Abstract: A photosensitive resin composition including an alkali-soluble resin, a photoacid generator, a first organic solvent, and a second organic solvent different from the first organic solvent, in which the alkali-soluble resin includes at least one selected from a polyimide resin, a polyimide resin, and precursors thereof, the second organic solvent includes a heterocyclic compound having a carbonyl Group (provided that N-methyl-2-pvrrolidone is excluded), and the amount or the second organic solvent is 0.001% by mass or more and 4.0% by mass or less with respect to the entire photosensitive resin composition.

Abstract: The method for manufacturing a photosensitive resin composition of the present invention is a method for manufacturing a photosensitive resin composition containing an amide bond-containing precursor having a repeating unit represented by General Formula (1), the method including a step of obtaining an activated carboxylic acid material by activating a carboxylic acid compound represented by General Formula (2) and a step of obtaining the amide bond-containing precursor by allowing an amine compound represented by General Formula (3) to act on the activated carboxylic acid material, in which at least either the step of obtaining an activated carboxylic acid material and the step of obtaining the amide bond-containing precursor is performed in a solvent containing a carbonyl group-containing heterocyclic compound.