side and a back side, a first resin member, and a second resin member. The leads have side faces thereof fixed with the first resin member. Faces serving as internal connectors of the leads are uncovered on the side of the front-side surface of the first resin member, and faces serving as external connectors of the leads are uncovered on the side of the back-side surface of the first resin member. The second resin member is formed on the front-side surface of the first resin member to be at a level higher than the faces serving as the internal connectors, and has openings for leaving the faces serving as the internal connectors uncovered.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: July 28, 2020
    Assignee: OHKUCHI MATERIALS CO., LTD.
    Inventors: Kaoru Hishiki, Ryouichi Yoshimoto, Ichinori Iidani
  • LEAD FRAME
    Publication number: 20180158760
    Abstract: A lead frame includes a plurality of leads formed from a metal plate having a front side and a back side, a first resin member, and a second resin member. The leads have side faces thereof fixed with the first resin member. Faces serving as internal connectors of the leads are uncovered on the side of the front-side surface of the first resin member, and faces serving as external connectors of the leads are uncovered on the side of the back-side surface of the first resin member. The second resin member is formed on the front-side surface of the first resin member to be at a level higher than the faces serving as the internal connectors, and has openings for leaving the faces serving as the internal connectors uncovered.
    Type: Application
    Filed: November 28, 2017
    Publication date: June 7, 2018
    Inventors: Kaoru HISHIKI, Ryouichi YOSHIMOTO, Ichinori IIDANI
  • Lead frame for mounting semiconductor element and method for manufacturing the same
    Patent number: 9691689
    Abstract: A lead frame for mounting semiconductor element includes a protrusion that is horizontally projects from edges of the upper and lower surfaces of a semiconductor-mounting part or a terminal part of the lead frame and that is provided on a lateral side of at least one of the semiconductor-mounting part or the terminal part of the lead frame, wherein the top end of the protrusion is substantially flat or the profile of the cross section of the top end is arc-shaped, and the top end of the protrusion is thick.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: June 27, 2017
    Assignee: SH MATERIALS CO., LTD.
    Inventors: Ryouichi Yoshimoto, Ryohei Yamashita
  • LEAD FRAME FOR MOUNTING SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20160276252
    Abstract: A lead frame for mounting semiconductor element includes a protrusion that is horizontally projects from edges of the upper and lower surfaces of a semiconductor-mounting part or a terminal part of the lead frame and that is provided on a lateral side of at least one of the semiconductor-mounting part or the terminal part of the lead frame, wherein the top end of the protrusion is substantially flat or the profile of the cross section of the top end is arc-shaped, and the top end of the protrusion is thick.
    Type: Application
    Filed: March 18, 2014
    Publication date: September 22, 2016
    Applicant: SH MATERIALS CO., LTD.
    Inventors: Ryouichi YOSHIMOTO, Ryohei YAMASHITA