Abstract: A gold alloy and a method for producing the gold alloy. The gold alloy includes: gold; and an Au—X-RE-based hypermaterial represented by a compositional formula AU100-(a+b)XaREb, wherein, in the compositional formula, X represents at least one atom selected from the group consisting of Al, Ga, In, Si, Ge, and Sn; RE represents a rare-earth element; and a and b respectively represent a content of X and a content of RE, expressed in at %, and satisfy the following (1) and (2): 10?a?40 (1); and 13?b?17 (2), wherein the Au—X-RE-based hypermaterial is dispersed in a gold matrix phase.

Abstract: A wafer placement table includes a ceramic plate, a cooling plate, a space layer, and a space layer forming portion. The ceramic plate has a wafer placement portion at an upper surface of the ceramic plate and incorporates electrodes. The cooling plate is joined to a lower surface of the ceramic plate and has a refrigerant passage. The space layer is provided between the refrigerant passage and an upper surface of the cooling plate. The space layer forming portion is a part, surrounding the space layer, of the cooling plate. The space layer forming portion has a seam. The seam is formed by metal bonding without a seal member.

Abstract: A method of adjusting heat uniformity on a wafer mounting surface of a wafer mount having a ceramic base including the wafer mounting surface which can heat a wafer through energization and a cooling plate includes: a) preparing the wafer mount including the cooling plate including: a base including a flow path of a coolant; and a lid detachable from the base; b) measuring a temperature distribution with the lid being attached on the base while heating through the energization and cooling; c) detaching the lid and locally adjusting a shape of the flow path when the temperature distribution does not satisfy a predetermined criterion; and d) remeasuring the temperature distribution after adjusting the shape of the flow path, with the lid being attached on the base while heating through the energization and cooling, wherein the steps c) and d) are repeated until the remeasured temperature distribution satisfies the criterion.

Abstract: A soft magnetic alloy containing 1% by atom or more and 10% by atom or less of one or more elements M1 selected from Ga and Ge, substantially containing no Si, and containing Fe and unavoidable impurities as a balance.

Abstract: A motor includes a stator and a rotor rotatable about a central axis with respect to the stator, the rotor or the stator including a neodymium magnet including a material structure including a main phase with a composition represented by a composition formula: Nd—Fe—B and a grain boundary phase including an Nd concentration higher than an Nd concentration of the main phase, the grain boundary phase includes at least an alloy of Nd and an additive element M1, the additive element M1 is an element other than Fe and B, and an electrical resistivity of the neodymium magnet is equal to or greater than about 1.5 ??m.

Abstract: A member for semiconductor manufacturing apparatus has a structure in which a hollow ceramic shaft is provided on a back surface of a ceramic plate having a front surface serving as a wafer placement surface. The member for semiconductor manufacturing apparatus includes an RF electrode embedded in the ceramic plate, an RF connector disposed outside of the hollow interior of the ceramic shaft, and an RF link member provided between the RF connector and the RF electrode. The RF link member has a branching portion consisting of a plurality of RF rods, and the branching portion extends to the outside of the ceramic shaft.