Patents by Inventor Ryugo HIKICHI

Ryugo HIKICHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11353789
    Abstract: An imprint method using a mold and/or a transfer substrate having a mesa structure includes a resin supply step, a contact step, a curing step, and a mold release step. In the resin supply step, a balance layer is formed by supplying a molded resin also to an area outside of a pattern formation area of the transfer substrate in which a pattern structure is to be formed.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: June 7, 2022
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Takaharu Nagai, Yuichi Inazuki, Katsutoshi Suzuki, Ryugo Hikichi, Koji Ichimura, Saburou Harada
  • Publication number: 20190384169
    Abstract: An imprint method using a mold and/or a transfer substrate having a mesa structure includes a resin supply step, a contact step, a curing step, and a mold release step. In the resin supply step, a balance layer is formed by supplying a molded resin also to an area outside of a pattern formation area of the transfer substrate in which a pattern structure is to be formed.
    Type: Application
    Filed: August 19, 2019
    Publication date: December 19, 2019
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Takaharu NAGAI, Yuichi INAZUKI, Katsutoshi SUZUKI, Ryugo HIKICHI, Koji ICHIMURA, Saburou HARADA
  • Patent number: 10429732
    Abstract: An imprint method using a mold and/or a transfer substrate having a mesa structure includes a resin supply step, a contact step, a curing step, and a mold release step. In the resin supply step, a balance layer is formed by supplying a molded resin also to an area outside of a pattern formation area of the transfer substrate in which a pattern structure is to be formed.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: October 1, 2019
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Takaharu Nagai, Yuichi Inazuki, Katsutoshi Suzuki, Ryugo Hikichi, Koji Ichimura, Saburou Harada
  • Publication number: 20170235221
    Abstract: An imprint method using a mold and/or a transfer substrate having a mesa structure includes a resin supply step, a contact step, a curing step, and a mold release step. In the resin supply step, a balance layer is formed by supplying a molded resin also to an area outside of a pattern formation area of the transfer substrate in which a pattern structure is to be formed.
    Type: Application
    Filed: March 11, 2015
    Publication date: August 17, 2017
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Takaharu NAGAI, Yuichi INAZUKI, Katsutoshi SUZUKI, Ryugo HIKICHI, Koji ICHIMURA, Saburou HARADA