Patents by Inventor Ryuichiro Taniguchi

Ryuichiro Taniguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photosensitive resin composition
    Patent number: 7977400
    Abstract: Using a photosensitive resin composition comprising a polyimide (a) having, at the end of the main chain, at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, an unsaturated bond-containing polymerizable compound (b1) represented by the general formula (1), and a photopolymerization initiator (c), it is possible to conduct alkaline development and to form a polyimide film having excellent heat resistance, strength and elongation.
    Type: Grant
    Filed: March 14, 2006
    Date of Patent: July 12, 2011
    Assignee: Toray Industries, Inc.
    Inventors: Ryuichiro Taniguchi, Hiroko Mitsui, Mitsuhito Suwa
  • Photosensitive resin composition
    Patent number: 7455948
    Abstract: This invention relates to a positive photosensitive resin composition allowing development with an alkaline aqueous solution and excellent in resolution, photosensitivity and pattern form even if the film formed from the resin is thick. Furthermore, this invention relates to a photosensitive resin composition comprising (a) a polymer having one or more phenolic hydroxyl groups, (b) a compound having a phenolic hydroxyl group and containing only one group selected from a methylol group and alkoxymethyl group, and (c) a photo acid generator.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: November 25, 2008
    Assignee: Toray Industries, Inc.
    Inventors: Ryuichiro Taniguchi, Tomoyuki Yuba, Masao Tomikawa
  • Photosensitive Resin Composition
    Publication number: 20080108723
    Abstract: Using a photosensitive resin composition comprising a polyimide (a) having, at the end of the main chain, at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, an unsaturated bond-containing polymerizable compound (b1) represented by the general formula (1), and a photopolymerization initiator (c), it is possible to conduct alkaline development and to form a polyimide film having excellent heat resistance, strength and elongation.
    Type: Application
    Filed: March 14, 2006
    Publication date: May 8, 2008
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Ryuichiro Taniguchi, Hiroko Mitsui, Mitsuhito Suwa
  • Photosensitive resin composition
    Publication number: 20060110680
    Abstract: This invention relates to a positive photosensitive resin composition allowing development with an alkaline aqueous solution and excellent in resolution, photosensitivity and pattern form even if the film formed from the resin is thick. Furthermore, this invention relates to a photosensitive resin composition comprising (a) a polymer having one or more phenolic hydroxyl groups, (b) a compound having a phenolic hydroxyl group and containing only one group selected from a methylol group and alkoxymethyl group, and (c) a photo acid generator.
    Type: Application
    Filed: November 16, 2005
    Publication date: May 25, 2006
    Applicant: Toray Industries, Inc.
    Inventors: Ryuichiro Taniguchi, Tomoyuki Yuba, Masao Tomikawa