Patents by Inventor Ryuichi Ikezawa

Ryuichi Ikezawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin sealed semiconductor device
    Patent number: 4107727
    Abstract: A semiconductor device is disclosed wherein a semiconductor pellet is attached on a heat sink of a flange, leads are connected to corresponding electrodes of the semiconductor pellet directly or through wires, the semiconductor pellet and portions of the leads are sealed by resin mold on the flange and top outer periphery of the heat sink is formed with a projection to prevent peel-off of the resin mold and cracking of the resin mold which would otherwise occur due to difference between coefficients of thermal expansion of the flange and the resin mold.
    Type: Grant
    Filed: July 26, 1977
    Date of Patent: August 15, 1978
    Assignee: Hitachi, Ltd.
    Inventors: Ryuichi Ikezawa, Atsushi Sasayama, Sakae Kikuchi