Abstract: The present disclosure provides an antibody for inducing immune tolerance, an induced lymphocyte, and a cell therapy agent therapeutic method using the induced lymphocyte. Specifically, the present disclosure provides an antibody that inhibits the interaction between CD80 and/or CD86 expressed on the surface of a certain cell and CD28 expressed on the surface of another cell, and substantially does not induce immune activation-induced cytokines. In a specific embodiment, the Fc portion of the antibody substantially does not produce the immune activation-induced cytokines.

Abstract: A device including male and female connectors each including mounting pad terminals arranged on both side portions of a surface mounted on a circuit board, and a connector structure. The female connector includes: an insulating film; pad portions formed on one surface of the insulating film; a metal guide member fixedly disposed to cover the other surface of the insulating film and insulatingly coated; female terminal portions including slit openings penetrating in a thickness direction through the pad portions and portions of the insulating film; through-holes penetrating through the metal guide member; and mounting pad terminals formed on both side portions of the other surface of the insulating film, with surfaces projecting more than a surface of the metal guide member and electrically connected to the pad portions respectively. The connector structure includes male terminal portions inserted to the slit openings from the female connector's one surface side.

Abstract: A device including male and female connectors each including mounting pad terminals arranged on both side portions of a surface mounted on a circuit board, and a connector structure. The female connector includes: an insulating film; pad portions formed on one surface of the insulating film; a metal guide member fixedly disposed to cover the other surface of the insulating film and insulatingly coated; female terminal portions including slit openings penetrating in a thickness direction through the pad portions and portions of the insulating film; through-holes penetrating through the metal guide member; and mounting pad terminals formed on both side portions of the other surface of the insulating film, with surfaces projecting more than a surface of the metal guide member and electrically connected to the pad portions respectively. The connector structure includes male terminal portions inserted to the slit openings from the female connector's one surface side.

Abstract: A system is provided for testing a bare IC chip having an array of electrode pads. A burn-in socket includes a dielectric housing having a receptacle. A plurality of terminals on the housing include contact portions exposed in the receptacle and terminating portions extending exteriorly of the housing. An adapter socket is configured for positioning in the receptacle in the burn-in socket and includes an opening for removably receiving the bare IC chip. A plurality of conductors have contact portions exposed in the opening for engaging the electrode pads of the bare IC chip. Connection portions of the conductors engage the contact portions of the terminals of the burn-in socket. The conductors are formed on a laminated film which is part of the adapter socket.

Abstract: Disclosed is an improved integrated circuit socket having electrically conductive pads formed on a resilient circuitry component for contacting the terminals of an integrated circuit (IC) package which is positioned on the resilient circuitry. The electrically conductive pads are arranged around the center area of the resilient circuitry to be in one-to-one correspondence with the terminals of the IC package. The electrically conductive pads have individual circuit paths of substantially the same length and which are extending outwardly from the center area of the flexible circuitry, and additional electrically conductive pads are formed on the back side of the flexible circuitry in order to effect the required electrical connections to exterior circuits. These electrically conductive pads on the back side are connected to the conductor pattern on the front side by conductive through holes or vias. With this arrangement all conductors have the same, reduced inductance.

Abstract: This invention presents a new anisotropic conductive film for conductive connections, its method of manufacture, and connectors which use the same, which reduces the connection resistance of semiconductor and similar devices, to the circuit substrates, and simultaneously simplifies the repair. Copper foil 2 is bonded on both sides to an electrical insulating film 3. Holes are formed in the copper foil 2 by etching, and through-holes 5 are formed in the aforesaid electrical insulating film 3, using copper foil 2 as a mask for etching. Next, the through-holes 5 are filled with a conductive elastomer 6, and hardened. The copper foil 2 is then etched to form protuberances 4 of elastomer 6 having the same viscosity. The conducting elastomer 6 protuberance 4 on one side makes contact with the semiconductor device pad, while the protuberance 4 on the other side makes contact with the substrate-side pad. A conductive connection is made by pressing both together.

Abstract: A low-temperature burnt conductive paste prepared by dispersing, in an organic vehicle, a base material comprising 50 to 95% by weight of a powder of at least one conductive material selected from the group consisting of a copper alloy, a copper oxide and a copper alloy oxide and 5 to 50% by weight of a glass powder having a softening point of 300.degree. to 600.degree. C. and a coefficient of thermal expansion of 6 to 13.times.10.sup.-6 .degree.C..sup.-1, and a method of manufacturing a printed circuit board using this paste.

Abstract: This invention provides an aluminum enamel board having an electrically insulating glass layer formed on an Al-Si alloy plate containing at least 5 wt % of Si or a composite metal plate having an aluminum or alloy layer formed on at least one side of a metal plate made of a metal other than aluminum. Since the Al-Si alloy plate containing at least 5 wt % of Si or a composite metal plate having the aluminum or aluminum alloy layer is used as a board, the adhesion strength between the metal plate and the electrically insulating glass layer can be increased. At the same time, a predetermined material is used to form the electrically insulating glass layer, thereby minimizing a difference in thermal conductivity and thermal expansion coefficient between the electrically insulating glass layer and the metal plate. This improves the heat conduction characteristics of the board and prevents warping of the board.