Patents by Inventor Ryusuke Naito
Ryusuke Naito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9450158Abstract: An optical semiconductor device includes a metal lead frame including first and second plate portions, an optical semiconductor element mounted on the metal lead frame, and a reflector provided around the optical semiconductor element. A material for the reflector is an epoxy resin composition containing: (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) at least one of a carboxylic acid and water. Components (C) and (D) are present in a total proportion of 69 to 94 wt % based on the amount of the overall epoxy resin composition, and the component (E) is present in a proportion of 4 to 23 mol % based on the total amount of the components (B) and (E). The resin composition has a higher glass transition temperature, and is excellent in moldability and blocking resistance and substantially free from warpage.Type: GrantFiled: May 27, 2014Date of Patent: September 20, 2016Assignee: NITTO DENKO CORPORATIONInventors: Naoko Yoshida, Kazuhiro Fuke, Hidenori Onishi, Ryusuke Naito, Yuichi Fukamichi
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Publication number: 20160111611Abstract: An optical semiconductor device includes a metal lead frame including first and second plate portions, an optical semiconductor element mounted on the metal lead frame, and a reflector provided around the optical semiconductor element. A material for the reflector is an epoxy resin composition containing: (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) at least one of a carboxylic acid and water. Components (C) and (D) are present in a total proportion of 69 to 94 wt % based on the amount of the overall epoxy resin composition, and the component (E) is present in a proportion of 4 to 23 mol % based on the total amount of the components (B) and (E). The resin composition has a higher glass transition temperature, and is excellent in moldability and blocking resistance and substantially free from warpage.Type: ApplicationFiled: May 27, 2014Publication date: April 21, 2016Applicant: NITTO DENKO CORPORATIONInventors: Naoko Yoshida, Kazuhiro Fuke, Hidenori Onishi, Ryusuke Naito, Yuichi Fukamichi
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Patent number: 9110237Abstract: A method of manufacturing an optical waveguide is provided which enables a recognition device such as a CCD camera to easily recognize an alignment mark for positioning a mold for over cladding layer formation. The method includes the steps of: forming protruding cores and a protruding alignment mark on an upper surface of an under cladding layer on a substrate by a photolithographic method; and forming the over cladding layer by use of the mold positioned using the alignment mark as a guide. For the formation of the alignment mark, a photomask is used which has an opening pattern for alignment mark formation including an opening, and a light transmission amount reduction region provided around the opening and having an aperture ratio within a range greater than 10% and less than 80%. The alignment mark is formed to have a peripheral side surface in the form of an inclined surface.Type: GrantFiled: December 6, 2011Date of Patent: August 18, 2015Assignee: NITTO DENKO CORPORATIONInventors: Naoki Shibata, Ryusuke Naito, Toru Mizutani
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Patent number: 8845208Abstract: An optical connector reduced in size and capable of reducing optical coupling losses when optical waveguides are connected to each other, and a method of manufacturing the same are provided. The optical connector comprises: an optical waveguide including cores for transmitting light, an under cladding layer provided under the cores, and an over cladding layer provided over the cores; and a ferrule section for optical connection provided in each end portion of the optical waveguide. Part of at least one of the over cladding layer and the under cladding layer lying in a location corresponding to each end portion of the optical waveguide is thick-walled to become the ferrule section for optical connection. A thin-walled part of the optical connector lying between the ferrule sections is an optical waveguide section. The optical connector requires no additional component as a ferrule, and is made small in size.Type: GrantFiled: October 18, 2011Date of Patent: September 30, 2014Assignee: Nitto Denko CorporationInventors: Yuichi Tsujita, Yusuke Shimizu, Ryusuke Naito
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Patent number: 8778451Abstract: A method of manufacturing an optical waveguide is provided in which a mold that prevents fins or burrs from being formed is used for the formation of an over cladding layer in the optical waveguide. The mold for the formation of the over cladding layer is produced from a light-transmissive resin by molding using a mold member including a protruding portion identical in shape with the over cladding layer and a ridge portion provided around the protruding portion. For the formation of the over cladding layer, the cavity is filled with a photosensitive resin for the formation of the over cladding layer, and the photosensitive resin is cured by being exposed to light through the mold while cores formed on a surface of an under cladding layer are immersed in the photosensitive resin and part of the photosensitive resin spilling out of the cavity is collected in the groove.Type: GrantFiled: June 30, 2011Date of Patent: July 15, 2014Assignee: Nitto Denko CorporationInventors: Ryusuke Naito, Akiko Nagafuji
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Patent number: 8778452Abstract: A mold for the formation of an over cladding layer in an optical waveguide is integrally produced from a light-transmissive resin and a light-transmissive support plate by molding using a mold member identical in shape with the over cladding layer. In the production of the mold, a hollow resulting from the removal of the mold member serves as a cavity for the formation of the over cladding layer. For the formation of the over cladding layer, the cavity of the mold is filled with a photosensitive resin for the formation of the over cladding layer, and the photosensitive resin is cured by being exposed to light through the mold while cores formed in a pattern on a surface of an under cladding layer are immersed in the photosensitive resin.Type: GrantFiled: June 30, 2011Date of Patent: July 15, 2014Assignee: Nitto Denko CorporationInventor: Ryusuke Naito
