Patents by Inventor Ryusuke YAMADA
Ryusuke YAMADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240115719Abstract: Compounds or salts thereof represented by formula (I): wherein X indicates a leaving group, Y indicates an affinity peptide having a binding region in a CH2 domain in an immunoglobulin unit comprising two heavy chains and two light chains, M indicates a trivalent group linking the carbon atom in C?O adjacent to M and the carbon atom in C?W via a main chain portion consisting of 3 to 5 carbon atoms, O indicates an oxygen atom, S indicates a sulfur atom, W indicates an oxygen atom or a sulfur atom, N3 indicates an azide group, La indicates a bond or a divalent group, and Lb indicates a bond or a divalent group; and antibodies or salts thereof which can be prepared using such a compound or salt thereof, are useful for controlling the bonding ratio of an antibody and a modifying group within a desired range.Type: ApplicationFiled: September 8, 2023Publication date: April 11, 2024Applicant: Ajinomoto Co., Inc.Inventors: Tomohiro FUJII, Kei YAMADA, Yutaka MATSUDA, Ryusuke HIRAMA, Noriko HATADA, Naoko ARASHIDA
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Patent number: 11441031Abstract: A thermoplastic resin composition contains 10 to 90% by mass of (A) thermoplastic resin; 1 to 20% by mass of (B) laser direct structuring additive; and 0.3 to 7.0% by mass of (D) graphite, a total of the ingredient (A), the ingredient (B) and the ingredient (D) being always kept at 100% by mass or below, and a ratio by mass given by ingredient (B)/ingredient (D) being 1.0 to 20.Type: GrantFiled: February 25, 2019Date of Patent: September 13, 2022Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Ryusuke Yamada, Tatsuya Kikuchi, Yuki Hiwatashi
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Patent number: 11078330Abstract: Provided is a polyamide resin composition capable of providing a molded article having an excellent wear resistance while maintaining a high mechanical strength; a molded article; and a method for manufacturing a polyamide resin pellet. The polyamide resin composition includes a polyamide resin and an inorganic filler, wherein the polyamide resin includes diamine-derived constituent units and dicarboxylic acid derived constituent units; 70 mol % or more of the diamine-derived constituent units are derived from 1,4-bis(aminomethyl)cyclohexane; a molar ratio of cis:trans of the 1,4-bis(aminomethyl)cyclohexane is from 35:65 to 0:100; 70 mol % or more of the dicarboxylic acid-derived constituent units are derived from an ?,?-linear aliphatic dicarboxylic acid having from 8 to 12 carbons; and the polyamide resin includes phosphorus atoms in a ratio of from 20 to 100 mass ppm and comprises calcium atoms so as to be phosphorus atoms:calcium atoms of 1:0.3 to 0.7 in a molar ratio.Type: GrantFiled: December 6, 2017Date of Patent: August 3, 2021Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Hatsuki Oguro, Tomonori Kato, Ryusuke Yamada
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Patent number: 10988615Abstract: Provided is a polyamide resin composition capable of yielding highly abrasion-resistant molded article, while keeping high mechanical strength, and, a molded article using the polyamide resin composition. The polyamide resin composition contains (A) polyamide resin, (B) polyolefin wax, and (C) at least one metal salt selected from alkali metal salt and alkali earth metal salt, and the (A) polyamide resin contains (a-1) semiaromatic polyamide resin.Type: GrantFiled: March 6, 2017Date of Patent: April 27, 2021Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Ryusuke Yamada, Takahiro Takano
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Publication number: 20210032461Abstract: A thermoplastic resin composition contains 10 to 90% by mass of (A) thermoplastic resin; 1 to 20% by mass of (B) laser direct structuring additive; and 0.3 to 7.0% by mass of (D) graphite, a total of the ingredient (A), the ingredient (B) and the ingredient (D) being always kept at 100% by mass or below, and a ratio by mass given by ingredient (B)/ingredient (D) being 1.0 to 20.Type: ApplicationFiled: February 25, 2019Publication date: February 4, 2021Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Ryusuke YAMADA, Tatsuya KIKUCHI, Yuki HIWATASHI
