Abstract: The present invention discloses a composition comprising at least one or more stereoisomers of a compound represented by the following Formula (1), wherein, in a gas chromatogram obtained by analyzing the composition by gas chromatography, the ratio of the area of the maximum peak with respect to the total area of peaks derived from the stereoisomers is 90% or more. The present invention also discloses: a curable composition comprising the above described composition, and one selected from the group consisting of a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator; as well as a cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. (In the Formula (1), R1 to R18 are each independently selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group.).

Abstract: The present invention discloses a curable composition comprising: an epoxy compound represented by the following Formula (1); and one selected from the group consisting of: a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator as well as the cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. (In the Formula (1), A represents CR17R18; B represents CR19R20; R1 to R20 each independently represents a substituent selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group; and n represents 0 or 1, with the proviso that when n is 0, m represents 1, and when n is 1, m represents 0.

Abstract: The present invention discloses a monoepoxy compound represented by the following Formula (1), a curable composition containing the same, a cured product therefrom, a method of producing the monoepoxy compound, and a reactive diluent containing the monoepoxy compound. The monoepoxy compound represented by the Formula (1) is useful in that it is capable of reducing the viscosity of a curable composition containing the monoepoxy compound, while preventing a reduction in the heat resistance of the curable composition as well as a reduction in the weight of the curable composition upon curing. (In the Formula (1), R1 to R6 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group.

Abstract: The present invention discloses a curable composition comprising: an epoxy compound represented by the following Formula (1); and one selected from the group consisting of: a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator as well as the cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. (In the Formula (1), A represents CR17R18; B represents CR19R20; R1 to R20 each independently represents a substituent selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group; and n represents 0 or 1, with the proviso that when n is 0, m represents 1, and when n is 1, m represents 0.

Abstract: A thermoplastic elastomer composition having at least one elastomer component selected from the group consisting of elastomeric polymers (A) each of which has a side chain (a) containing a hydrogen-bond cross-linkable moiety having a carbonyl-containing group and/or a nitrogen-containing heterocycle and has a glass-transition point of 25° C. or below, and elastomeric polymers (B) each of which contains a hydrogen-bond cross-linkable moiety and a covalent-bond cross-linking moiety in a side chain and has a glass-transition point of 25° C. or below; and a clay, wherein an amount of the clay contained is 20 parts by mass or less relative to 100 parts by mass of the elastomer component.

Abstract: The present invention discloses a composition comprising at least one or more stereoisomers of a compound represented by the following Formula (1), wherein, in a gas chromatogram obtained by analyzing the composition by gas chromatography, the ratio of the area of the maximum peak with respect to the total area of peaks derived from the stereoisomers is 90% or more. The present invention also discloses: a curable composition comprising the above described composition, and one selected from the group consisting of a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator; as well as a cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. (In the Formula (1), R1 to R18 are each independently selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group.

Abstract: The present invention discloses a curable composition comprising: an epoxy compound represented by the following Formula (1); and one selected from the group consisting of: a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator as well as the cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. (In the Formula (1), A represents CR17R18; B represents CR19R20; R1 to R20 each independently represents a substituent selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group; and n represents 0 or 1, with the proviso that when n is 0, m represents 1, and when n is 1, m represents 0.

Abstract: A tetracarboxylic dianhydride, which is a compound represented by the following general formula (1): [in the formula (1), A represents a divalent aromatic group in which the number of carbon atoms forming an aromatic ring is 6 to 30 or the like, and multiple R1s each independently represent a hydrogen atom or the like].

Abstract: The present invention discloses a composition comprising at least one or more stereoisomers of a compound represented by the following Formula (1), wherein, in a gas chromatogram obtained by analyzing the composition by gas chromatography, the ratio of the area of the maximum peak with respect to the total area of peaks derived from the stereoisomers is 60% or more; and wherein the maximum peak is present within the range of retention time of from 27.6 to 28.0 minutes. The present invention also discloses: a curable composition comprising the above described composition, and one selected from the group consisting of a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator; as well as a cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance.

Abstract: The present invention discloses a composition comprising at least one or more stereoisomers of a compound represented by the following Formula (1), wherein, in a gas chromatogram obtained by analyzing the composition by gas chromatography, the ratio of the area of the maximum peak with respect to the total area of peaks derived from the stereoisomers is 60% or more; and wherein the maximum peak is present within the range of retention time of from 27.6 to 28.0 minutes. The present invention also discloses: a curable composition comprising the above described composition, and one selected from the group consisting of a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator; as well as a cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance.

Abstract: A choke coil for a brake control device, includes: lead wires; a magnetic core; and a case housing the core. The case includes: a cylindrical core part around which the lead wires are wound; and a base part provided on an outer peripheral surface of the core part. End portions of the lead wires extend laterally from the core part, and holding portions configured to hold the end portions of the lead wires are formed on an outer surface of the base part on the opposite side to the core part side.

