Patents by Inventor Ryuichi Goto

Ryuichi Goto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LUBRICATING OIL FOR ROLLING AND ROLLING METHOD
    Publication number: 20140144197
    Abstract: The present invention provides a lubricating oil for rolling, which contains a mineral oil and/or a synthetic oil as the main component and has a friction coefficient of 0.2 or more, and a rolling method using the lubricating oil for rolling.
    Type: Application
    Filed: July 25, 2012
    Publication date: May 29, 2014
    Applicants: Nissei Co., Ltd., IDEMITSU KOSAN CO., LTD.
    Inventors: Nobuhide Tanino, Akihiro Shishikura, Toshinaka Shinbutsu, Shuichi Amano, Shoichi Usunami, Shigeru Nagaki, Ryuichi Goto
  • Method for manufacturing semiconductor apparatus and mold assembly for the same
    Patent number: 7998763
    Abstract: A method for manufacturing a semiconductor apparatus which does not hamper the miniaturization of products and can simplify the manufacturing process without the optical performance deteriorating is described. Furthermore, a mold assembly for use in molding a semiconductor apparatus can be provided. A substrate can be set within a lower mold, wherein a plurality of optical semiconductor elements are mounted on the substrate at predetermined intervals. Primary transfer molding using the lower mold and a primary upper mold can be carried out to form a plurality of frame bodies so as to surround the respective optical semiconductor elements. While the substrate is set on the lower mold, secondary transfer molding using the lower mold and the secondary upper mold can be carried out to form the light-transmitting portions so as to cover the optical semiconductor elements and the frame bodies on the substrate.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: August 16, 2011
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Kazuyuki Iwasaki, Ryuichi Goto, Shogo Sakuma
  • METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND MOLD ASSEMBLY FOR THE SAME
    Publication number: 20100124794
    Abstract: A method for manufacturing a semiconductor apparatus which does not hamper the miniaturization of products and can simplify the manufacturing process without the optical performance deteriorating is described. Furthermore, a mold assembly for use in molding a semiconductor apparatus can be provided. A substrate can be set within a lower mold, wherein a plurality of optical semiconductor elements are mounted on the substrate at predetermined intervals. Primary transfer molding using the lower mold and a primary upper mold can be carried out to form a plurality of frame bodies so as to surround the respective optical semiconductor elements. While the substrate is set on the lower mold, secondary transfer molding using the lower mold and the secondary upper mold can be carried out to form the light-transmitting portions so as to cover the optical semiconductor elements and the frame bodies on the substrate.
    Type: Application
    Filed: November 17, 2009
    Publication date: May 20, 2010
    Inventors: Kazuyuki Iwasaki, Ryuichi Goto, Shogo Sakuma