Abstract: A die bonding/dicing sheet, which can solve the problems of the peeling and the dispersion of an adhesive layer from a pressure sensitive adhesive layer in expanding and further the adhesion thereof to a semiconductor chip, is provided. The die bonding/dicing sheet, which is attached to a support member for mounting a semiconductor element in use, comprising: a peerable first base material; an adhesive layer provided on one surface of the first base material; a pressure sensitive adhesive layer, which covers a whole upper surface of the adhesive layer and has a peripheral part which does not overlap the adhesive layer; and a second base material provided on an upper surface of the pressure sensitive adhesive layer, wherein a plane outer shape of the adhesive layer is larger than a plane outer shape of the support member for mounting the semiconductor element, and a distance between an edge of the adhesive layer and an edge of the support member is 1 mm or more and 12 mm or less.