Patents by Inventor Ryoya ABE

Ryoya ABE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12531213
    Abstract: A plasma processing apparatus comprising: a plasma processing chamber; a substrate support; and a baffle structure to surround the substrate support. The baffle structure includes an upper baffle plate having a plurality of first openings, each of the plurality of first openings having a first width, and a lower baffle plate having a plurality of second openings, each of the plurality of second openings having an upper opening portion and a lower opening portion. A liner structure surrounds a plasma processing space disposed above the substrate support, and includes an inner cylindrical liner and an outer cylindrical liner. The inner cylindrical liner has a plurality of third openings, each of the plurality of third openings having a fourth width. The outer cylindrical liner has a plurality of fourth openings, each of the plurality of fourth openings having an inner opening portion and an outer opening portion.
    Type: Grant
    Filed: April 4, 2023
    Date of Patent: January 20, 2026
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Ryoya Abe, Tetsuji Sato, Shin Matsuura
  • Publication number: 20240112891
    Abstract: There is a plasma processing apparatus comprising: a conductive chamber made of a first conductive material and connected to a ground potential; a plasma generator configured to generate a plasma in the conductive chamber; a plurality of conductive liners made of a second conductive material different from the first conductive material and arranged in a circumferential direction in the conductive chamber, each conductive liner having a first surface and a second surface opposite to the first surface, the first surface being in contact with a sidewall of the conductive chamber, the second surface being exposed to the plasma, a gap being formed between two adjacent conductive liners among the plurality of conductive liners; and a plurality of fixing mechanisms respectively corresponding to the plurality of conductive liners, each fixing mechanism being configured to fix a corresponding conductive liner to the sidewall of the conductive chamber.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 4, 2024
    Applicant: Tokyo Electron Limited
    Inventors: Masaru ISAGO, Ryoya ABE
  • Publication number: 20230317425
    Abstract: A plasma processing apparatus comprising: a plasma processing chamber; a substrate support; and a baffle structure to surround the substrate support. The baffle structure includes an upper baffle plate having a plurality of first openings, each of the plurality of first openings having a first width, and a lower baffle plate having a plurality of second openings, each of the plurality of second openings having an upper opening portion and a lower opening portion. A liner structure surrounds a plasma processing space disposed above the substrate support, and includes an inner cylindrical liner and an outer cylindrical liner. The inner cylindrical liner has a plurality of third openings, each of the plurality of third openings having a fourth width. The outer cylindrical liner has a plurality of fourth openings, each of the plurality of fourth openings having an inner opening portion and an outer opening portion.
    Type: Application
    Filed: April 4, 2023
    Publication date: October 5, 2023
    Applicant: Tokyo Electron Limited
    Inventors: Ryoya ABE, Tetsuji SATO, Shin MATSUURA
  • Publication number: 20220301832
    Abstract: A plasma processing apparatus includes a plasma processing chamber; a plasma generator configured to generate a plasma in the plasma processing chamber; a substrate support disposed in the plasma processing chamber; a first conductive ring disposed to surround a substrate on the substrate support; an insulating ring disposed to surround the first conductive ring; and a second conductive ring disposed to surround the insulating ring, and connected to a ground potential.
    Type: Application
    Filed: March 16, 2022
    Publication date: September 22, 2022
    Inventors: Takashi Aramaki, Hiroshi Tsujimoto, Lifu Li, Yusei Kuwabara, Ryoya Abe
  • Publication number: 20220148861
    Abstract: A chamber is provided where an exhaust port for exhausting a gas in an inside thereof is formed thereon and substrate processing for a substrate is executed in the inside. A partition member partitions the inside of the chamber into a processing region where the substrate processing is executed and an exhaust region that leads to the exhaust port. The partition member is configured to include a plurality of plate-shaped members. The plurality of plate-shaped members are provided in such a manner that at least a part of each thereof is arranged obliquely at intervals in a side view from a side of a side surface of the chamber and an upper end part of each thereof is arranged so as to overlap with a lower end part of the plate-shaped member that is adjacent thereto in a top view from an upper side of the chamber.
    Type: Application
    Filed: November 8, 2021
    Publication date: May 12, 2022
    Applicant: Tokyo Electron Limited
    Inventors: Wataru SHIMIZU, Ryoya ABE, Tomoya UJIIE