Abstract: A solution casting apparatus includes a drive roller as a conveying means. The drive roller conveys a polymer film peeled from a belt, the polymer film still containing a solvent. The drive roller has corrugation valleys and corrugation peaks formed on a peripheral surface along a circumferential direction of the drive roller. Each of the corrugation valleys and the corrugation peaks has a substantially semicircular cross section. The corrugation valleys and the corrugation peaks are disposed alternately in an axial direction of the drive roller. A pitch Pv between the corrugation valleys and a pitch Pm between the corrugation peaks are in the range of 0.01 to 2 mm, and a height Hv-m from a lowest point of the corrugation valley to a highest point of the corrugation peak is in the range of 0.01 to 1 mm. A curvature radius Rv of the corrugation valley and a curvature radius Rm of the corrugation peak are in the range of 0.1 to 0.5 mm.

Abstract: A dope producing apparatus is provided with a first feed line for sending polymer solution from a fourth tank to a solution casting apparatus. The first feed line is provided with a first orifice for adding dilute liquid to the polymer solution; a first inline mixer for inline-mixing the polymer solution and the dilute liquid to produce a mixture; a second orifice for adding matting liquid to the mixture; and a second inline mixer for mixing the mixture and the matting liquid to produce a first dope.

Abstract: A solution casting apparatus includes a drive roller as a conveying means. The drive roller conveys a polymer film peeled from a belt, the polymer film still containing a solvent. The drive roller has corrugation valleys and corrugation peaks formed on a peripheral surface along a circumferential direction of the drive roller. Each of the corrugation valleys and the corrugation peaks has a substantially semicircular cross section. The corrugation valleys and the corrugation peaks are disposed alternately in an axial direction of the drive roller. A pitch Pv between the corrugation valleys and a pitch Pm between the corrugation peaks are in the range of 0.01 to 2 mm, and a height Hv-m from a lowest point of the corrugation valley to a highest point of the corrugation peak is in the range of 0.01 to 1 mm. A curvature radius Rv of the corrugation valley and a curvature radius Rm of the corrugation peak are in the range of 0.1 to 0.5 mm.

Abstract: A dope producing apparatus is provided with a first feed line for sending polymer solution from a fourth tank to a solution casting apparatus. The first feed line is provided with a first orifice for adding dilute liquid to the polymer solution; a first inline mixer for inline-mixing the polymer solution and the dilute liquid to produce a mixture; a second orifice for adding matting liquid to the mixture; and a second inline mixer for mixing the mixture and the matting liquid to produce a first dope.

Abstract: In a piezoelectric resonator, first and second resonance electrodes are provided on the upper surface and the lower surface of a piezoelectric member, inner electrode layers for leading the first and second resonance electrodes to the upper and lower surfaces are provided and extend to the upper and lower surfaces of the piezoelectric member, and connecting electrodes are provided on the upper and lower surfaces of the piezoelectric member, and are electrically connected to the corresponding resonance electrodes via the inner electrode layers.

Abstract: A method for producing an energy trap piezoelectric resonator which operates in a thickness longitudinal vibration mode and which includes a piezoelectric member and first and second vibrating electrodes disposed on respective major surfaces of the piezoelectric member, involves the use of a piezoelectric material having an R value and an A value which are selected such that Qe=C/(R×A), where R and A are the average pore size in micrometers and the porosity in percent of the piezoelectric member, respectively. Here, Qe is a value at a frequency to be used and C is a constant that is determined by the piezoelectric material of the piezoelectric member. An energy trap, thickness longitudinal piezoelectric resonator produced by this method has a sufficiently high response to a vibration mode to be used, without any limitation on the type of piezoelectric material and size of the piezoelectric member and the frequency to be used.

