Abstract: The present invention provides a resin composition and the like having excellent high-frequency characteristics, while exhibiting high adhesion to conductors and high heat resistance. The resin composition specifically contains a thermosetting resin (A), and a thermoplastic resin (B), in which the thermoplastic resin (B) contains a block copolymer (B1) including a block (b1) that contains a structural unit derived from an aromatic hydrocarbon compound, and a block (b2) that contains a structural unit derived from a conjugated diene compound, the component (B1) does not contain a diblock copolymer, or when the component (B1) contains a diblock copolymer, the content thereof is 50% by mass or less in the component (B1), and the weight-average molecular weight of the component (B1) is 130,000 or less.

Abstract: The present invention relates to: a resin composition containing (A) a thermosetting resin, (B) one or more selected from the group consisting of a conjugated diene polymer and its derivative, having 2 or more of a functional group including an ethylenically unsaturated bond, and (C) an inorganic filler whose surface is treated with a silane coupling agent having a functional group including an ethylenically unsaturated bond; and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package, all of which use the said resin composition.

Abstract: The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof, and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) dissolves in an alcohol-based solvent, a ketone-based solvent, an aromatic hydrocarbon-based solvent, an ester-based solvent, or a nitrogen atom-containing solvent in an amount of 30% by mass or more at 25° C. The present invention also relates to a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.

Abstract: An embodiment relates to a compound including: an indene ring; a vinylbenzyl group; and an aromatic ring-containing group of 6 or more carbon atoms without a polymerizable carbon-carbon double bond, in which both of the vinylbenzyl group and the aromatic ring-containing group are directly bonded to the indene ring.

Abstract: The present invention relates to a resin composition containing (A) a thermosetting resin and (B) a copolymer resin containing a structural unit derived from an aromatic vinyl compound and a structural unit derived from an unsaturated aliphatic hydrocarbon, in which the component (B) contains a component (B1) having a content of a structural unit derived from an aromatic vinyl compound of 25 to 60% by mass, and a component (B2) having a content of a structural unit derived from an aromatic vinyl compound of less than that of the component (B1) on a mass basis, and the content of the component (B1) in the resin composition is greater than the content of the component (B2) in the resin composition on a mass basis; and a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package using the resin composition.

Abstract: Provided are a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof, (B) a modified conjugated diene polymer, and (C) a thermoplastic elastomer other than the above component (B), wherein the component (B) is one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups; and a prepreg, a resin film, a laminated board, a printed wiring board and a semiconductor package, each using the maleimide resin composition.

Abstract: The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof; and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) contains (A1) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of less than 600 and (A2) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of 600 or more. The present invention also relates to a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.

Abstract: Provided are a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof, (B) a modified conjugated diene polymer, and (C) a thermoplastic elastomer other than the above component (B), wherein the component (B) is one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups; and a prepreg, a resin film, a laminated board, a printed wiring board and a semiconductor package, each using the maleimide resin composition.

Abstract: The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof; and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) contains (A1) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of less than 600 and (A2) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of 600 or more. The present invention also relates to a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.

Abstract: The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof, and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) dissolves in an alcohol-based solvent, a ketone-based solvent, an aromatic hydrocarbon-based solvent, an ester-based solvent, or a nitrogen atom-containing solvent in an amount of 30% by mass or more at 25° C. The present invention also relates to a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.

Abstract: Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.

Abstract: Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.