Abstract: The invention is intended to provide a small and highly reliable pressure sensor, which has a smaller number of components and can be produced by using a mold for resin molding in common. A sensor unit (11) is molded with resin and includes a semiconductor chip (1) for converting the change in pressure of a medium introduced through an introduction hole for measurement into an electric signal. A lead member (12) has one end exposed in a connector (23) and is electrically connected to the semiconductor chip (1) in the sensor unit (11) beforehand. Pressure is applied to the semiconductor chip (1) through a pipe (22). An outer case (21) is integrally formed of synthetic resin by insert molding of the sensor unit (11), the lead member (12) and the pipe (22).

Abstract: The invention is intended to provide a small and highly reliable pressure sensor, which has a smaller number of components and can be produced by using a mold for resin molding in common. A sensor unit (11) is molded with resin. and includes a semiconductor chip (1) for converting the change in pressure of a medium introduced through an introduction hole for measurement into an electric signal. A lead member (12) has one end exposed in a connector (23) and is electrically connected to the semiconductor chip (1) in the sensor unit (11) beforehand. Pressure is applied to the semiconductor chip (1) through a pipe (22). An outer case (21) is integrally formed of synthetic resin by insert molding of the sensor unit (11), the lead member (12) and the pipe (22).