Abstract: A method is provided in which it is possible to easily perform product development, financing, the acquisition of a manufacturing plant, the acquisition of a component vendor, the acquisition of a sales channel and the like that have so far required a large amount of time and cost. A need reception unit 101 receives, from a need provider who provides need information indicating that it is desired to manufacture a predetermined product, the need information. A design information reception unit 102 discloses the need information and receives design information provided by a participant. A design optimization unit 103 optimizes a design necessary for manufacturing the predetermined product based on the received design information. A manufacturing management unit 104 receives information on a plurality of components of the predetermined product manufactured by the participant based on the details of the optimized design. A flow progress control unit 107 performs control on the flow of the respective processing.

Abstract: An apparatus for controlling ignition timing during a shift in a vehicular automatic transmission is provided that is capable of suppressing shift shock in the event that input torque of the automatic transmission is affected by external changes, such as changes in fuel and air pressure and the like, by adjusting immediately to those changes. This control apparatus is provided with an ignition timing controller that controls an ignition timing retard amount; a calculator that calculates a basic retard amount; a detector that detects an engine retard amount; a determinator that determines a retard correction value based on a shift mode of the automatic transmission and the like; and a corrector that corrects the ignition timing retard amount of the controller based on the retard correction value, the basic retard amount, and the engine retard amount.

Abstract: An intermediate board comprising: an intermediate board body having first and second faces wherein a semiconductor device is to be mounted on at least one of said first and second faces, said semiconductor device having a coefficient of thermal expansion that is equal to or larger than 2.0 ppm/° C. and smaller than 5.0 ppm/° C., and having surface mount terminals, said intermediate board body having a plurality of through holes through which said first and second faces communicate with each other, said intermediate board body containing an inorganic insulating material; and a plurality of conductor columns filling said through holes and containing a conductive metal, said conductor columns being to be connected with said surface mount terminals.

Abstract: An apparatus for controlling ignition timing during a shift in a vehicular automatic transmission is provided that is capable of suppressing shift shock in the event that input torque of the automatic transmission is affected by external changes, such as changes in fuel and air pressure and the like, by adjusting immediately to those changes. This control apparatus is provided with an ignition timing controller that controls an ignition timing retard amount; a calculator that calculates a basic retard amount; a detector that detects an engine retard amount; a determinator that determines a retard correction value based on a shift mode of the automatic transmission and the like; and a corrector that corrects the ignition timing retard amount of the controller based on the retard correction value, the basic retard amount, and the engine retard amount.

Abstract: In a wired base plate for an electronic part, an infinite number of metallic posts made of copper are provided to a lid joining section of a plural wire layer portion, which section includes a lid joining surface area to which a lid is joined. The metallic posts supports a pressure applied thereto from a lid at the time of mounting of the wired base plate on a circuit board and prevent the plural wire layer portion having a plurality of conductor wire layers and a plurality of resinous insulation layers, from being deformed by compression. A package for an electronic part having such a wired base plate is also provided.

Abstract: An integrated circuit package comprises a power supply conductor film having a potential and conductor columns insulated from and passed through the power supply conductor film. A power supply conductor column comprises one of the conductor columns connected to a power supply having a potential different from the power supply conductor film. The other conductor columns are signal conductor columns for exchanging signals with mounted integrated circuits. An insulation space between the power supply conductor film and the power supply conductor column is greater than an insulation space between the power supply conductor film and a signal conductor column. Thereby, a probability of short-circuit occurrence in the power supply conductor film across the power supply conductor column is lowered.

Abstract: In a multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, the grounding conductor wiring is in the form of a grid and an open area ratio Rx [%]of the grid and a line width ratio Ry=Wg/Ws have a relationship expressed by Ry, .ltoreq.25.98.times.Rx.sup.-0.3871 -4.370 where Wg is the line width of the grounding conductor wiring, Sg is the width of an opening of the grid, Ws is the line width of the signal circuit wiring, and Rx={Sg/(Wg+Sg)}.sup.2 .times.100.

Abstract: An integrated circuit package in which three conductor columns for connecting an insulating substrate and an integrated circuit are connected in parallel for use as I/O vias. Thereby, the conductor columns in a multilayer wiring portion between an integrated circuit and an insulating substrate is prevented from disconnecting.

Abstract: A terminal for an electric circuit device, comprises a copper core, a gold (Au) layer provided over the copper core, and a nickel (Ni) layer having the thickness of 1.5 .mu.m or less, provided under the gold (Au) layer. In another embodiment, the core is made of an alloy containing (Ni) and covered by a metallized surface layer made of copper.

Abstract: An object of the present invention is to match impedance of each portion of whole lines of a signal wiring with the integrated circuit mounted on the package. All ground planes are deleted within a region vertically under/above a connection pad provided on the top- or bottom-surface of a polyimide multilayer part, whereby no capacitance is generated between the connection pad and the ground planes, so that the impedance of the signal wiring within the region right under/above the connection pad is prevented from being lowered.

Abstract: In a method of fabricating a multilayered interconnection for integrated circuit package, a coating of a metallized conductive pattern is formed on an upper surface of the substrate. A plurality of vertical copper studs are formed on the substrate for an interconnection with the metallized conductive pattern. A polyimide slurry is provided on the surface of the substrate to cover each top surface of the conductive studs. An upper surface of the polyimide slurry is polished to expose each top surface of the copper studs. A masking film is provided on each top surface of the copper studs prior to supplying an intermediate derivative of a polyimide polymer.

Abstract: A hydraulic control system for a continuously variable transmission having two variable-diameter pulleys, a belt connecting the pulleys to transmit power from one of the pulleys to the other, and corresponding cylinders for changing effective diameters of the pulleys.

Abstract: A hydraulic control system for a continuously variable transmission having a first and a second variable-diameter pulley provided on a first and a second shaft, a transmission belt connecting the first and second pulleys to transmit power from one of the first and second pulleys to the other, and a pair of hydraulic cylinders for changing an effective diameter of the pulleys engaging the belt. The hydraulic control system includes a hydraulic source delivering a pressurized fluid, and a flow control device for controlling a flow of the pressurized fluid from said hydraulic source into one of said hydraulic cylinders, and a flow of the fluid from said one hydraulic cylinder, thereby changing the effective diameters of the pulleys to vary a speed ratio of the transmission.