Patents by Inventor Ryuji Moriya

Ryuji Moriya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible printed circuit board and manufacturing method
    Patent number: 6617519
    Abstract: A flexible printed circuit board including a component mount section, which an electronic component is mounted on, and a cable section, which connects to the component mount section; circuit patterns being provided on the cable section, and covered by a soft laminated adhesive.
    Type: Grant
    Filed: February 15, 2002
    Date of Patent: September 9, 2003
    Assignee: Nippon Mektron, Ltd.
    Inventors: Yuji Wakimoto, Toshihiro Watanabe, Ryuji Moriya
  • Flexible printed circuit board and manufacturing method
    Publication number: 20020112880
    Abstract: A flexible printed circuit board including a component mount section, which an electronic component is mounted on, and a cable section, which connects to the component mount section; circuit patterns being provided on the cable section, and covered by a soft laminated adhesive.
    Type: Application
    Filed: February 15, 2002
    Publication date: August 22, 2002
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Yuji Wakimoto, Toshihiro Watanabe, Ryuji Moriya