Abstract: A multilayer printed wiring board including one or more insulating layers 2 and at least one conductive layer 1 which are stacked alternately is disclosed. The one or more insulating layers 2 include at least one liquid crystal polymer resin layer 4 so that each of the one or more insulating layers 2 includes at least one layer selected from a group consisting of at least one polyolefin resin layer 3 and the at least one liquid crystal polymer resin layer 4. A percentage by volume of the at least one liquid crystal polymer resin layer 4 relative to the one or more insulating layers 2 is within a range of 5 to 90%.

Abstract: A multilayer printed wiring board including one or more insulating layers 2 and at least one conductive layer 1 which are stacked alternately is disclosed. The one or more insulating layers 2 include at least one liquid crystal polymer resin layer 4 so that each of the one or more insulating layers 2 includes at least one layer selected from a group consisting of at least one polyolefin resin layer 3 and the at least one liquid crystal polymer resin layer 4. A percentage by volume of the at least one liquid crystal polymer resin layer 4 relative to the one or more insulating layers 2 is within a range of 5 to 90%.

Abstract: This thermosetting adhesive composition contains as a component (A) a vinyl compound in which a terminal end of a bifunctional polyphenylene ether oligomer is converted to a vinyl group, as a component (B) a maleimide resin, and as a component (C) a thermoplastic elastomer, the equivalent ratio of vinyl groups in the component (A) and maleimide groups in the component (B) being 1.0:0.5 to 1.0:4.0, the proportion of the component (C) in the total weight of the component (A), the component (B), and the component (C) being 55 to 95% by weight, the ratio of styrene units of the component (C) with respect to the total weight of the component (C) being 10 to 40% by weight, the tensile stress at 100% elongation being 0.1 to 2.9 MPa, and the elongation at break being 100% or greater.

Abstract: A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.

Abstract: A multilayer printed wiring board has excellent high-frequency characteristics. The multilayer printed wiring board includes one or more conductive layers and one or more insulating layers. In the multilayer printed wiring board, the one or more conductive layers and the one or more insulating layers are alternately stacked. Each insulating layer of the one or more insulating layers includes one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer. At least one insulating layer of the one or more insulating layers includes a polyolefin resin layer.

Abstract: A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.

Abstract: A multilayer printed wiring board has excellent high-frequency characteristics. The multilayer printed wiring board includes one or more conductive layers and one or more insulating layers. In the multilayer printed wiring board, the one or more conductive layers and the one or more insulating layers are alternately stacked. Each insulating layer of the one or more insulating layers includes one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer. At least one insulating layer of the one or more insulating layers includes a polyolefin resin layer.

Abstract: A multilayer printed wiring board including one or more insulating layers and at least one conductive layer which are stacked alternately is disclosed. The one or more insulating layers include at least one liquid crystal polymer resin layer so that each of the one or more insulating layers includes at least one layer selected from a group consisting of at least one polyolefin resin layer and the at least one liquid crystal polymer resin layer. A percentage by volume of the at least one liquid crystal polymer resin layer relative to the one or more insulating layers is within a range of 5 to 90%.

Abstract: This thermosetting adhesive composition contains as a component (A) a vinyl compound in which a terminal end of a bifunctional polyphenylene ether oligomer is converted to a vinyl group, as a component (B) a maleimide resin, and as a component (C) a thermoplastic elastomer, the equivalent ratio of vinyl groups in the component (A) and maleimide groups in the component (B) being 1.0:0.5 to 1.0:4.0, the proportion of the component (C) in the total weight of the component (A), the component (B), and the component (C) being 55 to 95% by weight, the ratio of styrene units of the component (C) with respect to the total weight of the component (C) being 10 to 40% by weight, the tensile stress at 100% elongation being 0.1 to 2.9 MPa, and the elongation at break being 100% or greater.