Patents by Inventor Ryuji AKEBI

Ryuji AKEBI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12024624
    Abstract: The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof; and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) contains (A1) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of less than 600 and (A2) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of 600 or more. The present invention also relates to a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: July 2, 2024
    Assignee: RESONAC CORPORATION
    Inventors: Naoyoshi Sato, Shuji Gozu, Minoru Kakitani, Takao Tanigawa, Ryuji Akebi, Chihiro Hayashi
  • Publication number: 20240032209
    Abstract: Provided are a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof, (B) a modified conjugated diene polymer, and (C) a thermoplastic elastomer other than the above component (B), wherein the component (B) is one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups; and a prepreg, a resin film, a laminated board, a printed wiring board and a semiconductor package, each using the maleimide resin composition.
    Type: Application
    Filed: November 16, 2021
    Publication date: January 25, 2024
    Inventors: Chihiro HAYASHI, Minoru KAKITANI, Takao TANIGAWA, Ryuji AKEBI, Naoyoshi SATO, Akira HORIE
  • Publication number: 20230392001
    Abstract: The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof; and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) contains (A1) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of less than 600 and (A2) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of 600 or more. The present invention also relates to a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.
    Type: Application
    Filed: November 16, 2021
    Publication date: December 7, 2023
    Inventors: Naoyoshi SATO, Shuji GOZU, Minoru KAKITANI, Takao TANIGAWA, Ryuji AKEBI, Chihiro HAYASHI
  • Publication number: 20230391940
    Abstract: The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof, and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) dissolves in an alcohol-based solvent, a ketone-based solvent, an aromatic hydrocarbon-based solvent, an ester-based solvent, or a nitrogen atom-containing solvent in an amount of 30% by mass or more at 25° C. The present invention also relates to a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.
    Type: Application
    Filed: November 16, 2021
    Publication date: December 7, 2023
    Inventors: Naoyoshi SATO, Shuji GOZU, Minoru KAKITANI, Takao TANIGAWA, Ryuji AKEBI, Chihiro HAYASHI
  • Patent number: 11512214
    Abstract: Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: November 29, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Kohsuke Urashima, Yoshinori Ejiri, Takaaki Nohdoh, Motoki Yonekura, Ryuji Akebi
  • Publication number: 20200399493
    Abstract: Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.
    Type: Application
    Filed: November 13, 2018
    Publication date: December 24, 2020
    Inventors: Kohsuke URASHIMA, Yoshinori EJIRI, Takaaki NOHDOH, Motoki YONEKURA, Ryuji AKEBI