Patents by Inventor Ryuichiro Abe
Ryuichiro Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230413675Abstract: A piezoelectric film laminated body includes a base member and a scandium-containing aluminum nitride film. The base member has a base surface. The scandium-containing aluminum nitride film is disposed in contact with the base surface of the base member. A surface roughness of the base surface is 0.5 nm or less in arithmetic average roughness.Type: ApplicationFiled: June 7, 2023Publication date: December 21, 2023Inventors: AKIHIKO TESHIGAHARA, HIDEO YAMADA, RYUICHIRO ABE, KENJI KIJIMA, TETSUYA ENOMOTO
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Publication number: 20230243710Abstract: A piezoelectric element includes a plurality of vibration regions that are separated from each other by a slit, and the slit is formed to have a tapered portion that is tapered from a first surface of the vibration regions on an opposite side to a support to a second surface opposite to the first surface. An electrode film is positioned inside than the slit when being viewed from a normal direction orthogonal to the first surface, and an angle formed by a side surface of the tapered portion in the vibration region and a surface parallel to the first surface is in a range of 39 to 81 degrees.Type: ApplicationFiled: April 7, 2023Publication date: August 3, 2023Inventors: TOMOYA JOMORI, RYUICHIRO ABE, DAISUKE KOBAYASHI, TAKAHIRO HIGUCHI, YUTAKA HAYAKAWA, MINEKAZU SAKAI, KAZUAKI MAWATARI, YUJI KOYAMA, MASAAKI TANAKA
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Patent number: 10901049Abstract: A magnetic sensor includes: a substrate; and first and second magnetoresistive devices on one surface of the substrate. Each of the first and second magnetoresistive devices includes: a fixed layer having an easy magnetization axis perpendicular to the one surface and having a fixed magnetization direction; a free layer having a variable magnetization direction; and an intermediate layer made of a non-magnetic material and arranged between the fixed layer and the free layer. The fixed layer includes a first ferromagnetic layer, a second ferromagnetic layer, and a non-magnetic layer arranged between the first ferromagnetic layer and the second ferromagnetic layer.Type: GrantFiled: April 17, 2019Date of Patent: January 26, 2021Assignees: DENSO CORPORATION, TOHOKU UNIVERSITYInventors: Takamoto Furuichi, Kenichi Ao, Ryuichiro Abe, Yasuo Ando, Mikihiko Oogane, Takafumi Nakano
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Publication number: 20190242957Abstract: A magnetic sensor includes: a substrate; and first and second magnetoresistive devices on one surface of the substrate. Each of the first and second magnetoresistive devices includes: a fixed layer having an easy magnetization axis perpendicular to the one surface and having a fixed magnetization direction; a free layer having a variable magnetization direction; and an intermediate layer made of a non-magnetic material and arranged between the fixed layer and the free layer. The fixed layer includes a first ferromagnetic layer, a second ferromagnetic layer, and a non-magnetic layer arranged between the first ferromagnetic layer and the second ferromagnetic layer.Type: ApplicationFiled: April 17, 2019Publication date: August 8, 2019Inventors: Takamoto FURUICHI, Kenichi AO, Ryuichiro ABE, Yasuo ANDO, Mikihiko OOGANE, Takafumi NAKANO
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Patent number: 7770452Abstract: A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.Type: GrantFiled: April 17, 2008Date of Patent: August 10, 2010Assignee: DENSO CORPORATIONInventors: Minekazu Sakai, Ryuichiro Abe, Akitoshi Yamanaka
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Patent number: 7670918Abstract: Resistor elements are formed by doping impurity into a single crystal film formed on a substrate such as a silicon-on-insulator substrate. A semiconductor device having such resistor elements is used as a detector for detecting an amount of airflow, for example. The impurity density in the single crystal silicon is made lower than 1×1020/cm3 to suppress a resistance change by aging especially at a temperature higher than 310° C. To obtain a high temperature coefficient of the resistor element as well as a low resistance change by aging, the impurity density is set in a range from 4×1019/cm3 to 1×1020/cm3, and more preferably in a range from 7×1019/cm3 to 1×1020/cm3. As the impurity, N-type impurity such as phosphorus or P-type impurity such as boron may be used. It is preferable to use the impurity having a low diffusion coefficient to attain a low resistance change by aging.Type: GrantFiled: January 15, 2008Date of Patent: March 2, 2010Assignee: DENSO CORPORATIONInventors: Yuko Fukami, Ryuichiro Abe
