Abstract: A discharge apparatus 1 comprises a feeder part 41 which is provided on a flow path of a discharge material from a supply part 10 to a nozzle 50 and feeds the discharge material in the flow path at a predetermined flow rate from the supply part 10 toward the nozzle 50 and a plurality of pressurizers 31, 32 provided in parallel to each other on the flow path and each having a function of temporarily storing the discharge material in a storage space and a function of pressurizing the discharge material stored in the storage space and feeding the discharge material under pressure to the feeder part 41. The plurality of pressurizers 31, 32 operate complementarily manner, thereby a constant pressure is applied to the discharge material fed to the feeder part 41.

Abstract: A discharge apparatus 1 comprises a feeder part 41 which is provided on a flow path of a discharge material from a supply part 10 to a nozzle 50 and feeds the discharge material in the flow path at a predetermined flow rate from the supply part 10 toward the nozzle 50 and a plurality of pressurizers 31, 32 provided in parallel to each other on the flow path and each having a function of temporarily storing the discharge material in a storage space and a function of pressurizing the discharge material stored in the storage space and feeding the discharge material under pressure to the feeder part 41. The plurality of pressurizers 31, 32 operate complementarily manner, thereby a constant pressure is applied to the discharge material fed to the feeder part 41.

Abstract: A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally horizontally holding a generally round substrate (W) to be treated; a cathode ring (80) provided in the substrate holding mechanism and having substantially the same inner diameter as the plating vessel for sealing a peripheral edge portion of a lower surface of the substrate, the cathode ring having a cathode (83) to be brought into contact with the substrate held by the substrate holding mechanism; and a rotative driving mechanism (45) for rotating the substrate held by the substrate holding mechanism together with the cathode ring; wherein the plating vessel has an upper edge portion complementary in configuration to a portion of the cathode ring opposed to the plating vessel so that the lower surface of the substrate held by the substrate holding mechanism can approach the plating vessel so as to be substantiall

Abstract: A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally horizontally holding a generally round substrate (W) to be treated; a cathode ring (80) provided in the substrate holding mechanism and having substantially the same inner diameter as the plating vessel for sealing a peripheral edge portion of a lower surface of the substrate, the cathode ring having a cathode (83) to be brought into contact with the substrate held by the substrate holding mechanism; and a rotative driving mechanism (45) for rotating the substrate held by the substrate holding mechanism together with the cathode ring; wherein the plating vessel has an upper edge portion complementary in configuration to a portion of the cathode ring opposed to the plating vessel so that the lower surface of the substrate held by the substrate holding mechanism can approach the plating vessel so as to be substantiall

Abstract: A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally horizontally holding a generally round substrate (W) to be treated; a cathode ring (80) provided in the substrate holding mechanism and having substantially the same inner diameter as the plating vessel for sealing a peripheral edge portion of a lower surface of the substrate, the cathode ring having a cathode (83) to be brought into contact with the substrate held by the substrate holding mechanism; and a rotative driving mechanism (45) for rotating the substrate held by the substrate holding mechanism together with the cathode ring; wherein the plating vessel has an upper edge portion complementary in configuration to a portion of the cathode ring opposed to the plating vessel so that the lower surface of the substrate held by the substrate holding mechanism can approach the plating vessel so as to be substantiall

Abstract: A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally horizontally holding a generally round substrate (W) to be treated; a cathode ring (80) provided in the substrate holding mechanism and having substantially the same inner diameter as the plating vessel for sealing a peripheral edge portion of a lower surface of the substrate, the cathode ring having a cathode (83) to be brought into contact with the substrate held by the substrate holding mechanism; and a rotative driving mechanism (45) for rotating the substrate held by the substrate holding mechanism together with the cathode ring; wherein the plating vessel has an upper edge portion complementary in configuration to a portion of the cathode ring opposed to the plating vessel so that the lower surface of the substrate held by the substrate holding mechanism can approach the plating vessel so as to be substantiall

Abstract: A substrate transfer apparatus provided with a first substrate transfer mechanism having a first substrate holding hand which is movable while holding a substrate; and a second substrate transfer mechanism having a second substrate holding hand for receiving and transferring a substrate directly from and to the first substrate holding hand. The apparatus has a positioning mechanism disposed, in a moving passage of a substrate held by the first substrate holding hand, independently from the first substrate transfer mechanism, and having a positioning contact portion for regulating the movement of a substrate such that the substrate is positioned at a predetermined position on the first substrate holding hand.

Abstract: A device for electrically exciting tissue in the uveal and periuveal areas of the eye includes a frame similar to an eyeglass frame in shape and construction. Two flat, disk-shaped electrodes are attached to the frame. When the frame is placed on the head of the patient, the electrodes are positioned adjacent the orbits of the patient's eyes. A voltage source and electronic circuitry is provided to establish a voltage differential between the electrodes thereby allowing electrical currents to flow from one electrode to the other, stimulating the tissue and other cells in the uveal and periuveal areas of the eyes. Alternatively, the patient's body can be isolated from ground and the voltage source used to place a negative charge on each electrode to thereby create beneficial negative ions in the uveal and periuveal areas of each eye.

Abstract: A substrate transfer apparatus provided with a first substrate transfer mechanism having a first substrate holding hand which is movable while holding a substrate; and a second substrate transfer mechanism having a second substrate holding hand for receiving and transferring a substrate directly from and to the first substrate holding hand. The apparatus has a positioning mechanism disposed, in a moving passage of a substrate held by the first substrate holding hand, independently from the first substrate transfer mechanism, and having a positioning contact portion for regulating the movement of a substrate such that the substrate is positioned at a predetermined position on the first substrate holding hand.