Abstract: Provided is an encapsulation resin composition that is suitable for encapsulating a semiconductor element-mounted surface of a substrate with a semiconductor element(s) mounted thereon or a semiconductor element-forming surface of a wafer with a semiconductor element(s) formed thereon, and is superior in low warpage property and grindability. The encapsulation resin composition of the present invention contains: (A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule; (B) a reaction initiator; and (C) an inorganic filler surface-treated with a silane coupling agent, wherein the component (C) has a maximum particle size of not larger than 40 ?m.

Abstract: A thermosetting resin composition, including: a thermosetting resin; a laser direct structuring additive; an inorganic filler; and a coupling agent, wherein the coupling agent contains one or more selected from the group consisting of a triazine functional group-, isocyanate functional group-, isocyanuric acid functional group-, benzotriazole functional group-, acid anhydride functional group-, azasilacyclopentane functional group-, imidazole functional group-, and unsaturated group-containing-silane coupling agent, and is not a mercaptosilane coupling agent, an amino silane coupling agent, or an epoxy silane coupling agent.

Abstract: Provided are a resin composition for encapsulation that is superior in high-temperature reverse bias test (HTRB test) reliability; and a semiconductor device. The resin composition for encapsulation is used to encapsulate a power semiconductor element made of Si, SiC, GaN, Ga2O3 or diamond, and a cured product of the resin composition for encapsulation has a dielectric tangent of not larger than 0.50 when measured at 150° C. and 0.1 Hz. The semiconductor device is such that a power semiconductor element made of Si, SiC, GaN, Ga2O3 or diamond is encapsulated by the cured product of the resin composition for encapsulation.

Abstract: Provided is a heat-curable maleimide resin composition capable of being turned into a cured product with a superior dielectric property, and allowing a plating layer(s) to be formed only at laser-irradiated parts on the surface of or inside the cured product. The heat-curable maleimide resin composition contains: (A) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; and (B) a laser direct structuring additive being a metal oxide having a spinel structure and represented by the following average composition formula (1): AB2O4 ??(1) wherein A represents one or more metal elements selected from iron, copper, nickel, cobalt, zinc, magnesium and manganese, B represents iron or chrome, provided that A and B do not both represent iron.

Abstract: Provided are an epoxy resin composition for semiconductor encapsulation; and a semiconductor device having a cured product of such composition. The composition has a superior curability, and a metal layer (plated layer) can be selectively and easily formed on the surface of or inside the cured product of this composition via an electroless plating treatment. The composition of the present invention contains: (A) an epoxy resin; (B) a phenolic curing agent; (C) a curing accelerator having a urea structure; (D) a laser direct structuring additive; and (E) an inorganic filler.

Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent, (A) a carboxyl-containing benzotriazole derivative, and (B) an alkoxysilyl-containing aminoalkylsilane derivative is suited for encapsulating semiconductor devices. The sum of (A)+(B) is 0.5-5.0 pbw per 100 pbw of the sum of the epoxy resin and the curing agent, and a molar ratio (A)/(B) is 0.5-1.5. The composition is free of sulfur and highly adhesive to metal substrates.

Abstract: According to one embodiment, an electronic device includes a transformer connected to a power supply device, a super capacitor chargeable with an output of the transformer, a voltage converter connected to the transformer, a processor having a power supply terminal supplied with an output of the voltage converter, first and second photo-couplers connected to the power supply device, and a capacitor connected to a primary side of the second photo-coupler through a resistor. The primary side of the second photo-coupler is grounded via a pull-down resistor. The processor includes first and second terminals connected to the first and second photo-couplers and a third terminal supplied with a charging voltage of the super capacitor.

Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent, (A) a carboxyl-containing benzotriazole derivative, and (B) an alkoxysilyl-containing aminoalkylsilane derivative is suited for encapsulating semiconductor devices. The sum of (A)+(B) is 0.5-5.0 pbw per 100 pbw of the sum of the epoxy resin and the curing agent, and a molar ratio (A)/(B) is 0.5-1.5. The composition is free of sulfur and highly adhesive to metal substrates.

Abstract: A resin composition comprising a thermosetting resin, an inorganic filler and an organosilicon compound of specific structure is provided. The inorganic filler is briefly treated with the organosilicon compound to have a high affinity to the resin. The composition is improved in flow and impact resistance and suited for encapsulating semiconductor devices.

Abstract: According to one embodiment, an electronic device includes a power supply, a port and a circuit. The port is configured to connect with an external device. The circuit is configured to control the power supply to supply a first voltage to the external device connected with the port if a system status of the electronic device is not a power-saving status, and to supply a second voltage different from the first voltage to the external device if the system status of the electronic device is the power-saving status.

