Patents by Inventor Ryuichi SAWAGASHIRA

Ryuichi SAWAGASHIRA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having semiconductor module and cooler coupled with bolt
    Patent number: 9704776
    Abstract: The present invention provides a semiconductor device that is reduced in size by changing the structure of a fixing portion used for fixing a semiconductor module to a cooler. Bolts 17 are inserted through first through-holes 4 of external conductive terminals 3, second through-holes 6 formed in a resin frame 5, and third through-holes 10 formed in a top plate 9, and the ends of the bolts 17 are screwed to resin nuts 16. External wiring 25, the external conductive terminals 3, a semiconductor module 1, and a cooler 2 are fastened by the bolts 17, thereby fixing the whole members.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: July 11, 2017
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Ryuichi Sawagashira
  • SEMICONDUCTOR DEVICE
    Publication number: 20160322278
    Abstract: The present invention provides a semiconductor device that is reduced in size by changing the structure of a fixing portion used for fixing a semiconductor module to a cooler. Bolts 17 are inserted through first through-holes 4 of external conductive terminals 3, second through-holes 6 formed in a resin frame 5, and third through-holes 10 formed in a top plate 9, and the ends of the bolts 17 are screwed to resin nuts 16. External wiring 25, the external conductive terminals 3, a semiconductor module 1, and a cooler 2 are fastened by the bolts 17, thereby fixing the whole members.
    Type: Application
    Filed: July 8, 2016
    Publication date: November 3, 2016
    Inventor: Ryuichi SAWAGASHIRA