Patents by Inventor Ryuji Koga
Ryuji Koga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230271888Abstract: One aspect of the present disclosure provides a production method for a composite, the method including: a cooling step of performing cooling under a pressurized condition in a state where a heated molten material of a thermosetting composition is brought into contact with a resin-impregnated body, in which the above-described resin-impregnated body includes a nitride sintered body having a porous structure and a semi-cured product of the thermosetting composition impregnated into the above-described nitride sintered body.Type: ApplicationFiled: May 13, 2021Publication date: August 31, 2023Applicant: Denka Company LimitedInventors: Nobuya SUZUKI, Saori INOUE, Yasuhisa UESHIMA, Ryo YOSHIMATSU, Ryuji KOGA
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Publication number: 20230227370Abstract: One aspect of the present disclosure provides a composite body including: a nitride sintered body having a porous structure; and a semi-cured product of a thermosetting composition impregnated into the above-described nitride sintered body, in which dielectric breakdown voltage is 4.5 kV or higher.Type: ApplicationFiled: May 13, 2021Publication date: July 20, 2023Applicant: Denka Company LimitedInventors: Nobuya SUZUKI, Saori INOUE, Yasuhisa UESHIMA, Ryo YOSHIMATSU, Ryuji KOGA
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Patent number: 11492299Abstract: A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.Type: GrantFiled: December 5, 2018Date of Patent: November 8, 2022Assignee: DENKA COMPANY LIMITEDInventors: Yoshitaka Minakata, Eri Sasaki, Toshitaka Yamagata, Saori Inoue, Ryo Yoshimatu, Ryuji Koga
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Publication number: 20220250994Abstract: One aspect of the present invention is a method for producing a composite, including a step of placing a porous boron nitride sintered body immersed in a resin composition under a pressurized condition and then placing the boron nitride sintered body immersed in the resin composition under a pressure condition lower than the pressurized condition, wherein the step is repeated a plurality of times.Type: ApplicationFiled: March 26, 2020Publication date: August 11, 2022Applicant: Denka Company LimitedInventors: Saori INOUE, Shoji IWAKIRI, Yoshitaka MINAKATA, Ryo YOSHIMATSU, Ryuji KOGA, Tomoya YAMAGUCHI
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Publication number: 20220177375Abstract: One aspect of the present invention is a composite including: a porous boron nitride sintered body; and a resin filled in pores of the boron nitride sintered body, wherein the boron nitride sintered body has an average pore diameter of 3.5 ?m or less.Type: ApplicationFiled: March 26, 2020Publication date: June 9, 2022Applicant: Denka Company LimitedInventors: Saori INOUE, Shoji IWAKIRI, Yoshitaka MINAKATA, Ryo YOSHIMATSU, Ryuji KOGA, Tomoya YAMAGUCHI
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Patent number: 11034623Abstract: A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.Type: GrantFiled: March 28, 2018Date of Patent: June 15, 2021Assignee: DENKA COMPANY LIMITEDInventors: Saori Inoue, Toshitaka Yamagata, Yoshitaka Minakata, Ryo Yoshimatsu, Ryuji Koga
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Publication number: 20210032171Abstract: A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.Type: ApplicationFiled: December 5, 2018Publication date: February 4, 2021Applicant: DENKA COMPANY LIMITEDInventors: Yoshitaka MINAKATA, Eri SASAKI, Toshitaka YAMAGATA, Saori INOUE, Ryo YOSHIMATU, Ryuji KOGA
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Publication number: 20200406586Abstract: A ceramic-metal temporary bonding body to inhibit breakage and degradation of a ceramic resin composite having low strength includes: a ceramic resin composite in which a non-oxide ceramic sintered body is impregnated with a thermosetting resin composition having cyanate groups in such a manner that a degree of cure calculated by differential scanning calorimetry is 5.0% or more and 70% or less; and a metal plate temporarily bonded to at least one surface of the ceramic resin composite. A shear bond strength between the ceramic resin composite and the metal plate is 0.1 MPa or more and 1.0 MPa or less.Type: ApplicationFiled: March 6, 2019Publication date: December 31, 2020Applicant: DENKA COMPANY LIMITEDInventors: Yoshitaka MINAKATA, Toshitaka YAMAGATA, Saori INOUE, Ryo YOSHIMATU, Ryuji KOGA