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Patent number: 8771562Abstract: An optical waveguide production method, employs a light-transmissive mold having higher dimensional accuracy for formation of an over-cladding layer. The mold for the formation of the over-cladding layer is unitarily produced by molding a light-transmissive resin with the use of a mold component having the same shape as the over-cladding layer. A recess formed in the mold by removing the mold component in the production of the mold serves as a cavity for the formation of the over-cladding layer. For the formation of the over-cladding layer, a photosensitive resin for the over-cladding layer is injected into the cavity of the mold, and exposed through the mold to be cured while a core formed in a predetermined pattern on a surface of an under-cladding layer is immersed in the photosensitive resin.Type: GrantFiled: May 23, 2011Date of Patent: July 8, 2014Assignee: Nitto Denko CorporationInventor: Ryusuke Naito
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Patent number: 8644655Abstract: Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of the undercladding layer and the overcladding layer, and are located and formed at predetermined locations with respect to a light transmitting surface of a core. The electric circuit unit includes fitting holes into which the protruding portions fit, and are located and formed at predetermined locations with respect to the optical element.Type: GrantFiled: February 28, 2012Date of Patent: February 4, 2014Assignee: Nitto Denko CorporationInventors: Yuichi Tsujita, Masayuki Hodono, Akiko Nagafuji, Masami Inoue, Ryusuke Naito, Mitsuru Honjo
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Patent number: 8452138Abstract: An optical sensor module is provided in which an engagement portion of a board unit is fitted in a groove of an optical waveguide unit and, even with the single engagement portion, the board unit is stably supported. An optical sensor module includes an optical waveguide unit, and a board unit mounted with an optical element and coupled to the optical waveguide unit. The optical waveguide unit includes a single edge extension portion axially extending along one side edge of an over-cladding layer, a board unit engagement groove provided in the single edge extension portion, and a projection provided on a side wall of the vertical groove and kept in abutment against an engagement portion of the board unit. The board unit includes an engagement portion fitted in the vertical groove, which abuts against the projection within the vertical groove.Type: GrantFiled: January 30, 2012Date of Patent: May 28, 2013Assignee: Nitto Denko CorporationInventors: Ryusuke Naito, Emiko Tani, Masayuki Hodono, Yusuke Shimizu, Kei Nakamura
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Publication number: 20120327033Abstract: An input device which allows a user to erase display information such as a character inputted thereto is provided. The input device includes a rectangular frame-shaped optical waveguide having a rectangular hollow input-use interior, and a control means provided on the outside of one of the sides of the optical waveguide. The optical waveguide and the control means are provided on a surface of a rectangular frame-shaped retainer plate having the hollow input-use interior, and are covered with a rectangular frame-shaped protective plate. The control means includes: a light-emitting element connected to ends of light-emitting cores of the optical waveguide; a light-receiving element connected to ends of light-receiving cores of the optical waveguide; and a CPU incorporating a program for recognizing the size of the tip of a pen and the size of the tip of an eraser in a region within the hollow input-use interior.Type: ApplicationFiled: May 10, 2012Publication date: December 27, 2012Applicant: NITTO DENKO CORPORATIONInventors: Yusuke SHIMIZU, Toru MIZUTANI, Ryusuke NAITO, Toshiki NAITO, Shinichi INOUE
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Publication number: 20120237159Abstract: Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of the undercladding layer and the overcladding layer, and are located and formed at predetermined locations with respect to a light transmitting surface of a core. The electric circuit unit includes fitting holes into which the protruding portions fit, and are located and formed at predetermined locations with respect to the optical element.Type: ApplicationFiled: February 28, 2012Publication date: September 20, 2012Applicant: NITTO DENKO CORPORATIONInventors: Yuichi Tsujita, Masayuki Hodono, Akiko Nagafuji, Masami Inoue, Ryusuke Naito, Mitsuru Honjo
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Publication number: 20120201490Abstract: An optical sensor module is provided in which an engagement portion of a board unit is fitted in a groove of an optical waveguide unit and, even with the single engagement portion, the board unit is stably supported. An optical sensor module includes an optical waveguide unit, and a board unit mounted with an optical element and coupled to the optical waveguide unit. The optical waveguide unit includes a single edge extension portion axially extending along one side edge of an over-cladding layer, a board unit engagement groove provided in the single edge extension portion, and a projection provided on a side wall of the vertical groove and kept in abutment against an engagement portion of the board unit. The board unit includes an engagement portion fitted in the vertical groove, which abuts against the projection within the vertical groove.Type: ApplicationFiled: January 30, 2012Publication date: August 9, 2012Applicant: NITTO DENKO CORPORATIONInventors: Ryusuke Naito, Emiko Tani, Masayuki Hodono, Yusuke Shimizu, Kei Nakamura