Abstract: According to one embodiment, an electronic device includes a transformer connected to a power supply device, a super capacitor chargeable with an output of the transformer, a voltage converter connected to the transformer, a processor having a power supply terminal supplied with an output of the voltage converter, first and second photo-couplers connected to the power supply device, and a capacitor connected to a primary side of the second photo-coupler through a resistor. The primary side of the second photo-coupler is grounded via a pull-down resistor. The processor includes first and second terminals connected to the first and second photo-couplers and a third terminal supplied with a charging voltage of the super capacitor.

Abstract: Provided is a semiconductor encapsulation resin composition exhibiting an insignificant heat decomposition when left under a high temperature of 200 to 250° C. for a long period of time; and a superior reliability and adhesion to a Cu LF and Ag plating under a high-temperature and high-humidity environment. The composition comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenolic compound; (C) at least one epoxy resin; (D) a copolymer obtained by a hydrosilylation reaction of an alkenyl group-containing epoxy compound and an organopolysiloxane; and (E) at least one compound selected from a tetraphenylborate salt of a tetra-substituted phosphonium compound and a tetraphenylborate salt. A molar ratio of phenolic hydroxyl groups in (B) to cyanato groups in (A) is 0.08 to 0.25, and a molar ratio of epoxy groups in (C) and (D) to cyanato groups in (A) is 0.04 to 0.25.

Abstract: Provided is a semiconductor encapsulation resin composition exhibiting an insignificant heat decomposition when left under a high temperature of 200 to 250° C. for a long period of time; and a superior reliability and adhesion to a Cu LF and Ag plating under a high-temperature and high-humidity environment. The composition comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenolic compound; (C) at least one epoxy resin; (D) a copolymer obtained by a hydrosilylation reaction of an alkenyl group-containing epoxy compound and an organopolysiloxane; and (E) at least one compound selected from a tetraphenylborate salt of a tetra-substituted phosphonium compound and a tetraphenylborate salt. A molar ratio of phenolic hydroxyl groups in (B) to cyanato groups in (A) is 0.08 to 0.25, and a molar ratio of epoxy groups in (C) and (D) to cyanato groups in (A) is 0.04 to 0.25.

Abstract: The purposes of the present invention is to provide a resin composition which provides a cured product which has a high glass transition temperature, a low moisture absorption and a good solder reflow property and small heat decomposition in storage at a high temperature for a long time, and has good moldability and good adhesiveness to a Cu lead frame.

Abstract: According to one embodiment, an electronic device includes a power supply, a port and a circuit. The port is configured to connect with an external device. The circuit is configured to control the power supply to supply a first voltage to the external device connected with the port if a system status of the electronic device is not a power-saving status, and to supply a second voltage different from the first voltage to the external device if the system status of the electronic device is the power-saving status.

Abstract: According to one embodiment, a power supply circuit includes a battery, a first manually-operated switch, a second switch, and a maintaining circuit. The first manually-operated switch includes a normally open contact point. The second switch has a closed state and an open state. When in the closed-state, the second switch is configured to supply electric power of the battery to a target circuit. When in the open state, the second switch is configured to shut off the electric power of the battery to the target circuit. The maintaining circuit is configured to maintain the second switch in the closed state when the first switch is continuously closed for greater than or equal to a first time.

Abstract: According to one embodiment, an electronic apparatus includes: a presence determining module configured to determine at an interval whether a user is present based on image data output by a camera; a display power controller configured to turn on a display when the user is present and to turn off the display when the user is not present, based on a result of the presence determining module; and a detection interval controller configured to control the interval such that the interval is shorter when the display is off compared to when the display is on and the user is determined to be present.

Abstract: An electronic device includes: display controller; user presence determination module; user authentication module; and controller. The user presence determination module determines presence of a user based on image data received from the camera while dominating access to a camera. The user authentication module dominates access to the camera, if the display is put in a screen lock state and to perform a user authentication based on the image data. The controller turns off the display if the user present determination module determines that the user is absent and while the display has not been put in the screen lock state, and to cause the user presence determination module to release the access to the camera and to put the display in the screen lock state before turning on the display if it is determined after the display is turned off that the user is present.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a display on a surface of the housing, an infrared sensor in a first region of the surface of the housing, the first region facing one side of the display, an indicator in the first region and configured to emit light, a first controller, and a second controller. The first controller turns on and off the display in accordance with a detection output of the infrared sensor. The second controller is configured to blink the indicator in a first blinking pattern in which a ratio of an ON time to a blinking cycle is smaller than that of an OFF time to the blinking cycle, when an event of which a user is notified occurs.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a display on a surface of the housing, an infrared sensor in a first region of the surface of the housing, the first region facing one side of the display, an indicator in the first region and configured to emit light, a first controller, and a second controller. The first controller turns on and off the display in accordance with a detection output of the infrared sensor. The second controller is configured to blink the indicator in a first blinking pattern in which a ratio of an ON time to a blinking cycle is smaller than that of an OFF time to the blinking cycle, when an event of which a user is notified occurs.