Patents by Inventor Ryuichi Kondou

Ryuichi Kondou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10217557
    Abstract: One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The three or more magnetic alloy particles have an average particle diameter of 4 ?m or smaller. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: February 26, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takayuki Arai, Ryuichi Kondou, Akiko Yamaguchi, Shinsuke Takeoka, Kazuhiko Oyama, Kenji Otake
  • Patent number: 10166749
    Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: January 1, 2019
    Assignees: LAN TECHNICAL SERVICE CO., LTD., TADATOMO SUGA
    Inventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto
  • Publication number: 20180358164
    Abstract: One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The three or more magnetic alloy particles have an average particle diameter of 4 ?m or smaller. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.
    Type: Application
    Filed: August 21, 2018
    Publication date: December 13, 2018
    Inventors: Takayuki ARAI, Ryuichi KONDOU, Akiko YAMAGUCHI, Shinsuke TAKEOKA, Kazuhiko OYAMA, Kenji OTAKE
  • Patent number: 10096418
    Abstract: One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The three or more magnetic alloy particles have an average particle diameter of 4 ?m or smaller. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: October 9, 2018
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takayuki Arai, Ryuichi Kondou, Akiko Yamaguchi, Shinsuke Takeoka, Kazuhiko Oyama, Kenji Otake
  • Publication number: 20180114627
    Abstract: One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The three or more magnetic alloy particles have an average particle diameter of 4 ?m or smaller. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.
    Type: Application
    Filed: December 21, 2017
    Publication date: April 26, 2018
    Inventors: Takayuki ARAI, Ryuichi KONDOU, Akiko YAMAGUCHI, Shinsuke TAKEOKA, Kazuhiko OYAMA, Kenji OTAKE
  • Publication number: 20180061551
    Abstract: There is provided a passive electronic component that achieves proper recognition of a marker portion thereof that indicates a winding start position and a winding direction of a coil conductor as well as a posture and an orientation of the component. The passive electronic component is a laminated type electronic component and has an insulator portion, a terminal electrode electrically connected to a conductor portion provided inside the insulator portion and formed on a surface of the insulator portion, and a marker portion for indicating a winding start position and a winding direction of a conductor or a posture and an orientation of the component. The marker portion is disposed in a recessed portion on the surface of the insulator portion.
    Type: Application
    Filed: March 10, 2017
    Publication date: March 1, 2018
    Inventors: Ryuichi KONDOU, Satoshi TOKUNAGA, Yukihiro SAIDA
  • Patent number: 9892843
    Abstract: One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer has a thickness of 4 to 19 ?m, and includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: February 13, 2018
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takayuki Arai, Ryuichi Kondou, Akiko Yamaguchi, Shinsuke Takeoka, Kazuhiko Oyama, Kenji Otake
  • Publication number: 20170140864
    Abstract: One object is to provide a laminated inductor having a reduced thickness without reduction in the magnetic characteristic and the insulation quality. The laminated inductor includes a first magnetic layer, an internal conductor, second magnetic layers, third magnetic layers, and a pair of external electrodes. The first magnetic layer has a thickness of 4 to 19 ?m, and includes three or more magnetic alloy particles arranged in the thickness direction and an oxide film binding the magnetic alloy particles together and containing Cr. The internal conductor includes a plurality of conductive patterned portions electrically connected to each other via the first magnetic layer. The second magnetic layers are composed of magnetic alloy particles and disposed around the conductive patterned portions. The third magnetic layers are composed of magnetic alloy particles and disposed so as to be opposed to each other in thickness direction.
    Type: Application
    Filed: September 26, 2016
    Publication date: May 18, 2017
    Inventors: Takayuki ARAI, Ryuichi KONDOU, Akiko YAMAGUCHI, Shinsuke TAKEOKA, Kazuhiko OYAMA, Kenji OTAKE
  • Patent number: 9601350
    Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: March 21, 2017
    Assignees: BONDTECH CO., LTD., TAIYO YUDEN CO., LTD., LAN TECHNICAL SERVICE CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto
  • Patent number: 8853544
    Abstract: Various aspects of the present invention provide a transfer method for peeling off an MIM structure (comprising lower electrode/dielectric layer/upper electrodes) film formed on a supporting substrate and then transferring onto a transfer substrate with sufficiently uniform and low damage. Various aspects of the present invention also provide a thin film element provided with one or more thin film components which are transferred onto a substrate by using said method.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: October 7, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Ryuichi Kondou, Kenichi Ota
  • Publication number: 20140048805
    Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
    Type: Application
    Filed: January 30, 2012
    Publication date: February 20, 2014
    Applicants: LAN TECHNICAL SERVICE CO., LTD., TAIYO YUDEN CO., LTD., BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou
  • Publication number: 20140037945
    Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
    Type: Application
    Filed: January 30, 2012
    Publication date: February 6, 2014
    Applicants: LAN TECHNICAL SERVICE CO., LTD., TAIYO YUDEN CO., LTD., BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto
  • Publication number: 20120228008
    Abstract: Various aspects of the present invention provide a transfer method for peeling off an MIM structure (comprising lower electrode/dielectric layer/upper electrodes) film formed on a supporting substrate and then transferring onto a transfer substrate with sufficiently uniform and low damage. Various aspects of the present invention also provide a thin film element provided with one or more thin film components which are transferred onto a substrate by using said method.
    Type: Application
    Filed: March 9, 2012
    Publication date: September 13, 2012
    Applicant: TAIYO YUDEN CO., LTD
    Inventors: Ryuichi KONDOU, Kenichi Ota
  • Patent number: 7847469
    Abstract: A micro-cantilever of a simple structure and capable of obtaining a larger displacement at a low voltage including a plate-like piezoelectric substrate having electrode films as an upper electrode and a lower electrode formed on both surfaces thereof, a plate-like resilient member in close contact with the piezoelectric substrate on the side of the lower electrode and a support for supporting a driving member in a cantilever manner, in which a thin-walled portion is formed to the vicinity of a base portion of the driving member supported by the support.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: December 7, 2010
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Kentaro Nakamura, Ryuichi Kondou
  • Publication number: 20090026892
    Abstract: A micro-cantilever of a simple structure and capable of obtaining a larger displacement at a low voltage including a plate-like piezoelectric substrate having electrode films as an upper electrode and a lower electrode formed on both surfaces thereof, a plate-like resilient member in close contact with the piezoelectric substrate on the side of the lower electrode and a support for supporting a driving member in a cantilever manner, in which a thin-walled portion is formed to the vicinity of a base portion of the driving member supported by the support.
    Type: Application
    Filed: January 22, 2008
    Publication date: January 29, 2009
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Kentaro Nakamura, Ryuichi Kondou