Patents by Inventor Ryouichi YOSHINO

Ryouichi YOSHINO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly of internal combustion engine valve and valve seat
    Patent number: 10287933
    Abstract: In an assembly of a hollow poppet valve and a valve seat insert, the hollow poppet valve's head is integrally formed with a stem end, a hollow part is formed from the head to a stem, and coolant is filled into the hollow part along with an inert gas. The valve seat insert is formed of iron base sintered alloy and obtained by integrating two layers of a supporting material side layer and a valve contact face side layer. The hollow poppet valve is formed of a material having thermal conductivity of 5-45 (W/m·K) at 20-1000° C. The valve seat insert includes the supporting material side layer having thermal conductivity of 23-50 (W/m·K) at 20-300° C. and a valve contact face side layer having thermal conductivity of 10-22 (W/m·K) at 20-300° C. This enables a valve temperature decrease throughout an engine's entire RPM range compared with the prior art.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: May 14, 2019
    Assignees: NIPPON PISTON RING CO., LTD., NITTAN VALVE CO., LTD.
    Inventors: Satoshi Ikemi, Hiroshi Oshige, Kiyoshi Suwa, Kenichi Sato, Kouji Kunitake, Ryouichi Yoshino
  • ASSEMBLY OF INTERNAL COMBUSTION ENGINE VALVE AND VALVE SEAT
    Publication number: 20160326919
    Abstract: In an assembly of a hollow poppet valve and a valve seat insert, the hollow poppet valve's head is integrally formed with a stem end, a hollow part is formed from the head to a stem, and coolant is filled into the hollow part along with an inert gas. The valve seat insert is formed of iron base sintered alloy and obtained by integrating two layers of a supporting material side layer and a valve contact face side layer. The hollow poppet valve is formed of a material having thermal conductivity of 5-45 (W/m·K) at 20-1000° C. The valve seat insert includes the supporting material side layer having thermal conductivity of 23-50 (W/m·K) at 20-300° C. and a valve contact face side layer having thermal conductivity of 10-22 (W/m·K) at 20-300° C. This enables a valve temperature decrease throughout an engine's entire RPM range compared with the prior art.
    Type: Application
    Filed: December 17, 2014
    Publication date: November 10, 2016
    Inventors: Satoshi IKEMI, Hiroshi OSHIGE, Kiyoshi SUWA, Kenichi SATO, Kouji KUNITAKE, Ryouichi YOSHINO