Patents by Inventor Ryoya SHIRAHAMA

Ryoya SHIRAHAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 11961784
    Abstract: A first heat sink has a first inner surface and a first outer surface, and has a first through hole. A second heat sink has a second inner surface disposed with a clearance left from the first inner surface of the first heat sink, and a second outer surface opposite to the second inner surface, and has a second through hole. A semiconductor element is disposed within a clearance between the first inner surface of the first heat sink and the second inner surface of the second heat sink. A sealing member seals the semiconductor element within the clearance between the first inner surface and the second inner surface. A first hollow tube is made of metal, and connects the first through hole and the second through hole.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: April 16, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Arata Iizuka, Korehide Okamoto, Ryoya Shirahama
  • SEMICONDUCTOR DEVICE
    Publication number: 20220059432
    Abstract: A first heat sink has a first inner surface and a first outer surface, and has a first through hole. A second heat sink has a second inner surface disposed with a clearance left from the first inner surface of the first heat sink, and a second outer surface opposite to the second inner surface, and has a second through hole. A semiconductor element is disposed within a clearance between the first inner surface of the first heat sink and the second inner surface of the second heat sink. A sealing member seals the semiconductor element within the clearance between the first inner surface and the second inner surface. A first hollow tube is made of metal, and connects the first through hole and the second through hole.
    Type: Application
    Filed: November 19, 2018
    Publication date: February 24, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Arata IIZUKA, Korehide OKAMOTO, Ryoya SHIRAHAMA