Patents by Inventor Ryuichi Narita

Ryuichi Narita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240310259
    Abstract: A load sensor and load detector for detecting the weight of tiny substances such as viruses or bacteria and includes a resonance generator causing a vibrating unit to resonate, a load sensor, and a voltage detector that detects change in induced electromotive force in a pick-up. The load sensor includes the vibrating unit, pick-up, and a substance adsorbent. The vibrating unit includes a magnetostrictive element capable of resonating. The pick-up generates an induced current using inverse magnetostrictive effect of the magnetostrictive element resulting from the vibrating unit vibrations. The substance adsorbent is provided at the vibrating unit, is composed of an antibody to viruses or bacteria and at least partially covers the vibrating unit. The pick-up is composed of a coil with the vibrating unit arranged inside the coil. The vibrating unit is formed by bonding the magnetostrictive element and a soft magnetic body to each other.
    Type: Application
    Filed: March 4, 2022
    Publication date: September 19, 2024
    Applicants: TOHOKU UNIVERSITY, TOHOKU STEEL CO., LTD.
    Inventors: Fumio NARITA, Kumi INOUE, Hiroki KURITA, Shion OSANA, Siti Masturah BINTI FAKHRUDDIN, Naoto MIYAMOTO, Masahito WATANABE, Daiki CHIBA, Ryuichi ONODERA, Tsuyoki TAYAMA, Takenobu SATO, Takashi EBATA
  • Publication number: 20240261865
    Abstract: A three-dimensional additive manufacturing device, which performs additive manufacturing by irradiating, with a beam, a powder bed laid on a build surface area, includes a projection unit that is configured to project a pattern in which there is a luminance distribution in the build surface area and the luminance distribution changes over time, an imaging unit configured to image the pattern projected onto the build surface area, and a reflective part configured to reflect at least one among a first light beam projected by the projection unit and a second light beam captured by the imaging unit. The projection and imaging units are disposed outside the chamber where the additive manufacturing is performed on the build surface area. The reflective part is accommodated inside the chamber. The first and second light beams pass through one first window portion installed on the chamber.
    Type: Application
    Filed: June 27, 2022
    Publication date: August 8, 2024
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Ryuichi Narita, Takayuki Moritake, Akemi Takano, Toshiya Watanabe
  • Publication number: 20230251128
    Abstract: A laser light profile measuring device of the present disclosure includes a reflection attenuation part reflecting and attenuating at least part of laser light incident from a first direction in a direction different from the first direction to generate measurement target laser light traveling in the first direction, a capture unit placed on one side of the reflection attenuation part in the first direction and which captures the measurement target laser light, a cooling body covering at least part of the reflection attenuation part and the capture unit in a circumferential direction with respect to the first direction, a refrigerant supply unit forcibly feeding a refrigerant toward the cooling body, and a rotation support part supporting the reflection attenuation part, the cooling body, and the refrigerant supply unit to be rotatable around a rotation axis extending in a horizontal direction.
    Type: Application
    Filed: January 4, 2023
    Publication date: August 10, 2023
    Applicants: MITSUBISHI HEAVY INDUSTRIES, LTD., National Institute of Advanced Industrial Science and Technology
    Inventors: Ryuichi Narita, Toshiya Watanabe, Misaki Fukuyama, Takeshi Kaneko, Takayuki Numata
  • Publication number: 20230093386
    Abstract: An object is to improve the quality of a processed composite material without reducing the processing rate. A processing apparatus includes a laser head configured to irradiate a front face of a composite material with a laser beam and a gas supply unit configured to supply an assist gas to an irradiation point irradiated with the laser beam by the laser head. The gas supply unit has a first-level nozzle configured to eject the assist gas to an area at or near the irradiation point and a second nozzle configured to eject the assist gas to an area at or near the irradiation point and arranged above the first-level nozzle. The angle of the direction in which the first-level nozzle ejects the assist gas relative to the front face differs from the angle of the direction in which the second nozzle ejects the assist gas relative to the front face.
