Patents by Inventor Ryuichi Kondou
Ryuichi Kondou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10217557Abstract: One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The three or more magnetic alloy particles have an average particle diameter of 4 ?m or smaller. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.Type: GrantFiled: August 21, 2018Date of Patent: February 26, 2019Assignee: TAIYO YUDEN CO., LTD.Inventors: Takayuki Arai, Ryuichi Kondou, Akiko Yamaguchi, Shinsuke Takeoka, Kazuhiko Oyama, Kenji Otake
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Patent number: 10166749Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.Type: GrantFiled: January 30, 2012Date of Patent: January 1, 2019Assignees: LAN TECHNICAL SERVICE CO., LTD., TADATOMO SUGAInventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto
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Publication number: 20180358164Abstract: One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The three or more magnetic alloy particles have an average particle diameter of 4 ?m or smaller. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.Type: ApplicationFiled: August 21, 2018Publication date: December 13, 2018Inventors: Takayuki ARAI, Ryuichi KONDOU, Akiko YAMAGUCHI, Shinsuke TAKEOKA, Kazuhiko OYAMA, Kenji OTAKE
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Patent number: 10096418Abstract: One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The three or more magnetic alloy particles have an average particle diameter of 4 ?m or smaller. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.Type: GrantFiled: December 21, 2017Date of Patent: October 9, 2018Assignee: TAIYO YUDEN CO., LTD.Inventors: Takayuki Arai, Ryuichi Kondou, Akiko Yamaguchi, Shinsuke Takeoka, Kazuhiko Oyama, Kenji Otake
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Publication number: 20180114627Abstract: One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The three or more magnetic alloy particles have an average particle diameter of 4 ?m or smaller. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.Type: ApplicationFiled: December 21, 2017Publication date: April 26, 2018Inventors: Takayuki ARAI, Ryuichi KONDOU, Akiko YAMAGUCHI, Shinsuke TAKEOKA, Kazuhiko OYAMA, Kenji OTAKE
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Publication number: 20180061551Abstract: There is provided a passive electronic component that achieves proper recognition of a marker portion thereof that indicates a winding start position and a winding direction of a coil conductor as well as a posture and an orientation of the component. The passive electronic component is a laminated type electronic component and has an insulator portion, a terminal electrode electrically connected to a conductor portion provided inside the insulator portion and formed on a surface of the insulator portion, and a marker portion for indicating a winding start position and a winding direction of a conductor or a posture and an orientation of the component. The marker portion is disposed in a recessed portion on the surface of the insulator portion.Type: ApplicationFiled: March 10, 2017Publication date: March 1, 2018Inventors: Ryuichi KONDOU, Satoshi TOKUNAGA, Yukihiro SAIDA
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Patent number: 9892843Abstract: One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer has a thickness of 4 to 19 ?m, and includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.Type: GrantFiled: September 26, 2016Date of Patent: February 13, 2018Assignee: TAIYO YUDEN CO., LTD.Inventors: Takayuki Arai, Ryuichi Kondou, Akiko Yamaguchi, Shinsuke Takeoka, Kazuhiko Oyama, Kenji Otake
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Publication number: 20170140864Abstract: One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer has a thickness of 4 to 19 ?m, and includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.Type: ApplicationFiled: September 26, 2016Publication date: May 18, 2017Inventors: Takayuki ARAI, Ryuichi KONDOU, Akiko YAMAGUCHI, Shinsuke TAKEOKA, Kazuhiko OYAMA, Kenji OTAKE
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Patent number: 9601350Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.Type: GrantFiled: January 30, 2012Date of Patent: March 21, 2017Assignees: BONDTECH CO., LTD., TAIYO YUDEN CO., LTD., LAN TECHNICAL SERVICE CO., LTD.Inventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto
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Patent number: 8853544Abstract: Various aspects of the present invention provide a transfer method for peeling off an MIM structure (comprising lower electrode/dielectric layer/upper electrodes) film formed on a supporting substrate and then transferring onto a transfer substrate with sufficiently uniform and low damage. Various aspects of the present invention also provide a thin film element provided with one or more thin film components which are transferred onto a substrate by using said method.Type: GrantFiled: March 9, 2012Date of Patent: October 7, 2014Assignee: Taiyo Yuden Co., Ltd.Inventors: Ryuichi Kondou, Kenichi Ota
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Publication number: 20140048805Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.Type: ApplicationFiled: January 30, 2012Publication date: February 20, 2014Applicants: LAN TECHNICAL SERVICE CO., LTD., TAIYO YUDEN CO., LTD., BONDTECH CO., LTD.Inventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou
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Publication number: 20140037945Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.Type: ApplicationFiled: January 30, 2012Publication date: February 6, 2014Applicants: LAN TECHNICAL SERVICE CO., LTD., TAIYO YUDEN CO., LTD., BONDTECH CO., LTD.Inventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto
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Publication number: 20120228008Abstract: Various aspects of the present invention provide a transfer method for peeling off an MIM structure (comprising lower electrode/dielectric layer/upper electrodes) film formed on a supporting substrate and then transferring onto a transfer substrate with sufficiently uniform and low damage. Various aspects of the present invention also provide a thin film element provided with one or more thin film components which are transferred onto a substrate by using said method.Type: ApplicationFiled: March 9, 2012Publication date: September 13, 2012Applicant: TAIYO YUDEN CO., LTDInventors: Ryuichi KONDOU, Kenichi Ota
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Patent number: 7847469Abstract: A micro-cantilever of a simple structure and capable of obtaining a larger displacement at a low voltage including a plate-like piezoelectric substrate having electrode films as an upper electrode and a lower electrode formed on both surfaces thereof, a plate-like resilient member in close contact with the piezoelectric substrate on the side of the lower electrode and a support for supporting a driving member in a cantilever manner, in which a thin-walled portion is formed to the vicinity of a base portion of the driving member supported by the support.Type: GrantFiled: January 22, 2008Date of Patent: December 7, 2010Assignee: Taiyo Yuden Co., Ltd.Inventors: Kentaro Nakamura, Ryuichi Kondou
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Publication number: 20090026892Abstract: A micro-cantilever of a simple structure and capable of obtaining a larger displacement at a low voltage including a plate-like piezoelectric substrate having electrode films as an upper electrode and a lower electrode formed on both surfaces thereof, a plate-like resilient member in close contact with the piezoelectric substrate on the side of the lower electrode and a support for supporting a driving member in a cantilever manner, in which a thin-walled portion is formed to the vicinity of a base portion of the driving member supported by the support.Type: ApplicationFiled: January 22, 2008Publication date: January 29, 2009Applicant: Taiyo Yuden Co., Ltd.Inventors: Kentaro Nakamura, Ryuichi Kondou