Patents by Inventor Ryuichi Onoda

Ryuichi Onoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal molding method and apparatus
    Patent number: 7331375
    Abstract: According to the present invention, between the mold-clamping process S1 in which the mold 1 is closed and the injection-pressure increase (solidifying) process S3, the gate-melting process for heating the hot runner 21 to melt the plug (metallic material) of the gate 27, the mold-lubricant coating process for spraying the lubricant onto the wall surface of the cavity 10, and the material-metering process are simultaneously carried out in parallel to each other. Thus, the molding cycle time can be reduced to a great extent.
    Type: Grant
    Filed: July 14, 2005
    Date of Patent: February 19, 2008
    Assignee: Denso Corporation
    Inventors: Hideyuki Suzuki, Koichiro Sato, Ryuichi Onoda
  • Metal molding method and apparatus
    Publication number: 20050247427
    Abstract: According to the present invention, between the mold-clamping process S1 in which the mold 1 is closed and the injection-pressure increase (solidifying) process S3, the gate-melting process for heating the hot runner 21 to melt the plug (metallic material) of the gate 27, the mold-lubricant coating process for spraying the lubricant onto the wall surface of the cavity 10, and the material-metering process are simultaneously carried out in parallel to each other. Thus, the molding cycle time can be reduced to a great extent.
    Type: Application
    Filed: July 14, 2005
    Publication date: November 10, 2005
    Applicant: DENSO Corporation
    Inventors: Hideyuki Suzuki, Koichiro Sato, Ryuichi Onoda
  • Metal molding method and apparatus
    Patent number: 6938669
    Abstract: According to the present invention, between the mold-clamping process S1 in which the mold 1 is closed and the injection-pressure increase (solidifying) process S3, the gate-melting process for heating the hot runner 21 to melt the plug (metallic material) of the gate 27, the mold-lubricant coating process for spraying the lubricant onto the wall surface of the cavity 10, and the material-metering process are simultaneously carried out in parallel to each other. Thus, the molding cycle time can be reduced to a great extent.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: September 6, 2005
    Assignee: DENSO Corporation
    Inventors: Hideyuki Suzuki, Koichiro Sato, Ryuichi Onoda
  • Manufacturing method of multilayer substrate
    Patent number: 6855625
    Abstract: Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: February 15, 2005
    Assignee: Denso Corporation
    Inventors: Koji Kondo, Tetsuaki Kamiya, Toshikazu Harada, Ryuichi Onoda, Yasutaka Kamiya, Gentaro Masuda, Yoshitaro Yazaki, Tomohiro Yokochi
  • Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method
    Patent number: 6667443
    Abstract: Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.
    Type: Grant
    Filed: December 10, 2001
    Date of Patent: December 23, 2003
    Assignee: Denso Corporation
    Inventors: Koji Kondo, Tetsuaki Kamiya, Toshikazu Harada, Ryuichi Onoda, Yasutaka Kamiya, Gentaro Masuda, Yoshitaro Yazaki, Tomohiro Yokochi
  • Manufacturing method of multilayer substrate
    Publication number: 20030209796
    Abstract: Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.
    Type: Application
    Filed: June 11, 2003
    Publication date: November 13, 2003
    Inventors: Koji Kondo, Tetsuaki Kamiya, Toshikazu Harada, Ryuichi Onoda, Yasutaka Kamiya, Gentaro Masuda, Yoshitaro Yazaki, Tomohiro Yokochi
  • Metal molding method and apparatus
    Publication number: 20030041998
    Abstract: According to the present invention, between the mold-clamping process S1 in which the mold 1 is closed and the injection-pressure increase (solidifying) process S3, the gate-melting process for heating the hot runner 21 to melt the plug (metallic material) of the gate 27, the mold-lubricant coating process for spraying the lubricant onto the wall surface of the cavity 10, and the material-metering process are simultaneously carried out in parallel to each other. Thus, the molding cycle time can be reduced to a great extent.
    Type: Application
    Filed: August 28, 2002
    Publication date: March 6, 2003
    Inventors: Hideyuki Suzuki, Koichiro Sato, Ryuichi Onoda
  • Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method
    Publication number: 20020076903
    Abstract: Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.
    Type: Application
    Filed: December 10, 2001
    Publication date: June 20, 2002
    Inventors: Koji Kondo, Tetsuaki Kamiya, Toshikazu Harada, Ryuichi Onoda, Yasutaka Kamiya, Gentaro Masuda, Yoshitaro Yazaki, Tomohiro Yokochi