    Type: Application
    Filed: July 18, 2022
    Publication date: March 23, 2023
    Inventors: Saneyuki GOYA, Junichiro MIYAGAKI, Jiro YONEDA, Ryuichi NARITA, Hirotoshi TAGATA
  • Patent number: 11590578
    Abstract: An internal defect detection system for a three-dimensional additive manufacturing device which performs additive molding by emitting a laser beam to a powder bed is provided. This system specifies a candidate position of an internal defect on the basis of a change amount of a local temperature measured in an irradiated part of a powder bed irradiated by a laser beam. The system calculates a cooling speed at the candidate position on the basis of a temperature distribution and determines whether an internal defect exists on the basis of the cooling speed.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: February 28, 2023
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Ryuichi Narita, Toshiya Watanabe, Akio Kondou, Masashi Kitamura, Hidetaka Haraguchi, Shuji Tanigawa, Claus Thomy, Henry Koehler
  • Patent number: 11583957
    Abstract: A laser processing method includes a first step of irradiating a surface of a composite material with a laser to form a hole processing groove on the composite material by scanning first paths from an outside corresponding to an inner peripheral surface side of a through hole to be formed to an inside corresponding to a center side of the through hole to be formed, the first paths extending across a width direction of the hole processing groove; and a second step of irradiating and penetrating through the hole processing groove with the laser to form the through hole by scanning second paths from the outside to the inside after the first step, the second paths extending across the width direction of the hole processing groove. The laser used at the first step has a smaller heat input amount per unit time than the laser used at the second step.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: February 21, 2023
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Saneyuki Goya, Ryuichi Narita, Rudolf Weber, Christian Freitag, Ehsan Zahedi
  • Patent number: 11554419
    Abstract: An additive manufacturing method includes: forming a powder bed by supplying a raw material powder; and irradiating the raw material powder that forms the powder bed with a light beam having an intensity distribution of a second or higher order mode or of a top hat shape.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: January 17, 2023
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Ryuichi Narita, Shuji Tanigawa, Yasuyuki Fujiya, Claus Thomy, Dieter Tyralla, Thomas Seefeld
  • Publication number: 20220410319
    Abstract: A laser processing method for cutting a base material, including stacked first and second layers having different thermal expansion coefficients, includes radiating laser light onto a first inter-layer part under prescribed first inter-layer conditions, to cut the first inter-layer part, which extends from a position in the vicinity of a layer boundary inward of the surface of the second layer, through the layer boundary between the second layer and the first layer, to a position in the vicinity of a layer boundary inward of said one surface of the first layer, and radiating the laser light onto a part of the first layer inward from the position in the vicinity of the layer boundary, under first conditions, to cut the first layer, wherein the first inter-layer condition is a condition under which the amount of heat input by the laser light is less than under the first condition.
    Type: Application
    Filed: November 22, 2019
    Publication date: December 29, 2022
    Inventors: Saneyuki GOYA, Akiko INOUE, Ryuichi NARITA, Akihisa OKUDA, Ryota OZAKI, Masahiko SHIMIZU, Hiroki MORI
  • Publication number: 20220395930
    Abstract: In this laser cutting method and laser cutting device with which a base material is cut by irradiating, with laser, a surface of a base material formed of a composite material, an irradiation step for swinging the laser in a tolerance direction crossing the length direction of a cutting line while moving the laser relative to the base material along the length direction of the cutting line for cutting the base material is repeatedly performed on the cutting line, thereby cutting the base material, and in the irradiation step, a swing width in the width direction of the laser is decreased as the depth in the depth direction from the surface of the base material toward the rear surface increases.