Abstract: There are provided a benzoxazine compound-containing curable resin composition and a cured product obtained from the curable resin composition. The cured product can have a high strength and a high heat resistance, and therefore can be used under a severer condition in the fields of adhesive, sealant, paint, matrix resin for composite material, and the like. The curable resin composition contains (A) a polyfunctional benzoxazine compound having at least two benzoxazine rings and (B) a polyfunctional epoxy compound having at least one norbornane structure and at least two epoxy groups. The polyfunctional benzoxazine compound of (A) is a first benzoxazine compound or a second benzoxazine compound. The first benzoxazine compound is a compound having at least two benzoxazine ring structures represented by the following formula (1), and the second benzoxazine compound is represented by the following formula (2).

Abstract: The present invention discloses a monoepoxy compound represented by the following Formula (1), a curable composition containing the same, a cured product therefrom, a method of producing the monoepoxy compound, and a reactive diluent containing the monoepoxy compound. The monoepoxy compound represented by the Formula (1) is useful in that it is capable of reducing the viscosity of a curable composition containing the monoepoxy compound, while preventing a reduction in the heat resistance of the curable composition as well as a reduction in the weight of the curable composition upon curing. (In the Formula (1), R1 to R6 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group.

Abstract: A tetracarboxylic dianhydride, which is a compound represented by the following general formula (1): [in the formula (1), multiple R1s each independently represent hydrogen atom or the like, and R2 and R3 each independently represent a hydrogen atom or the like].

Abstract: A thermoplastic elastomer composition having at least one elastomer component selected from the group consisting of elastomeric polymers (A) each of which has a side chain (a) containing a hydrogen-bond cross-linkable moiety having a carbonyl-containing group and/or a nitrogen-containing heterocycle and has a glass-transition point of 25° C. or below, and elastomeric polymers (B) each of which contains a hydrogen-bond cross-linkable moiety and a covalent-bond cross-linking moiety in a side chain and has a glass-transition point of 25° C. or below; and a clay, wherein an amount of the clay contained is 20 parts by mass or less relative to 100 parts by mass of the elastomer component.

Abstract: The present invention provides a poly(meth)acrylate-based viscosity index improver comprising a core portion and three or more arm portions, wherein each of the arm portions consists of a polymer chain comprising a structural unit represented by the following formula (1), and one end of the polymer chain is bonded to the core portion, and wherein a weight-average molecular weight Mw is 100000 or more, and a ratio of the weight-average molecular weight Mw to a number average molecular weight Mn, Mw/Mn, is 1.6 or less. [R1 represents hydrogen or a methyl group, and R2 represents a C1 to C36 alkyl group.

Abstract: A transparent electro-conductive laminate comprising: a substrate film made of a polyimide; and a thin film made of an electro-conductive material and stacked on the substrate film, wherein the polyimide is a polyimide containing at least one repeating unit represented by the following general formula (1): [in the formula (1), R1, R2, and R3 each independently represent one selected from the group consisting of a hydrogen atom, alkyl groups having 1 to 10 carbon atoms, and a fluorine atom, R4 represents an aryl group having 6 to 40 carbon atoms, and n represents an integer of 0 to 12], having a glass transition temperature of 350° C. to 450° C., and having a linear expansion coefficient of 30 ppm/° C. or less, the linear expansion coefficient being determined by measuring change in length under a nitrogen atmosphere and under a condition of a rate of temperature rise of 5° C./minute in a temperature range from 50° C. to 200° C.

Abstract: A tetracarboxylic dianhydride, which is a compound represented by the following general formula (1): [in the formula (1), A represents a divalent aromatic group in which the number of carbon atoms forming an aromatic ring is 6 to 30 or the like, and multiple R1s each independently represent a hydrogen atom or the like].

Abstract: The present invention provides an imide compound represented by the following general formula (1). The imide compound of the present invention, particularly when used as a thickening agent for grease, is excellent in durability at high temperatures. [wherein X represents a tetravalent residue obtained by removing four carboxylic groups from an aromatic tetracarboxylic acid, Y represents a divalent residue obtained by removing two amino groups from an aliphatic diamine or an aromatic diamine, and R represents a residue obtained by removing an amino group from an aliphatic monoamine, an alicyclic monoamine, or an aromatic monoamine.

Abstract: A resin composition prepared by blending an epoxy compound represented by the following formula (1), an acid anhydride, and a curing accelerator, wherein the epoxy compound is purified in such a way that, in a chromatogram obtained by gas chromatographic analysis, a ratio of a peak area B of peaks derived from a heavier molecular mass portion having longer retention times than the epoxy compound to a peak area A of peak(s) derived from the epoxy compound B/A is 2.0×10?3 or less. [In the formula, R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, and R12 each independently represent a hydrogen atom, a halogen atom, an alkyl group which may have a substituent, or an alkoxy group which may have a substituent.].