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Patent number: 7615832Abstract: A sensor includes: a semiconductor chip having a sensing portion and a first bump; a circuit chip having a second bump; and a resin film having a groove. The semiconductor chip and the circuit chip are integrated with sandwiching the resin film therebetween. The resin film includes a first space and a second space before the first bump is bonded to the second bump. The first space faces the sensing portion. The second space is disposed on a periphery of the first space. The resin film expands when the first bump is bonded to the second bump. The second space accommodates an expanded portion of the resin film. The first space provides the groove after the first bump is bonded to the second bump.Type: GrantFiled: February 8, 2007Date of Patent: November 10, 2009Assignee: DENSO CORPORATIONInventors: Ichiharu Kondoh, Ryuichiro Abe, Akitoshi Yamanaka, Yoshio Nakajima
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Patent number: 7541574Abstract: A sensor device includes a board, a sensor element and a resin member made of resin. The sensor element has a displace part to be displaced in a predetermined detection direction, and detects a displace amount of the displace part in the detection direction. The sensor element is mounted and connected to the board through the resin member. The resin member is arranged between the sensor element and the board in part such that a warp of the sensor element in the detection direction due to a temperature variation is smaller than a warp of the sensor element in a direction except for the detection direction.Type: GrantFiled: May 24, 2007Date of Patent: June 2, 2009Assignee: DENSO CORPORATIONInventors: Yasunori Ninomiya, Ryuichiro Abe
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Patent number: 7470996Abstract: A packaging method includes ultrasonically bonding a semiconductor device and a substrate together via bumps that include gold as a main component thereof. A contact surface of a primary bump on a surface of an aluminum pad on one side of the substrate contacts and is ultrasonically bonded to a distal end surface of each opposed secondary bump on one side of the semiconductor device. An area of the contact surface is larger than that of the opposed distal end surface. By this method, damage to the substrate from the ultrasonic can be reduced without using a reinforcing layer.Type: GrantFiled: July 12, 2006Date of Patent: December 30, 2008Assignee: DENSO CORPORATIONInventors: Takao Yoneyama, Kimiharu Kayukawa, Nobuya Makino, Ryuichiro Abe
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Publication number: 20080196501Abstract: A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.Type: ApplicationFiled: April 17, 2008Publication date: August 21, 2008Applicant: DENSO CORPORATIONInventors: Minekazu Sakai, Ryuichiro Abe, Akitoshi Yamanaka
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Publication number: 20080188027Abstract: Resistor elements are formed by doping impurity into a single crystal film formed on a substrate such as a silicon-on-insulator substrate. A semiconductor device having such resistor elements is used as a detector for detecting an amount of airflow, for example. The impurity density in the single crystal silicon is made lower than 1×1020/cm3 to suppress a resistance change by aging especially at a temperature higher than 310° C. To obtain a high temperature coefficient of the resistor element as well as a low resistance change by aging, the impurity density is set in a range from 4×1019/cm3 to 1×1020/cm3, and more preferably in a range from 7×1019/cm3 to 1×1020/cm3. As the impurity, N-type impurity such as phosphor or P-type impurity such as boron may be used. It is preferable to use the impurity having a low diffusion coefficient to attain a low resistance change by aging.Type: ApplicationFiled: January 15, 2008Publication date: August 7, 2008Applicant: DENSO CORPORATIONInventors: Yuko Fukami, Ryuichiro Abe
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Patent number: 7373821Abstract: A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.Type: GrantFiled: June 20, 2006Date of Patent: May 20, 2008Assignee: DENSO CORPORATIONInventors: Minekazu Sakai, Ryuichiro Abe, Akitoshi Yamanaka
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Patent number: 7327004Abstract: A sensor device includes a sensor chip having a movable portion on one surface, a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip, and a bump located between the sensor chip and the circuit chip. In the sensor device, the sensor chip and the circuit chip are electrically connected through the bump, and the movable portion of the sensor chip is separated from the circuit chip by a space using the bump. Accordingly, it can effectively restrict parasitic capacity of an electric connecting portion between both the chips from being changed by an impact. For example, the sensor device can be used as an angular velocity sensor device having a vibrator as the movable portion.Type: GrantFiled: December 6, 2005Date of Patent: February 5, 2008Assignee: DENSO CORPORATIONInventors: Koji Hattori, Takao Yoneyama, Ryuichiro Abe, Minekazu Sakai, Shigenori Yamauchi
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Publication number: 20070284713Abstract: A sensor device includes a board, a sensor element and a resin member made of resin. The sensor element has a displace part to be displaced in a predetermined detection direction, and detects a displace amount of the displace part in the detection direction. The sensor element is mounted and connected to the board through the resin member. The resin member is arranged between the sensor element and the board in part such that a warp of the sensor element in the detection direction due to a temperature variation is smaller than a warp of the sensor element in a direction except for the detection direction.Type: ApplicationFiled: May 24, 2007Publication date: December 13, 2007Applicant: DENSO CORPORATIONInventors: Yasunori Ninomiya, Ryuichiro Abe