    Type: Application
    Filed: November 15, 2019
    Publication date: December 15, 2022
    Inventors: Saneyuki GOYA, Ryuichi NARITA, Akiko INOUE, Hiroki MORI, Ryota OZAKI, Masahiko SHIMIZU
  • Publication number: 20220203480
    Abstract: This laser processing device is provided with a laser radiating unit which forms a processed groove extending in a scanning direction on a workpiece, by subjecting the workpiece to laser processing while scanning the surface of the workpiece, and a nozzle portion which has a plurality of ejection holes arranged side by side in the scanning direction, and which ejects a gas toward the processed groove from each of the ejection holes. With this laser processing device, since a plume is eliminated by ejecting gas into the processed groove by means of the nozzle portion, the formation of a heat affected layer by the plume can be suppressed to an even greater extent.
    Type: Application
    Filed: July 31, 2019
    Publication date: June 30, 2022
    Inventors: Kazuhiro YOSHIDA, Yoshinao KOMATSU, Saneyuki GOYA, Akiko INOUE, Yasuyuki FUJIYA, Ryuichi NARITA, Masahiko SHIMIZU
  • Publication number: 20220168848
    Abstract: A laser machining device includes: a laser irradiation unit that forms a machining groove that has one end opening to an end section of a workpiece and the other end thereof closed, as a result of scanning a workpiece surface from an end section of the workpiece and laser machining the workpiece; and a nozzle unit that sprays a gas across an irradiation zone of the workpiece surface created by the laser irradiation unit. The nozzle unit is configured so as to increase the flowrate of the gas supplied to the irradiation zone, from one end to the other end of the machining groove.
    Type: Application
    Filed: June 28, 2019
    Publication date: June 2, 2022
    Inventors: Kazuhiro YOSHIDA, Yoshinao KOMATSU, Saneyuki GOYA, Akiko INOUE, Yasuyuki FUJIYA, Ryuichi NARITA, Masahiko SHIMIZU, Ryota OZAKI, Yuki KANI
  • Patent number: 11344952
    Abstract: A three-dimensional additive manufacturing device is configured to emit a beam to a powder bed formed by laying a powder on a base plate to harden the powder bed selectively. A sensor is configured to detect the shape or the temperature of a surface of the powder bed or a modeling surface. A defect in laying of the powder or a defect in emission of the beam is corrected based on the detection result, before completion of forming of the next layer.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: May 31, 2022
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Ryuichi Narita, Toshiya Watanabe, Akio Kondou, Hidetaka Haraguchi, Shuji Tanigawa, Masashi Kitamura
  • Publication number: 20210370403
    Abstract: An additive manufacturing method according to at least one embodiment of the disclosure includes the steps of, forming a powder bed by supplying a raw material powder, and irradiating the raw material powder that forms the powder bed with a light beam having intensity distribution of a high-order mode that is the second order and higher order mode or of a top hat shape.
    Type: Application
    Filed: April 8, 2021
    Publication date: December 2, 2021
    Inventors: Ryuichi Narita, Shuji Tanigawa, Yasuyuki Fujiya, Claus Thomy, Dieter Tyralla, Thomas Seefeld
  • Patent number: 11185925
    Abstract: A process abnormality detection system for a three-dimensional additive manufacturing device which performs additive modeling by emitting a beam to a powder bed determines that a laying abnormality of the powder bed is occurring if at least one of a first condition that an average height of the powder bed from a reference position is out of a first predetermined range or a second condition that a height variation of the powder bed is out of a second predetermined range is satisfied, on the basis of a detection result of a shape measurement sensor.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: November 30, 2021
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Ryuichi Narita, Toshiya Watanabe, Akio Kondou, Masashi Kitamura, Hidetaka Haraguchi, Shuji Tanigawa, Claus Thomy, Henry Koehler, Michael Kalms
  • Publication number: 20210331245
    Abstract: A method of monitoring an additive manufacturing process according to at least one embodiment of the present disclosure includes the steps of acquiring information on a temperature of a region upstream of a melt pool in a scanning direction of an energy beam, the melt pool being formed by irradiating a raw material with the energy beam, acquiring a parameter indicating a cooling rate of the region based on the information on the temperature, and determining a formation status based on the parameter.
