Abstract: According to an embodiment, a semiconductor device includes a first chip including a substrate and a second chip bonded to the first chip. The second chip includes a first interconnect layer provided with an external connection terminal, a first semiconductor layer in contact with the first interconnect layer, and a conductor extending in a first direction, having an end portion in contact with the first semiconductor layer, and electrically coupled to the first chip.

Abstract: A sill cover includes an elongated sill cover main body, a plurality of hinges, a plurality of attachments and a linking portion. The plurality of hinges is foldably provided along a longitudinal direction of the sill cover main body. The plurality of attachments is connected to the plurality of hinges and shifts to a vehicle mounting position according to folding of the plurality of hinges. The linking portion links three attachments among the plurality of attachments to one another.

Abstract: A sill cover includes an elongated sill cover main body, a plurality of hinges, a plurality of attachments and a linking portion. The plurality of hinges is foldably provided along a longitudinal direction of the sill cover main body. The plurality of attachments is connected to the plurality of hinges and shifts to a vehicle mounting position according to folding of the plurality of hinges. The linking portion links three attachments among the plurality of attachments to one another.

Abstract: A sill cover includes an elongated sill cover main body, a step portion, hinges and attachments. The sill cover main body includes a bottom surface portion formed in a curved surface shape along a longitudinal direction of the sill cover main body. The step portion is provided to the bottom surface portion along a longitudinal direction of the bottom surface portion. The hinges are foldably provided to hinge support ends of the step portion. The attachments are connected to the hinges and shift to vehicle mounting positions according to folding of the hinges. A height of the step portion is variable along a longitudinal direction of the step portion, so that the hinge support ends are linearly arranged along the longitudinal direction of the hinge support ends.