Abstract: An imaging device includes: an imaging sensor 110; a main circuit substrate 120 includes a first ground conductor; an imaging sensor cable 130 that includes a second ground conductor, has the imaging sensor 110 mounted thereon, and is connected to the main circuit substrate 120; a metal plate 150 that is disposed between the main circuit substrate 120 and an area of the imaging sensor cable 130 where the imaging sensor 110 is mounted thereon, and that is electrically connected to the second ground conductor; and a ground connection conductor 190 that electrically connects between the first ground conductor and the metal plate 150. The ground connection conductor 190 is disposed in an area where the imaging sensor 110 and the imaging sensor cable 130 overlap each other or in an area where the imaging sensor 110 and the main circuit substrate 120 overlap each other.

Abstract: An imaging device includes: an imaging sensor 110 configured to capture an optical image of an object and generate image data; a main circuit substrate 120 configured to perform signal processing of the image data generated by the imaging sensor 110; a mounting component 130 configured to mount the imaging sensor 110; a metal plate 150 disposed between the mounting component 130 and the main circuit substrate 120; and an electrically-conductive section 190 configured to electrically connect between a ground conductor of the main circuit substrate 120 and the metal plate 150. The electrically-conductive section 190 is positioned in an area where the metal plate 150 and the imaging sensor 110 overlap each other in the case of a back surface of the metal plate 150 being viewed in a direction orthogonal thereto.

Abstract: An imaging device 100 includes: an imaging element 110; a main circuit substrate 120; a mounting component 130 mounting the imaging element 110; a metal plate 150 disposed between the mounting component 130 and the main circuit substrate 120; a mount 140 supporting the metal plate 150 by connection sections 160 being fixed at at least three fixing points; elastic components 165 urging the connection sections 160 at each fixing point of the mount 140; and an electrically-conductive component 190 electrically connecting between a ground conductor of the main circuit substrate 120 and the metal plate 150. The electrically-conductive component 190 is disposed such that a connection point with the metal plate 150 is positioned in a area formed by the at least three fixing points being sequentially connected in the case of a back surface of the metal plate 150 being viewed in a direction orthogonal thereto.

Abstract: An imaging device to which a support can be attached includes a support attachment unit and a support body unit. The support attachment unit includes a first threaded hole configured to be attached to the support, and an exposure face formed around the entrance of the first threaded hole. The support body unit includes a housing having an opening configured to expose the exposure face and an outer surface formed around the opening, and movably supports the support attachment unit. The support attachment unit is disposed at a first position when the support is not attached, and is disposed at a second position when the support is attached. The exposure face is disposed more to the inside of the housing than the outer surface when the support attachment unit is disposed at the first position.

Abstract: An imaging device to which a support can be attached includes a support attachment unit and a support body unit. The support attachment unit includes a first threaded hole configured to be attached to the support, and an exposure face formed around the entrance of the first threaded hole. The support body unit includes a housing having an opening configured to expose the exposure face and an outer surface formed around the opening, and movably supports the support attachment unit. The support attachment unit is disposed at a first position when the support is not attached, and is disposed at a second position when the support is attached. The exposure face is disposed more to the inside of the housing than the outer surface when the support attachment unit is disposed at the first position.

Abstract: A camera body includes a body mount to which the lens unit can be mounted, a metal main frame supporting the body mount, an imaging element configured to convert an optical image of the subject into image data, an intermediate part disposed along a thermal conduction path formed between the main frame and the imaging element, and a metal heat radiating member connected to the intermediate part.

Abstract: A camera body includes a body mount, an imaging element, an imaging element circuit board, a main circuit board, and a metal heat radiating plate. The body mount allows the lens unit to be mounted. The imaging element is disposed on the opposite side of the body mount from the side where the lens unit is mounted, and converts an optical image of the subject into image data. The imaging element circuit board is electrically connected to the imaging element and controls the imaging element. The main circuit board is disposed on the opposite side of the imaging element from the body mount, and includes a camera controller. The heat radiating plate is disposed between the imaging element and the main circuit board.

Abstract: A camera body includes a body mount to which the lens unit can be mounted, a metal main frame supporting the body mount, an imaging element configured to convert an optical image of the subject into image data, an intermediate part disposed along a thermal conduction path formed between the main frame and the imaging element, and a metal heat radiating member connected to the intermediate part.

Abstract: A camera body includes a body mount, an imaging element, an imaging element circuit board, a main circuit board, and a metal heat radiating plate. The body mount allows the lens unit to be mounted. The imaging element is disposed on the opposite side of the body mount from the side where the lens unit is mounted, and converts an optical image of the subject into image data. The imaging element circuit board is electrically connected to the imaging element and controls the imaging element. The main circuit board is disposed on the opposite side of the imaging element from the body mount, and includes a camera controller. The heat radiating plate is disposed between the imaging element and the main circuit board.