Patents by Inventor Ryuichi Kanazawa

Ryuichi Kanazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11228649
    Abstract: There are provided a molded product manufacturing system that can be easily adapted to IoT and an apparatus for taking out a molded product that can promote adaptation of the molded product manufacturing system to IoT. A molded product manufacturing system includes an injection molding machine, an apparatus for taking out a molded product, and one or more peripheral devices arranged around the apparatus to operate together during operation of the apparatus. The apparatus includes a communication unit operable to transmit internal data to an external server via a communication network. The communication unit of the apparatus transmits external data, which is output from the one or more peripheral devices, to external servers together with information on a die.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: January 18, 2022
    Assignee: YUSHIN PRECISION EQUIPMENT CO., LTD.
    Inventors: Mitsuharu Hamahata, Koji Ikeda, Ryuichi Kanazawa
  • Publication number: 20200092377
    Abstract: There are provided a molded product manufacturing system that can be easily adapted to IoT and an apparatus for taking out a molded product that can promote adaptation of the molded product manufacturing system to IoT. A molded product manufacturing system includes an injection molding machine, an apparatus for taking out a molded product, and one or more peripheral devices arranged around the apparatus to operate together during operation of the apparatus. The apparatus includes a communication unit operable to transmit internal data to an external server via a communication network. The communication unit of the apparatus transmits external data, which is output from the one or more peripheral devices, to external servers together with information on a die.
    Type: Application
    Filed: September 11, 2019
    Publication date: March 19, 2020
    Inventors: Mitsuhara Hamahata, Koji Ikeda, Ryuichi Kanazawa