Patents by Inventor Ryouji Suezaki

Ryouji Suezaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Suspension board with circuit and producing method thereof
    Patent number: 8927870
    Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: January 6, 2015
    Assignee: Nitto Denko Corporation
    Inventors: Yasushi Tamura, Ryouji Suezaki, Tetsuya Ohsawa, Hiroyuki Tanabe, Hitoki Kanagawa
  • Suspension board with circuit and producing method thereof
    Patent number: 8872036
    Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: October 28, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yasushi Tamura, Ryouji Suezaki, Tetsuya Ohsawa, Hiroyuki Tanabe, Hitoki Kanagawa
  • Negative photosensitive material, photosensitive board employing the negative photosensitive material, and negative pattern forming method
    Patent number: 8728705
    Abstract: A negative photosensitive material is provided which has a lower linear expansion coefficient and a lower hygroscopic expansion coefficient and is excellent in gradational patternability and PI etchability in patterning.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: May 20, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Katsutoshi Hirashima, Hirofumi Fujii, Yasushi Tamura, Ryouji Suezaki
  • Suspension board with circuit and production method thereof
    Patent number: 8450613
    Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.
    Type: Grant
    Filed: March 3, 2010
    Date of Patent: May 28, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Yasushi Tamura, Ryouji Suezaki, Tetsuya Ohsawa, Hiroyuki Tanabe, Hitoki Kanagawa
  • NEGATIVE PHOTOSENSITIVE MATERIAL, PHOTOSENSITIVE BOARD EMPLOYING THE NEGATIVE PHOTOSENSITIVE MATERIAL, AND NEGATIVE PATTERN FORMING METHOD
    Publication number: 20100304298
    Abstract: A negative photosensitive material is provided which has a lower linear expansion coefficient and a lower hygroscopic expansion coefficient and is excellent in gradational patternability and PI etchability in patterning.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 2, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Katsutoshi Hirashima, Hirofumi Fujii, Yasushi Tamura, Ryouji Suezaki
  • Suspension board with circuit and production method thereof
    Publication number: 20100224391
    Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.
    Type: Application
    Filed: March 3, 2010
    Publication date: September 9, 2010
    Applicant: Nitto Denko Corporation
    Inventors: Yasushi Tamura, Ryouji Suezaki, Tetsuya Ohsawa, Hiroyuki Tanabe, Hitoki Kanagawa