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Publication number: 20120164313Abstract: A method of manufacturing an optical waveguide is provided which enables a recognition device such as a CCD camera to easily recognize an alignment mark for positioning a mold for over cladding layer formation. The method includes the steps of: forming protruding cores and a protruding alignment mark on an upper surface of an under cladding layer on a substrate by a photolithographic method; and forming the over cladding layer by use of the mold positioned using the alignment mark as a guide. For the formation of the alignment mark, a photomask is used which has an opening pattern for alignment mark formation including an opening, and a light transmission amount reduction region provided around the opening and having an aperture ratio within a range greater than 10% and less than 80%. The alignment mark is formed to have a peripheral side surface in the form of an inclined surface.Type: ApplicationFiled: December 6, 2011Publication date: June 28, 2012Applicant: NITTO DENKO CORPORATIONInventors: Naoki Shibata, Ryusuke Naito, Toru Mizutani
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Publication number: 20120134630Abstract: An optical connector reduced in size and capable of reducing optical coupling losses when optical waveguides are connected to each other, and a method of manufacturing the same are provided. The optical connector comprises: an optical waveguide including cores for transmitting light, an under cladding layer provided under the cores, and an over cladding layer provided over the cores; and a ferrule section for optical connection provided in each end portion of the optical waveguide. Part of at least one of the over cladding layer and the under cladding layer lying in a location corresponding to each end portion of the optical waveguide is thick-walled to become the ferrule section for optical connection. A thin-walled part of the optical connector lying between the ferrule sections is an optical waveguide section. The optical connector requires no additional component as a ferrule, and is made small in size.Type: ApplicationFiled: October 18, 2011Publication date: May 31, 2012Applicant: NITTO DENKO CORPORATIONInventors: Yuichi Tsujita, Yusuke Shimizu, Ryusuke Naito
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Publication number: 20120051690Abstract: An optical waveguide module for a touch panel is provided which achieves the reduction in thickness, and a method of manufacturing the same. The optical waveguide module includes an optical waveguide unit for placement along the periphery of a display screen of a display of a touch panel, and a substrate unit coupled to an outer edge portion of the optical waveguide unit so as to be in orthogonal relation to the optical waveguide unit. The substrate unit includes a substrate bent toward the optical waveguide unit, and the bend of the substrate in that state has a distal end serving as a connecting portion to an electrical interconnect line. An over cladding layer includes a slot provided in a surface thereof and extending along the periphery of the display screen of the display. The electrical interconnect line is put in the slot.Type: ApplicationFiled: August 19, 2011Publication date: March 1, 2012Applicant: NITTO DENKO CORPORATIONInventors: Ryusuke Naito, Naoki Shibata
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Publication number: 20120003385Abstract: A mold for the formation of an over cladding layer in an optical waveguide is integrally produced from a light-transmissive resin and a light-transmissive support plate by molding using a mold member identical in shape with the over cladding layer. In the production of the mold, a hollow resulting from the removal of the mold member serves as a cavity for the formation of the over cladding layer. For the formation of the over cladding layer, the cavity of the mold is filled with a photosensitive resin for the formation of the over cladding layer, and the photosensitive resin is cured by being exposed to light through the mold while cores formed in a pattern on a surface of an under cladding layer are immersed in the photosensitive resin.Type: ApplicationFiled: June 30, 2011Publication date: January 5, 2012Applicant: NITTO DENKO CORPORATIONInventor: Ryusuke Naito
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Publication number: 20120003393Abstract: A method of manufacturing an optical waveguide is provided in which a mold that prevents fins or burrs from being formed is used for the formation of an over cladding layer in the optical waveguide. The mold for the formation of the over cladding layer is produced from a light-transmissive resin by molding using a mold member including a protruding portion identical in shape with the over cladding layer and a ridge portion provided around the protruding portion. For the formation of the over cladding layer, the cavity is filled with a photosensitive resin for the formation of the over cladding layer, and the photosensitive resin is cured by being exposed to light through the mold while cores formed on a surface of an under cladding layer are immersed in the photosensitive resin and part of the photosensitive resin spilling out of the cavity is collected in the groove.Type: ApplicationFiled: June 30, 2011Publication date: January 5, 2012Applicant: NITTO DENKO CORPORATIONInventors: Ryusuke Naito, Akiko Nagafuji
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Publication number: 20110298144Abstract: An optical waveguide production method, employs a light-transmissive mold having higher dimensional accuracy for formation of an over-cladding layer. The mold for the formation of the over-cladding layer is unitarily produced by molding a light-transmissive resin with the use of a mold component having the same shape as the over-cladding layer. A recess formed in the mold by removing the mold component in the production of the mold serves as a cavity for the formation of the over-cladding layer. For the formation of the over-cladding layer, a photosensitive resin for the over-cladding layer is injected into the cavity of the mold, and exposed through the mold to be cured while a core formed in a predetermined pattern on a surface of an under-cladding layer is immersed in the photosensitive resin.Type: ApplicationFiled: May 23, 2011Publication date: December 8, 2011Applicant: NITTO DENKO CORPORATIONInventor: Ryusuke Naito