Abstract: A ceramic electronic device includes: a multilayer chip in which each of internal electrode layers and each of dielectric layers are alternately stacked, wherein the multilayer chip has a first capacity region having a first electrostatic capacity C1 and a first inductance L1 and a second capacity region having a second electrostatic capacity C2 and a second inductance L2, wherein the first electrostatic capacity C1, the first inductance L1, the second electrostatic capacity C2 and the second inductance L2 satisfy (C1·L1)/(C2·L2)<0.5 or 1.9<(C1·L1)/(C2·L2).

Abstract: A ceramic electronic device includes: a multilayer chip in which each of internal electrode layers and each of dielectric layers are alternately stacked, wherein the multilayer chip has a first capacity region having a first electrostatic capacity C1 and a first inductance L1 and a second capacity region having a second electrostatic capacity C2 and a second inductance L2, wherein the first electrostatic capacity C1, the first inductance L1, the second electrostatic capacity C2 and the second inductance L2 satisfy (C1·L1)/(C2·L2)<0.5 or 1.9<(C1·L1)/(C2·L2).

Abstract: A multi-layer ceramic capacitor includes a ceramic body and external electrodes. The ceramic body includes ceramic layers laminated in a first direction, first and second internal electrodes between the ceramic layers, a facing portion in which the internal electrodes face in the first direction, and a cover that covers the facing portion in the first direction. The facing portion includes a first region including at least one element of manganese, a rare-earth element, or magnesium and having a flat distribution of a concentration of the element along the first direction, and a second region disposed between the cover and the first region and having an increasing concentration of the element from the first region toward the cover. The ceramic layers include a capacitance forming layer between the first and second internal electrodes, and a dummy layer between the first or second internal electrodes and across the first and second regions.

Abstract: A multi-layer ceramic capacitor includes a ceramic body and external electrodes. The ceramic body includes ceramic layers laminated in a first direction, first and second internal electrodes between the ceramic layers, a facing portion in which the internal electrodes face in the first direction, and a cover that covers the facing portion in the first direction. The facing portion includes a first region including at least one element of manganese, a rare-earth element, or magnesium and having a flat distribution of a concentration of the element along the first direction, and a second region disposed between the cover and the first region and having an increasing concentration of the element from the first region toward the cover. The ceramic layers include a capacitance forming layer between the first and second internal electrodes, and a dummy layer between the first or second internal electrodes and across the first and second regions.

Abstract: A ceramic electronic device includes: a multilayer chip in which each of internal electrode layers and each of dielectric layers are alternately stacked, wherein the multilayer chip has a first capacity region having a first electrostatic capacity C1 and a first inductance L1 and a second capacity region having a second electrostatic capacity C2 and a second inductance L2, wherein the first electrostatic capacity C1, the first inductance L1, the second electrostatic capacity C2 and the second inductance L2 satisfy (C1·L1)/(C2·L2)<0.5 or 1.9<(C1·L1)/(C2·L2).

Abstract: A multilayer ceramic capacitor highly useful in suppressing noise in a mounted state includes a capacitor body of a multilayer ceramic capacitor. The capacitor body integrally has: a capacitive part constituted by multiple internal electrode layers stacked in the height direction via dielectric layers; a top protective part made of a dielectric and positioned on the top side of the top internal electrode layer among the multiple internal electrode layers; and a bottom protective part made of a dielectric and positioned on the bottom side of the bottom internal electrode layer among the multiple internal electrode layers; wherein the thickness Tc of a bottom protective part is greater than the thickness Tb of a top protective part so that the capacitive part is disproportionately positioned in the upper side of the capacitor body in its height direction.