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Patent number: 10857850Abstract: A stabilizer bushing installed on a stabilizer bar is made of two divided parts of rubber or the like to prevent or decrease generation of a gap in a bonding surface. The stabilizer bushing installed on an outer periphery of the stabilizer bar by adhesion includes divided rubber bushings of an upper rubber bushing and a lower rubber bushing. Before adhesion, both end portions of the upper and lower rubber bushings, respectively, in a circumferential direction are tapered so that an overlapping amount between the upper and lower rubber bushings increases toward the outer periphery side of the bushings. After adhesion, a bonding surface is bonded by pressure.Type: GrantFiled: November 5, 2018Date of Patent: December 8, 2020Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, Sumitomo Riko Company LimitedInventors: Yuji Homma, Taisuke Nishimura, Masami Endo, Norimasa Kuki, Daiki Mimpo, Ryusuke Yamada
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Patent number: 10815377Abstract: Provided is a resin molding that uses a resin composition capable of achieving high platability, while being imparted flame retardant by the halogen-containing flame retarder, a method for manufacturing a plated resin molding, and a method for manufacturing an antenna-equipped portable electronic device part. The resin composition comprises 100 parts by weight of a thermoplastic resin; 5 to 100 parts by weight of a halogen-containing flame retarder; and, 1 to 30 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive contains antimony, and; a content of an antimony-containing flame retarder auxiliary is 0.5 parts by weight or less per 100 parts by weight of the thermoplastic resin.Type: GrantFiled: October 5, 2016Date of Patent: October 27, 2020Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Ryusuke Yamada, Takahiro Takano
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Publication number: 20200224028Abstract: Provided is a thermoplastic resin composition capable of yielding a resin molding well suppressed from warping after heating, while successfully maintaining high mechanical strength, and such resin molding. Provided is a thermoplastic resin composition containing LDS and capable of yielding a resin molding on which a plating layer can be formed, and, well suppressed from warping after heating while successfully maintaining high mechanical strength, such resin molding, and methods for manufacturing a plated resin molding and a portable electronic device part. The thermoplastic resin composition containing 10 to 100 parts by mass of a reinforcing filler, per 100 parts by mass of a crystalline thermoplastic resin, the reinforcing filler containing a reinforcing fiber and a glass flake having a thickness of 0.1 to 2 ?m, with reinforcing fiber/glass flake, which is mass ratio of the reinforcing fiber and the glass flake, adjusted to 0.1 to 1.Type: ApplicationFiled: September 28, 2018Publication date: July 16, 2020Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Ryusuke YAMADA, Yuki HIWATASHI
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Patent number: 10619031Abstract: Provided is resin molded articles having large elastic modulus, and good appearance. A thermoplastic resin composition contains 80 to 120 parts by weight of a carbon fiber and 0.1 to 3.0 parts by weight of a black colorant, per 100 parts by weight of a (A) crystallizable thermoplastic resin which shows a semicrystallization time (ST (P)) of 20 to 500 seconds, wherein the semicrystallization time is measured by depolarization photometry, under conditions that a sample melting temperature is 20 to 40° C. higher than a melting point of the crystallizable thermoplastic resin, a sample melting time is 3 minutes, and an oil bath temperature for crystallization is 140° C.Type: GrantFiled: June 13, 2014Date of Patent: April 14, 2020Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Takahiro Takano, Ryusuke Yamada
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Publication number: 20200087459Abstract: Provided is a polyamide resin composition capable of providing a molded article having an excellent wear resistance while maintaining a high mechanical strength; a molded article; and a method for manufacturing a polyamide resin pellet. The polyamide resin composition includes a polyamide resin and an inorganic filler, wherein the polyamide resin includes diamine-derived constituent units and dicarboxylic acid derived constituent units; 70 mol % or more of the diamine-derived constituent units are derived from 1,4-bis(aminomethyl)cyclohexane; a molar ratio of cis:trans of the 1,4-bis(aminomethyl)cyclohexane is from 35:65 to 0:100; 70 mol % or more of the dicarboxylic acid-derived constituent units are derived from an ?,?-linear aliphatic dicarboxylic acid having from 8 to 12 carbons; and the polyamide resin includes phosphorus atoms in a ratio of from 20 to 100 mass ppm and comprises calcium atoms so as to be phosphorus atoms:calcium atoms of 1:0.3 to 0.7 in a molar ratio.Type: ApplicationFiled: December 6, 2017Publication date: March 19, 2020Inventors: Hatsuki OGURO, Tomonori KATO, Ryusuke YAMADA