Abstract: A method for producing an energy trap piezoelectric resonator which operates in a thickness longitudinal vibration mode and which includes a piezoelectric member and first and second vibrating electrodes disposed on respective major surfaces of the piezoelectric member, involves the use of a piezoelectric material having an R value and an A value which are selected such that Qe=C/(R×A), where R and A are the average pore size in micrometers and the porosity in percent of the piezoelectric member, respectively. Here, Qe is a value at a frequency to be used and C is a constant that is determined by the piezoelectric material of the piezoelectric member. An energy trap, thickness longitudinal piezoelectric resonator produced by this method has a sufficiently high response to a vibration mode to be used, without any limitation on the type of piezoelectric material and size of the piezoelectric member and the frequency to be used.

Abstract: A piezoelectric oscillator is constructed to prevent deterioration of frequency accuracy caused by external-capacitance variations to maintain a high degree of frequency accuracy. Additionally, an undesired short-circuit is prevented from occurring even when the height of the oscillator is reduced. In this oscillator, on an upper surface of a capacitor substrate only first and second external electrodes connected to a piezoelectric resonator are provided. The piezoelectric resonator connects to the external electrodes. A parallel capacitance section for loading capacitance in parallel to the piezoelectric resonator is connected between the first and second external electrodes. Additionally, load capacitance sections for interposing load capacitances are connected between the first external electrode and a third external electrode and between the second and third external electrodes. The parallel capacitance section and the pair of load capacitance sections are contained in the capacitor substrate.

Abstract: A substrate of a case for packaging an electronic component includes a conductive cap bonded to a substrate to cover the electronic component and to tightly seal an enclosed space. The substrate has a substrate body layer, electrodes disposed on the substrate body layer, and a glass ceramic layer disposed on the substrate body layer so as to cover a portion of the electrodes.

Abstract: An energy-trap type piezoelectric resonator utilizes a fundamental wave of a thickness shear vibration mode and includes resonance electrodes provided on both main surfaces of a substantially rectangular piezoelectric plate so as to face each other with the piezoelectric plate disposed therebetween. An energy trap vibration portion including a portion of the piezoelectric plate where the resonance electrodes overlap each other is asymmetrical with respect to the center in the longitudinal direction of the piezoelectric plate.

Abstract: In a piezoelectric resonator, first and second resonance electrodes are provided on the upper surface and the lower surface of a piezoelectric member, inner electrode layers for leading the first and second resonance electrodes to the upper and lower surfaces are provided and extend to the upper and lower surfaces of the piezoelectric member, and connecting electrodes are provided on the upper and lower surfaces of the piezoelectric member, and are electrically connected to the corresponding resonance electrodes via the inner electrode layers.

Abstract: A piezoelectric oscillator is constructed to prevent deterioration of frequency accuracy caused by external-capacitance variations to maintain a high degree of frequency accuracy. Additionally, an undesired short-circuit is prevented from occurring even when the height of the oscillator is reduced. In this oscillator, on an upper surface of a capacitor substrate only first and second external electrodes connected to a piezoelectric resonator are provided. The piezoelectric resonator connects to the external electrodes. A parallel capacitance section for loading capacitance in parallel to the piezoelectric resonator is connected between the first and second external electrodes. Additionally, load capacitance sections for interposing load capacitances are connected between the first external electrode and a third external electrode and between the second and third external electrodes. The parallel capacitance section and the pair of load capacitance sections are contained in the capacitor substrate.

Abstract: An energy-trapping piezoelectric vibration device generates a thickness shear mode and includes an elongated piezoelectric element having first and second longitudinally opposed ends, top and bottom surfaces provided between the first and second ends such that the top and bottom surfaces oppose each other, and beveled surfaces disposed at a vicinity of the first and second ends such that the thickness of the piezoelectric element gradually decreases towards the first and second ends, respectively. First and second vibration electrodes are disposed on the top surface and the bottom surface of the piezoelectric element, respectively. The first and second vibration electrodes are located at an approximate middle portion of the piezoelectric element so as to oppose each other with the piezoelectric element disposed therebetween, to define opposing portions which constitute a vibrator.

