Abstract: Thermoplastic resin compositions are described in which amine salts of anthraquinone dyes and monoazo complex dyes are added. These compositions show superior performance in laser welding applications.

Abstract: A polyamide composition for molded products having thin-wall parts and for connectors for use in automobiles, containing:

Abstract: Thermoplastic resin compositions suitable for laser welding are disclosed, which include a mixture of neutral anthraquinone blue dye with other red dye to absorb visible light with wavelength less than 700 nm and transmit a laser beam with wavelength at 800 nm to 1200 nm and to enhance weldability.

Abstract: Thermoplastic resin compositions are described in which amine salts of anthraquinone dyes and monoazo complex dyes are added. These compositions show superior performance in laser welding applications.

Abstract: Thermoplatic resin compositions suitable for laser welding are discribed in which black colorants are added. These colorants constitute amine salt of anthraquinone dyes. Additional dyes, coloring agents, and a variety of other materials may be added. These compositions demonstrate outstanding mechanical and chemical properties once laser-welded.

Abstract: Thermoplastic resin compositions suitable for laser welding are disclosed, which include a mixture of neutral anthraquinone dyes and at least one other red dye to absorb and transmit select regions of visible light and to enhance weldability.

Abstract: Novel fabricated resin products are described and having suitability for laser welding applications. These contain a resin part for transmitting black colorant and a resin part for absorbing black colorant.

Abstract: This invention relates to high temperature, semi-crystalline, semi-aromatic nylon copolymers with improved shrinkage and blistering resistance, made from terephthalic acid (TA), hexamethylene diamine (HMD) and another aliphatic dicarboxylic acid as monomers. These polymers display superior % TD (Transverse Direction) annealing shrinkage, superior resistance to blistering when formulated with flame retardant additives and reinforcement under infrared (IR) reflow soldering conditions for electronic conectors, as well as a very good balance of mechanical performance as high temperature nylons.

Abstract: An aromatic polyamide resin composition composed of two types of aromatic polyamide (A) and (B), where (A) is an aromatic polyamide wherein the molar ratio of aromatic polyamide with respect to the monomer components that constitute the polyamide is 0.4 or greater, and (B) is an aromatic polyamide containing an aromatic monomer as the monomer component that constitutes the polyamide and has a recrystallization temperature that is lower than that of the aromatic polyamide (A), where said aromatic polyamide resin composition has a recrystallization temperature that is 10.degree. C. or more lower than the recrystallization temperature of the aromatic polyamide (A).Merit:The aromatic polyamide composition of the present invention has the high heat resistance characteristic of aromatic polyamides, superior dimensional stability with respect to water absorption, and maintenance of physical stability and chemical resistance, while providing improved molding characteristics.

Abstract: The semiaromatic polyamide of the invention comprises 40 to 90% by mol of (A) recurring units derived from terephthalic acid and an aliphatic diamine of 4 to 12 carbon atoms, 0 to 50% by mol of (B) recurring units derived from isophthalic acid and an aliphatic diamine of 4 to 12 carbon atoms, 0 to 60% by mol of (C) recurring units derived from an aliphatic dicarboxylic acid of 4 to 18 carbon atoms and an aliphatic diamine of 4 to 12 carbon atoms and 0 to 50% by mol of (D) recurring units derived from a lactam or an aminocarboxylic acid of 6 to 20 carbon atoms, and has a content of boiling water-soluble components (MO components) of not more than 0.25% by weight. The semiaromatic polyamide has a low content of the MO components, so that mold contamination hardly brought about in the molding process, and also molded articles of good heat resistance can be produced.

Abstract: Polyamide resin compositions which are useful for molding parts with excellent malleability, thoughness, rigidity, and high heat deformation temperatures are prepared from 10 to 89% by weight of a polyamide resin, 1 to 30% by weight of at least one type of elastomer selected from among elastomers composed of ethylene/propylene/dienes, elastomers composed of ethylene/unsaturated carboxylic acid unsaturated carboxylic acid esters, and elastomers obtained by graft-modifying these elastomers, and from 10 to 60% by weight of a copolymer of ethylene and cyclic olefin that is noncrystalline and has a glass transition temperature of from 100.degree. to 190.degree. C.

Abstract: A polyamide resin composition having good molding fluidity, heat and chemical resistance and dimensional stability is provided containing: (A) 30-90 weight percent, based on components (A) and (B), of a polyamide resin containing (i) 10-99 weight percent, based on components (i) and (ii) of an aromatic polyamide containing a carboxylic acid component derived from terephthalic acid or a mixture of terephthalic and isophthalic acid in which the isophthalic acid constitutes 40 mole percent or less of the mixture, and an aliphatic diamine component derived from a mixture of hexamethylene diamine and 2-methylpentamethylene diamine; and (ii) 1-90 weight percent, based on components (i) and (ii), of at least one polyamide selected from the group consisting of polyamides containing repeat units derived from alipathic dicarboxylic acids and alipathic diamines and polyamides containing repeat units derived from aliphatic aminocarboxylic acids; and (B) 10-70 weight percent, based on components (A) and (B), of an inorgan

Abstract: A cutting die is produced by a process of forming resist patterns corresponding to the shapes of low cutting edges and resist patterns corresponding to the shapes of high cutting edges on a metal plate and conducting an etching treatment on the metal plate, wherein the height of each of the cutting edges is varied by varying the width of the relevant resist pattern, varying the timing of removing the relevant resist pattern and applying or not applying sealing treatment thereto. This process enables easy production of a cutting die provided either with low cutting edges and high cutting edges or with embossing parts and high cutting edges. Further, the use of this cutting die enables simultaneous execution of full cutting and half cutting (or embossing) operations, so that labels, box development base papers and the like can be produced by a single process.