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Patent number: 10472536Abstract: Making formation of a plated layer on a surface of a resin molded article possible, without adding the LDS additive to the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, the composition comprising a water-compatible organic substance, water, and a laser direct structuring additive. Further provided is a kit having the composition for forming a laser direct structuring layer and a method for manufacturing a resin molded article with a plated layer, which uses the composition for forming a laser direct structuring layer.Type: GrantFiled: June 26, 2015Date of Patent: November 12, 2019Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Masahide Sugiyama, Ryusuke Yamada, Tatsuya Kikuchi, Yasushi Yamanaka
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Publication number: 20190135069Abstract: A stabilizer bushing installed on a stabilizer bar is made of two divided parts of rubber or the like to prevent or decrease generation of a gap in a bonding surface. The stabilizer bushing installed on an outer periphery of the stabilizer bar by adhesion includes divided rubber bushings of an upper rubber bushing and a lower rubber bushing. Before adhesion, both end portions of the upper and lower rubber bushings, respectively, in a circumferential direction are tapered so that an overlapping amount between the upper and lower rubber bushings increases toward the outer periphery side of the bushings.Type: ApplicationFiled: November 5, 2018Publication date: May 9, 2019Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, Sumitomo Riko Company LimitedInventors: Yuji HOMMA, Taisuke NISHIMURA, Masami ENDO, Norimasa KUKI, Daiki MIMPO, Ryusuke YAMADA
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Publication number: 20190077957Abstract: Provided is a polyamide resin composition capable of yielding highly abrasion-resistant molded article, while keeping high mechanical strength, and, a molded article using the polyamide resin composition. The polyamide resin composition contains (A) polyamide resin, (B) polyolef in wax, and (C) at least one metal salt selected from alkali metal salt and alkali earth metal salt, and the (A) polyamide resin contains (a-1) semiaromatic polyamide resin.Type: ApplicationFiled: March 6, 2017Publication date: March 14, 2019Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Ryusuke YAMADA, Takahiro TAKANO
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Patent number: 10131781Abstract: The invention is a polyacetal resin composition containing a polyacetal resin (A) and a polyethylene resin (B), in which the blending proportion of the polyacetal resin (A) occupying in the total mass of the polyacetal resin (A) and the polyethylene resin (B) is 10 to 90 mass %, the melt flow rate of the polyacetal resin (A) measured at a condition of 190° C. and 2.16 kg load is 30 g/10 minutes or less, and the polyethylene resin (B) consists of a modified polyethylene resin and the modification rate is 0.01 mass % or more based on 100 mass % of the total mass of the polyethylene resin and the melt flow rate of the polyethylene resin (B) measured at a condition of 190° C. and 2.16 kg load is 2.5 g/10 minutes or less.Type: GrantFiled: August 1, 2013Date of Patent: November 20, 2018Assignees: MITSUBISHI ENGINEERING-PLASTICS CORPORATION, JAPAN POLYETHYLENE CORPORATIONInventors: Ryusuke Yamada, Masayuki Nagai, Satoshi Nagai, Kunihiko Fujimoto, Kei Takahashi
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Publication number: 20180298190Abstract: Provided is a resin molding that uses a resin composition capable of achieving high platability, while being imparted flame retardant by the halogen-containing flame retarder, a method for manufacturing a plated resin molding, and a method for manufacturing an antenna-equipped portable electronic device part. The resin composition comprises 100 parts by weight of a thermoplastic resin; 5 to 100 parts by weight of a halogen-containing flame retarder; and, 1 to 30 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive contains antimony, and; a content of an antimony-containing flame retarder auxiliary is 0.5 parts by weight or less per 100 parts by weight of the thermoplastic resin.Type: ApplicationFiled: October 5, 2016Publication date: October 18, 2018Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Ryusuke YAMADA, Takahiro TAKANO