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Publication number: 20070235825Abstract: A sensor includes: a semiconductor chip having a sensing portion and a first bump; a circuit chip having a second bump; and a resin film having a groove. The semiconductor chip and the circuit chip are integrated with sandwiching the resin film therebetween. The resin film includes a first space and a second space before the first bump is bonded to the second bump. The first space faces the sensing portion. The second space is disposed on a periphery of the first space. The resin film expands when the first bump is bonded to the second bump. The second space accommodates an expanded portion of the resin film. The first space provides the groove after the first bump is bonded to the second bump.Type: ApplicationFiled: February 8, 2007Publication date: October 11, 2007Applicant: DENSO CORPORATIONInventors: Ichiharu Kondoh, Ryuichiro Abe, Akitoshi Yamanaka, Yoshio Nakajima
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Publication number: 20070090536Abstract: A sensor includes: a semiconductor chip having a sensing portion; a circuit chip; and first and second films. The sensing portion is disposed on a first side of the semiconductor chip. The first side of the semiconductor chip is electrically connected to the circuit chip through a bump. The first side of the semiconductor chip faces the circuit chip. The first film is disposed on the first side of the semiconductor chip. The first film covers the sensing portion, and is made of resin, and the second film is made of resin, and disposed on a second side of the semiconductor chip.Type: ApplicationFiled: September 19, 2006Publication date: April 26, 2007Applicant: DENSO CORPORATIONInventors: Minekazu Sakai, Ryuichiro Abe, Yasunori Ninomiya
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Publication number: 20070023483Abstract: A packaging method includes ultrasonically bonding a semiconductor device and a substrate together via bumps that include gold as a main component thereof. A contact surface of a primary bump on a surface of an aluminum pad on one side of the substrate contacts and is ultrasonically bonded to a distal end surface of each opposed secondary bump on one side of the semiconductor device. An area of the contact surface is larger than that of the opposed distal end surface. By this method, damage to the substrate from the ultrasonic can be reduced without using a reinforcing layer.Type: ApplicationFiled: July 12, 2006Publication date: February 1, 2007Applicant: DENSO CORPORATIONInventors: Takao Yoneyama, Kimiharu Kayukawa, Nobuya Makino, Ryuichiro Abe
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Publication number: 20070007607Abstract: A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.Type: ApplicationFiled: June 20, 2006Publication date: January 11, 2007Applicant: DENSO CORPORATIONInventors: Minekazu Sakai, Ryuichiro Abe, Akitoshi Yamanaka
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Publication number: 20060097331Abstract: A sensor device includes a sensor chip having a movable portion on one surface, a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip, and a bump located between the sensor chip and the circuit chip. In the sensor device, the sensor chip and the circuit chip are electrically connected through the bump, and the movable portion of the sensor chip is separated from the circuit chip by a space using the bump. Accordingly, it can effectively restrict parasitic capacity of an electric connecting portion between both the chips from being changed by an impact. For example, the sensor device can be used as an angular velocity sensor device having a vibrator as the movable portion.Type: ApplicationFiled: December 6, 2005Publication date: May 11, 2006Applicant: DENSO CORPORATIONInventors: Koji Hattori, Takao Yoneyama, Ryuichiro Abe, Minekazu Sakai, Shigenori Yamauchi
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Publication number: 20040016971Abstract: A PN junction diode has a substrate 1 of a first conductivity type, and first and second stripe diffusion regions 2, 3 which are the first conductivity type and second conductivity type, respectively. The stripe diffusion regions are alternately arranged at a regular interval in a surface layer of the semiconductor substrate. The diode further includes first and second stripe electrodes 7a, 7b connected to the first and second diffusion regions along the longitudinal sides thereof, respectively. The diode further includes a third electrode 7b′ which covers through an insulation film 5, 5′ the neighboring ends of the first and second diffusion regions and of which a potential is equalized to that of the second electrode 7b having a different conductivity type from the substrate.Type: ApplicationFiled: July 28, 2003Publication date: January 29, 2004Inventors: Ryuichiro Abe, Kenji Kouno