Abstract: A piezoelectric resonator adapted to generate a third harmonic wave of a thickness extensional vibration mode in which the fundamental wave is lead out of the vibrating portion and suppressed effectively. The piezoelectric resonator includes a vibrating portion with vibration electrodes opposing each other in the middle of a piezoelectric plate, lead-out electrodes electrically connected to the vibration electrodes, and a floating electrode disposed along the short side edge on at least one major surface of the piezoelectric plate or in the vicinity of the edge.

Abstract: An electronic component includes an electronic component element having a substantially rectangular plate disposed between upper and lower case substrates in the form of substantially rectangular plates such that the upper and lower case substrates and the electronic component element are stacked and define an integral unit. Assuming that the length of the shorter sides and the length of the longer sides of the electronic component element are a0 and b0, respectively, and that the length of the shorter sides and the length of the longer sides of the lower case substrate 3 are a1 and b1, respectively, the relationships a0<a1 and b0<b1 are satisfied.

Abstract: An energy-trap type piezoelectric resonator utilizes a fundamental wave of a thickness shear vibration mode and includes resonance electrodes provided on both main surfaces of a substantially rectangular piezoelectric plate so as to face each other with the piezoelectric plate disposed therebetween. An energy trap vibration portion including a portion of the piezoelectric plate where the resonance electrodes overlap each other is asymmetrical with respect to the center in the longitudinal direction of the piezoelectric plate.

Abstract: A surface mounting structure is arranged to minimize a height dimension of an electronic component. A surface mount type electronic component is provided on the surface mounting structure. The surface mount type electronic component includes a piezoelectric component element including an insulating substrate, and a piezo-resonator mounted on a mounting surface of the insulating substrate. The piezoelectric component element is mounted on a printed circuit board, with the mounting surface being arranged to face a surface of the printed circuit board. A recess is formed in the printed circuit board and a portion of the piezoelectric component element is accommodated in the recess. A conductive adhesive is located on external connection electrodes provided on the mounting surface and is firmly attached to circuit patterns on the printed circuit board so that the piezoelectric component element is fixed to the printed circuit board.

Abstract: A substrate of a case for packaging an electronic component includes a conductive cap bonded to a substrate to cover the electronic component and to tightly seal an enclosed space. The substrate has a substrate body layer, electrodes disposed on the substrate body layer, and a glass ceramic layer disposed on the substrate body layer so as to cover a portion of the electrodes.

Abstract: A capacitor-included, chip-type piezoelectric resonator allows minute and highly precise adjustment of electrostatic capacitance and the resonance frequency after production of the piezoelectric resonator by laminating a piezoelectric element and dielectric substrates. The resonator includes a piezoelectric substrate laminated with dielectric substrates and external electrodes disposed on the laminate body. A plurality of external electrodes are arranged to extend from the outer major surface of the first dielectric substrate to the outer major surface of the second dielectric substrate along first and second side surfaces disposed opposite to each other. On the outer major surface of the second dielectric substrate, at least one external electrode is divided into first and second electrode portions.

Abstract: A piezoelectric resonator includes two sealing substrates, a seal portion, and an energy-trap type piezoelectric resonance element which is adapted to vibrate in a third harmonic of thickness extensional vibration. The piezoelectric resonance element includes a piezoelectric substrate and a pair of excitation electrodes, which are disposed on opposite major surfaces of the piezoelectric substrate. A portion of the piezoelectric substrate sandwiched by the excitation electrodes defines a vibrating portion. The sealing substrates each have a cavity formed therein and are attached onto the corresponding major surfaces of the piezoelectric substrate such that the cavities define a space for vibration. The seal portion is formed around the vibration space so as to damp leaking vibration. The vibrating portion is arranged such that the approximate center thereof is spaced from the approximate center of the vibration space as viewed along the major surfaces of the piezoelectric resonance element.