Abstract: An electronic module includes a first substrate and a frame member. The frame member includes a first surface and a second surface, and an inner wall side surface in contact with the first and second surfaces. The inner wall side surface includes at least a first end face and a second end face. A normal line to the second surface is a first line, and a line parallel to the second surface, passing through a point where the first end face contacts the second end face, is a second line. An angle formed by the first line and the first end face is different from an angle formed by the first line and the second end face. A distance between the second surface and the second line with respect to the second surface is larger than or equal to 10% of a distance between the first and second surfaces.

Abstract: The method of the invention includes: placing a base member and a frame member having a thermal expansion coefficient different from a thermal expansion coefficient of the base member in a state in which the base member is stacked with the frame member and a thermosetting adhesive agent is interposed between the base member and the frame member; adhering the base member and the frame member by heating the base member, the frame member, and the adhesive agent from the state to a temperature equal to or higher than a curing temperature of the adhesive agent; and cooling the base member and the frame member from the curing temperature. The frame member in the state is warped so that a flatness error of the frame member after having been cooled becomes smaller than that in a case where the frame member is flat in the state.

Abstract: The method of the invention includes: placing a base member and a frame member having a thermal expansion coefficient different from a thermal expansion coefficient of the base member in a state in which the base member is stacked with the frame member and a thermosetting adhesive agent is interposed between the base member and the frame member; adhering the base member and the frame member by heating the base member, the frame member, and the adhesive agent from the state to a temperature equal to or higher than a curing temperature of the adhesive agent; and cooling the base member and the frame member from the curing temperature. The frame member in the state is warped so that a flatness error of the frame member after having been cooled becomes smaller than that in a case where the frame member is flat in the state.

Abstract: A resin substrate of the present invention has a resin layer and a surface layer formed on a surface of the resin layer, wherein the surface layer is a layer comprising silicon nitride as a main component and deposited by the chemical vapor deposition method, and at the interface between the resin layer and the surface layer, at the interface between the resin layer and the surface layer, an interfacial region over which a percentage changes from 80% to 20% has a thickness of not more than 25 nm, wherein the difference between the maximum nitrogen concentration in the surface layer and the steady-state nitrogen concentration in the resin layer is taken as 100%. The surface layer has an average surface roughness (Ra) of not more than 1 nm. The resin substrate has properties of water vapor barrier and surface flatness.

Abstract: At least one filter block (25, 35, 45) is formed in a thin and flat dielectric multilayer structure (21) and fixed with radiation elements (2, 3). Each filter block includes at least one of a low-pass filter, a high-pass filter and a band-eliminating filter. On the surface (one major surface) side and/or the side face of the multilayer structure, at least one radiation element (2, 3) being connected with the filter block is provided and feeding parts (28, 38, 48) for supplying signal to the radiation elements are provided on the rear surface of the multilayer structure. Consequently, the antenna and the filter block are integrated and a small surface mountable antenna with a built-in filter of a structure such that signals are not mixed each other even when signals of a plurality of frequency bands are transmitted/received can be obtained.

Abstract: A dielectric antenna module (1) includes an antenna element unit (50) having an antenna element (5) consisting of a radiation electrode (3) and a signal line (4) formed on a dielectric substrate (2), and a module substrate unit (60) having a signal processing circuit formed on a module substrate (6). The substrate (2,6) are arranged and connected to each other so that their bottom surfaces form a single plane. The antenna element unit (50) and the module substrate unit (60) are connected to each other by fitting a projection (8) to a recess (9) formed on and in the opposing faces of the substrates (2,6). On the projection (8) and in the recess (9), signal lines (4,4a) are formed, respectively, and on the opposing faces of the substrates (2,6), ground electrodes (11,11a) are formed. When the projection and recesses are engaged, the signal lines (4,4a) are connected to each other and the ground electrodes (11,11a) are connected to each other.

Abstract: Second transistors working as temperature-monitoring elements are disposed in the vicinity of the respective first transistors (HBT cells) connected in parallel to amplify an RF signal and at positions where their thermal environments are substantially the same. Each of the second transistors is connected between its collector and its base to thereby constitute a diode through which the current rises as the temperature increases. The collectors of the second transistors are connected with a DC power supply through respective first resistors, and their emitters are grounded through respective second resistors. Further, their bases are connected with the bases of the respective first transistors through respective first inductors.

