Abstract: An object of the present invention is to provide a Pd alloy, a Pd alloy material, and a probe pin for electric and electronic devices in which specific resistance, hardness, and processability are balanced at a higher level than before, and methods for manufacturing the same. In order to achieve this object, the Pd alloy for electric and electronic devices according to the present invention having a composition comprising 50.1 mass % or more and 55.5 mass % or less of Pd, 6.3 mass % or more and 16.1 mass % or less of Ag, 30.0 mass % or more and 38.0 mass % or less of Cu, and 0.5 mass % or more and 2.0 mass % or less of In is adopted.

Abstract: A precipitation-hardening alloy, including 17 to 23.6 at % of Ag, 0.5 to 1.1 at % of B, and a total of 74.9 to 81.5 at % of Pd and Cu, wherein the at % ratio of the Pd and Cu is 1:1 to 1:1.2, and the rest includes In and inevitable impurities. This provides an alloy with good overall balance, having all of maintaining low specific resistance, at least almost equal to that of conventional Ag—Pd—Cu alloys, and also having contact resistance stability (oxidation resistance), good plastic workability, and higher hardness than before.

Abstract: An object of the present invention is to provide a Pd alloy, a Pd alloy material, and a probe pin for electric and electronic devices in which specific resistance, hardness, and processability are balanced at a higher level than before, and methods for manufacturing the same. In order to achieve this object, the Pd alloy for electric and electronic devices according to the present invention having a composition comprising 50.1 mass % or more and 55.5 mass % or less of Pd, 6.3 mass % or more and 16.1 mass % or less of Ag, 30.0 mass % or more and 38.0 mass % or less of Cu, and 0.5 mass % or more and 2.0 mass % or less of In is adopted.

Abstract: A precipitation-hardening alloy, including 17 to 23.6 at % of Ag, 0.5 to 1.1 at % of B, and a total of 74.9 to 81.5 at % of Pd and Cu, wherein the at % ratio of the Pd and Cu is 1:1 to 1:1.2, and the rest includes In and inevitable impurities. This provides an alloy with good overall balance, having all of maintaining low specific resistance, at least almost equal to that of conventional Ag—Pd—Cu alloys, and also having contact resistance stability (oxidation resistance), good plastic workability, and higher hardness than before.

Abstract: The present invention is to provide metal material for electric/electronic devices, which is comprised of 20 to 50 mass % of Ag or 20 to 50 mass % of Pd to 10 to 40 mass % of Cu, 5 to 30 mass % of Co, said alloy has low contact resistance, good oxidation resistance, high hardness, good workability, and low wettability and anti-erosion property to Sn alloy solder.

Abstract: In materials using an Ag—Pd—Cu alloy for electric and electronic appliances, an improvement in weakness (fragility) to bending attained by adding Pt has been proposed since a material excellent in bending workability has been in demand. On the other hand, the proposal has entailed a problem of a considerable reduction in hardness though it depends on the added Pt amount. Also, there has been a problem that a material cost is increased by the addition of Pt. By adding 0.1 to 5.0 mass % of Co or 0.1 to 5.0 mass % of Ni to 20 to 50 mass % of Ag, 20 to 50 mass % of Pd, and 10 to 40 mass % of Cu, the hardness when precipitation hardened after plastic working was improved to 280 to 480 HV, and the bending workability was attained.

Abstract: The present invention provides an electrical/electronic material which has low contact resistance, excellent corrosion resistance, high hardness, high flexing strength and excellent processability. The electrical/electronic material is characterized by being composed of 20-40% by mass of Ag, 20-40% by mass of Pd, 10-30% by mass of Cu and 1.0-20% by mass of Pt and having a hardness of 340-420 HV at the time of precipitation hardening after metal forming and an adequate flexing strength.