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Patent number: 9969877Abstract: Provided is a resin composition having higher platability. The resin composition contains at least two kinds of metals and also containing a conductive oxide having a resistivity of 5×103 ?·cm or less.Type: GrantFiled: June 25, 2014Date of Patent: May 15, 2018Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Tatsuya Kikuchi, Ryusuke Yamada, Yasushi Yamanaka
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Publication number: 20170282447Abstract: Provided is a method of manufacturing a stabilizer bar with a rubber bush including manufacturing a rubber bush without an intermediate plate by subjecting a rubber composition containing butadiene rubber and natural rubber as a polymer to vulcanization molding; applying a thermosetting adhesive onto at least one of an inner peripheral surface of the rubber bush and an outer peripheral surface of the stabilizer bar, to thereby form a thermosetting adhesive layer; inserting and fitting the stabilizer bar into the rubber bush; holding the rubber bush with a fixing jig such that the rubber bush is compressed at a rate of 0% to 5%, at 25° C., in a direction of the stabilizer bar fitted into the rubber bush; and heating the rubber bush in the state to cure the thermosetting adhesive, to thereby bond and fix the rubber bush onto the stabilizer bar.Type: ApplicationFiled: March 1, 2017Publication date: October 5, 2017Applicant: Sumitomo Riko Company LimitedInventors: Yasuo Suzuki, Takamitsu Hayashi, Norimasa Kuki, Ryusuke Yamada, Ryusuke Ohnishi
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Publication number: 20170137660Abstract: Making formation of a plated layer on a surface of a resin molded article possible, without adding the LDS additive to the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, the composition comprising a water-compatible organic substance, water, and a laser direct structuring additive. Further provided is a kit having the composition for forming a laser direct structuring layer and a method for manufacturing a resin molded article with a plated layer, which uses the composition for forming a laser direct structuring layer.Type: ApplicationFiled: June 26, 2015Publication date: May 18, 2017Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Masahide SUGIYAMA, Ryusuke YAMADA, Tatsuya KIKUCHI, Yasushi YAMANAKA
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Publication number: 20160298242Abstract: Provided is a process for manufacturing a resin molded article, processes for manufacturing resin molded articles having high mechanical strength and low shielding properties that may be directly plated on their surfaces, a resin molded article having a plated layer obtained by the process. The process for manufacturing a resin molded article contains thermally molding a sheet containing a thermoplastic resin and a fiber together with a composition containing a thermoplastic resin belonging to a similar type to that of the thermoplastic resin of the sheet and a laser direct structuring additive.Type: ApplicationFiled: November 5, 2014Publication date: October 13, 2016Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Kei MORIMOTO, Masaki TAMURA, Takahiro TAKANO, Ryusuke YAMADA
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Publication number: 20160215124Abstract: Provided is a thermoplastic resin composition capable of producing a resin molded article having high resistance to soldering heat, good platability (appearance of plating layer), high thermal conductivity and high volume resistivity. The thermoplastic resin composition includes, per (A) 100 parts by weight of crystallizable thermoplastic resin showing a melting point of 250° C. or higher when measured by differential scanning colorimetry (DSC) at a temperature elevation rate of 10° C./min; (B) 40 to 150 parts by weight of insulating thermal conductive filler showing a thermal conductivity of 10 w/m·K or larger; (C) 3 to 20 parts by weight of laser direct structuring additive; and (D) 10 to 130 parts by weight of titanium oxide; wherein a total content of the (B) insulating thermal conductive filler, the (C) laser direct structuring additive and the (D) titanium oxide is 40 to 65% by weight of the resin composition.Type: ApplicationFiled: September 3, 2014Publication date: July 28, 2016Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Takahiro TAKANO, Ryusuke YAMADA, Shinichi AYUBA