Abstract: Four frequency components (f1 to f4) (where, f1<f2<f3<f4) are input into a port (10) of a first demultiplexing filter circuit (1), and demultiplexed into low frequency components (f1 and f2) and high frequency components (f3 and f4), and input in a port (20) of a second demultiplexing filter circuit (2) and a port (30) of a third demultiplexing filter circuit (3), respectively. The frequency components (f1 and f2) are demultiplexed into the component (f1) and the component (f2) by the second demultiplexing filter circuit (2), and output from a port (23) and a port (24), respectively. The frequency components (f3 and f4) are demultiplexed into the component (f3) and the component (f4) by the third demultiplexing filter circuit (3), and output from a port (33) and a port (34), respectively.

Abstract: An approximately rectangular plate-shaped radiation member (2) is provided and support portions (4,6) are attached to lower surface end portions adjacent to a pair of parallel shorter sides of the radiation member (2). The support portion (4) is composed of a laminated circuit member including a laminated demultiplexer and a laminated band pass filter of the reception side and the transmission side respectively connected to the laminated demultiplexer. The radiation member (2) has a power supply terminal (2c) and a ground terminal (2d) at the end portion where the support portion (4) is mounted. The power supply terminal (2c) and the ground terminal (2d) are connected to an antenna terminal (4a) and the ground terminal (4b) of the laminated circuit, respectively. The radiation member (2) has a radiation electrode (2a) where a slot (2b) is formed. The shape of the slot is set so that the radiation electrode (2a) causes resonance in a plurality of frequency bands.

Abstract: A dielectric antenna module (1) includes an antenna element unit (50) having an antenna element (5) consisting of a radiation electrode (3) and a signal line (4) formed on a dielectric substrate (2), and a module substrate unit (60) having a signal processing circuit formed on a module substrate (6). The substrate (2,6) are arranged and connected to each other so that their bottom surfaces form a single plane. The antenna element unit (50) and the module substrate unit (60) are connected to each other by fitting a projection (8) to a recess (9) formed on and in the opposing faces of the substrates (2,6). On the projection (8) and in the recess (9), signal lines (4,4a) are formed, respectively, and on the opposing faces of the substrates (2,6), ground electrodes (11,11a) are formed. When the projection and recesses are engaged, the signal lines (4,4a) are connected to each other and the ground electrodes (11,11a) are connected to each other.

Abstract: At least one filter block (25, 35, 45) is formed in a thin and flat dielectric multilayer structure (21) and fixed with radiation elements (2, 3). Each filter block includes at least one of a low-pass filter, a high-pass filter and a band-eliminating filter. On the surface (one major surface) side and/or the side face of the multilayer structure, at least one radiation element (2, 3) being connected with the filter block is provided and feeding parts (28, 38, 48) for supplying signal to the radiation elements are provided on the rear surface of the multilayer structure. Consequently, the antenna and the filter block are integrated and a small surface mountable antenna with a built-in filter of a structure such that signals are not mixed each other even when signals of a plurality of frequency bands are transmitted/received can be obtained.

Abstract: An approximately rectangular plate-shaped radiation member (2) is provided and support portions (4,6) are attached to lower surface end portions adjacent to a pair of parallel shorter sides of the radiation member (2). The support portion (4) is composed of a laminated circuit member including a laminated demultiplexer and a laminated band pass filter of the reception side and the transmission side respectively connected to the laminated demultiplexer. The radiation member (2) has a power supply terminal (2c) and a ground terminal (2d) at the end portion where the support portion (4) is mounted. The power supply terminal (2c) and the ground terminal (2d) are connected to an antenna terminal (4a) and the ground terminal (4b) of the laminated circuit, respectively. The radiation member (2) has a radiation electrode (2a) where a slot (2b) is formed. The shape of the slot is set so that the radiation electrode (2a) causes resonance in a plurality of frequency bands.

Abstract: Four frequency components (f1 to f4) (where, f1<f2<f3<f4) are input into a port (10) of a first demultiplexing filter circuit (1), and demultiplexed into low frequency components (f1 and f2) and high frequency components (f3 and f4), and input in a port (20) of a second demultiplexing filter circuit (2) and a port (30) of a third demultiplexing filter circuit (3), respectively. The frequency components (f1 and f2) are demultiplexed into the component (f1) and the component (f2) by the second demultiplexing filter circuit (2), and output from a port (23) and a port (24), respectively. The frequency components (f3 and f4) are demultiplexed into the component (f3) and the component (f4) by the third demultiplexing filter circuit (3), and output from a port (33) and a port (34), respectively.