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Patent number: 10615096Abstract: Provided is a heat dissipation structure for an electric circuit device excellent in mass-productivity and heat radiation performance. A heat dissipation structure for an electric circuit device, the structure including a layered structure comprising: a heatsink exposed on the electric circuit device; a thermal conductive member; and a cooler, wherein the thermal conductive member is a ceramic-resin composite in which a resin composition is impregnated in a ceramic sintered body, the ceramic sintered body comprising ceramic primary particles integrated into a three-dimensional structure, and wherein the thermal conductive member is arranged such that the thermal conductive member directly contacts with at least one of the heatsink and the cooler.Type: GrantFiled: August 2, 2017Date of Patent: April 7, 2020Assignee: DENKA COMPANY LIMITEDInventors: Toshitaka Yamagata, Saori Inoue, Hideki Hirotsuru, Ryoh Yoshimatu, Ryuji Koga
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Publication number: 20200031723Abstract: A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.Type: ApplicationFiled: March 28, 2018Publication date: January 30, 2020Applicant: DENKA COMPANY LIMITEDInventors: Saori INOUE, Toshitaka YAMAGATA, Yoshitaka MINAKATA, Ryo YOSHIMATSU, Ryuji KOGA
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Publication number: 20190189534Abstract: Provided is a heat dissipation structure for an electric circuit device excellent in mass-productivity and heat radiation performance. A heat dissipation structure for an electric circuit device, the structure including a layered structure comprising: a heatsink exposed on the electric circuit device; a thermal conductive member; and a cooler, wherein the thermal conductive member is a ceramic-resin composite in which a resin composition is impregnated in a ceramic sintered body, the ceramic sintered body comprising ceramic primary particles integrated into a three-dimensional structure, and wherein the thermal conductive member is arranged such that the thermal conductive member directly contacts with at least one of the heatsink and the cooler.Type: ApplicationFiled: August 2, 2017Publication date: June 20, 2019Applicant: Denka Company LimitedInventors: Toshitaka YAMAGATA, Saori INOUE, Hideki HIROTSURU, Ryoh YOSHIMATU, Ryuji KOGA
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Patent number: 6469259Abstract: A wiring board of the present invention readily controls a power source voltage and unwanted irradiation noises developed across a power source layer and a ground layer over a broad range of frequencies with a simple arrangement. The wiring board has an on-board surface on the surface of a dielectric substrate, on which a semiconductor device or the like is mounted, and a power source layer and a ground layer, which are made of a conductor material principally composed of at least one kind of element selected from Cu, W, and Mo, are provided on the back surface of the dielectric substrate or within the same. The periphery of at least one of low resistance areas of the power source layer and ground layer, respectively is provided with a corresponding high resistance area having a higher sheet resistance than that of the respective low resistance areas.Type: GrantFiled: February 27, 2001Date of Patent: October 22, 2002Assignee: Kyocera CorporationInventors: Yoshihiro Takeshita, Shinya Terao, Satoru Takenouchi, Masaki Kaji, Ryuji Koga
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Publication number: 20010050182Abstract: A wiring board of the present invention readily controls a power source voltage and unwanted irradiation noises developed across a power source layer and a ground layer over a broad range of frequencies with a simple arrangement. The wiring board has an on-board surface on the surface of a dielectric substrate, on which a semiconductor device or the like is mounted, and a power source layer and a ground layer, which are made of a conductor material principally composed of at least one kind of element selected from Cu, W, and Mo, are provided on the back surface of the dielectric substrate or within the same. The periphery of at least one of low resistance areas of the power source layer and ground layer, respectively is provided with a corresponding high resistance area having a higher sheet resistance than that of the respective low resistance areas.Type: ApplicationFiled: February 27, 2001Publication date: December 13, 2001Inventors: Yoshihiro Takeshita, Shinya Terao, Satoru Takenouchi, Masaki Kaji, Ryuji Koga
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Patent number: 5172083Abstract: A microwave plasma processing apparatus includes a microwave waveguide connected to a microwave power source, a mode converting wave guide and a plasma chamber.Type: GrantFiled: May 13, 1992Date of Patent: December 15, 1992Assignee: Nippon Steel CorporationInventors: Ryota Hidaka, Yoshinobu Kawai, Ryuji Koga, Toru Yamaguchi