    Type: Application
    Filed: April 19, 2021
    Publication date: October 28, 2021
    Inventors: Ryuichi NARITA, Shuji TANIGAWA, Yasuyuki FUJIYA, Claus THOMY, Dieter TYRALLA, Thomas SEEFELD
  • Publication number: 20210276132
    Abstract: A laser processing device includes a laser irradiation unit that performs processing on a workpiece by using a laser while scanning a workpiece surface to form a kerf, jet nozzles that respectively form jet flows flowing toward a bottom surface of the kerf on front and rear sides in a scanning direction of the laser, and an intake part that sucks, above injection ports of the jet nozzles, a gas in a region surrounded by the jet flows from the front and rear sides. In a state in which a certain region of the kerf is isolated by the jet flows, the gas is sucked from this region by the intake part. As a result, a suction force by the intake part can reach the bottom surface of the kerf.
    Type: Application
    Filed: January 26, 2021
    Publication date: September 9, 2021
    Inventors: Yoshinao KOMATSU, Kazuhiro YOSHIDA, Saneyuki GOYA, Akiko INOUE, Yasuyuki FUJIYA, Ryuichi NARITA
  • Publication number: 20210162505
    Abstract: A three-dimensional additive manufacturing device emits a beam to a powder bed formed by laying a powder on a base plate to harden the powder bed selectively. A sensor detects the shape or the temperature of a surface of the powder bed or a modeling surface. A defect in laying of the powder or a defect in emission of the beam is corrected on the basis of the detection result, before completion of forming of the next layer.
    Type: Application
    Filed: August 8, 2017
    Publication date: June 3, 2021
    Inventors: Ryuichi NARITA, Toshiya WATANABE, Akio KONDOU, Hidetaka HARAGUCHI, Shuji TANIGAWA, Masashi KITAMURA
  • Publication number: 20210162508
    Abstract: A forming defect detection system for a three-dimensional additive manufacturing device which performs additive molding by emitting a laser beam to a powder bed is provided. This system specifies a candidate position of a forming defect on the basis of a change amount of a local temperature measured in an irradiated part of a powder bed irradiated by a laser beam. The system calculates a cooling speed at the candidate position on the basis of a temperature distribution and determines whether a forming defect exists on the basis of the cooling speed.
    Type: Application
    Filed: August 8, 2017
    Publication date: June 3, 2021
    Inventors: Ryuichi NARITA, Toshiya WATANABE, Akio KONDOU, Masashi KITAMURA, Hidetaka HARAGUCHI, Shuji TANIGAWA, Claus THOMY, Henry KOEHLER
  • Publication number: 20210060706
    Abstract: A laser processing device of the present invention includes a laser radiation unit which is configured to perform laser processing on a workpiece while scanning a work surface from an end portion of the workpiece to form a processing groove of which one end is open at the end portion of the workpiece and the other end is closed; and a nozzle unit which is configured to inject a gas along the surface of the workpiece such that a flow velocity thereof increases from the one end of the processing groove toward the other end.
    Type: Application
    Filed: February 12, 2020
    Publication date: March 4, 2021
    Inventors: Kazuhiro YOSHIDA, Yoshinao KOMATSU, Saneyuki GOYA, Akiko INOUE, Yasuyuki FUJIYA, Ryuichi NARITA
  • Publication number: 20200306889
    Abstract: A laser processing method includes a first step of irradiating a surface of a composite material with laser to form a hole processing groove on the composite material in a manner of scanning paths from an outside corresponding to an inner peripheral surface side of the through hole to be formed to an inside corresponding to a center side of the through hole, the paths being across a width direction of the hole processing groove; and a second step of irradiating and penetrating through the hole processing groove with the laser to form the through hole in a manner of scanning paths from the outside to the inside after the first step, the paths being across the width direction of the hole processing groove. The laser used at the first step has a smaller heat input amount per unit time than the laser used at the second step.
    Type: Application
    Filed: February 7, 2020
    Publication date: October 1, 2020
    Inventors: Saneyuki GOYA, Ryuichi NARITA, Rudolf WEBER, Christian FREITAG, Ehsan ZAHEDI