Patents by Inventor Ryusuke YAMADA

Ryusuke YAMADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240115719
    Abstract: Compounds or salts thereof represented by formula (I): wherein X indicates a leaving group, Y indicates an affinity peptide having a binding region in a CH2 domain in an immunoglobulin unit comprising two heavy chains and two light chains, M indicates a trivalent group linking the carbon atom in C?O adjacent to M and the carbon atom in C?W via a main chain portion consisting of 3 to 5 carbon atoms, O indicates an oxygen atom, S indicates a sulfur atom, W indicates an oxygen atom or a sulfur atom, N3 indicates an azide group, La indicates a bond or a divalent group, and Lb indicates a bond or a divalent group; and antibodies or salts thereof which can be prepared using such a compound or salt thereof, are useful for controlling the bonding ratio of an antibody and a modifying group within a desired range.
    Type: Application
    Filed: September 8, 2023
    Publication date: April 11, 2024
    Applicant: Ajinomoto Co., Inc.
    Inventors: Tomohiro FUJII, Kei YAMADA, Yutaka MATSUDA, Ryusuke HIRAMA, Noriko HATADA, Naoko ARASHIDA
  • Patent number: 11441031
    Abstract: A thermoplastic resin composition contains 10 to 90% by mass of (A) thermoplastic resin; 1 to 20% by mass of (B) laser direct structuring additive; and 0.3 to 7.0% by mass of (D) graphite, a total of the ingredient (A), the ingredient (B) and the ingredient (D) being always kept at 100% by mass or below, and a ratio by mass given by ingredient (B)/ingredient (D) being 1.0 to 20.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: September 13, 2022
    Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Ryusuke Yamada, Tatsuya Kikuchi, Yuki Hiwatashi
  • Patent number: 11078330
    Abstract: Provided is a polyamide resin composition capable of providing a molded article having an excellent wear resistance while maintaining a high mechanical strength; a molded article; and a method for manufacturing a polyamide resin pellet. The polyamide resin composition includes a polyamide resin and an inorganic filler, wherein the polyamide resin includes diamine-derived constituent units and dicarboxylic acid derived constituent units; 70 mol % or more of the diamine-derived constituent units are derived from 1,4-bis(aminomethyl)cyclohexane; a molar ratio of cis:trans of the 1,4-bis(aminomethyl)cyclohexane is from 35:65 to 0:100; 70 mol % or more of the dicarboxylic acid-derived constituent units are derived from an ?,?-linear aliphatic dicarboxylic acid having from 8 to 12 carbons; and the polyamide resin includes phosphorus atoms in a ratio of from 20 to 100 mass ppm and comprises calcium atoms so as to be phosphorus atoms:calcium atoms of 1:0.3 to 0.7 in a molar ratio.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: August 3, 2021
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Hatsuki Oguro, Tomonori Kato, Ryusuke Yamada
  • Patent number: 10988615
    Abstract: Provided is a polyamide resin composition capable of yielding highly abrasion-resistant molded article, while keeping high mechanical strength, and, a molded article using the polyamide resin composition. The polyamide resin composition contains (A) polyamide resin, (B) polyolefin wax, and (C) at least one metal salt selected from alkali metal salt and alkali earth metal salt, and the (A) polyamide resin contains (a-1) semiaromatic polyamide resin.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: April 27, 2021
    Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Ryusuke Yamada, Takahiro Takano
  • Publication number: 20210032461
    Abstract: A thermoplastic resin composition contains 10 to 90% by mass of (A) thermoplastic resin; 1 to 20% by mass of (B) laser direct structuring additive; and 0.3 to 7.0% by mass of (D) graphite, a total of the ingredient (A), the ingredient (B) and the ingredient (D) being always kept at 100% by mass or below, and a ratio by mass given by ingredient (B)/ingredient (D) being 1.0 to 20.
    Type: Application
    Filed: February 25, 2019
    Publication date: February 4, 2021
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Ryusuke YAMADA, Tatsuya KIKUCHI, Yuki HIWATASHI
  • Patent number: 10857850
    Abstract: A stabilizer bushing installed on a stabilizer bar is made of two divided parts of rubber or the like to prevent or decrease generation of a gap in a bonding surface. The stabilizer bushing installed on an outer periphery of the stabilizer bar by adhesion includes divided rubber bushings of an upper rubber bushing and a lower rubber bushing. Before adhesion, both end portions of the upper and lower rubber bushings, respectively, in a circumferential direction are tapered so that an overlapping amount between the upper and lower rubber bushings increases toward the outer periphery side of the bushings. After adhesion, a bonding surface is bonded by pressure.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: December 8, 2020
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, Sumitomo Riko Company Limited
    Inventors: Yuji Homma, Taisuke Nishimura, Masami Endo, Norimasa Kuki, Daiki Mimpo, Ryusuke Yamada
  • Patent number: 10815377
    Abstract: Provided is a resin molding that uses a resin composition capable of achieving high platability, while being imparted flame retardant by the halogen-containing flame retarder, a method for manufacturing a plated resin molding, and a method for manufacturing an antenna-equipped portable electronic device part. The resin composition comprises 100 parts by weight of a thermoplastic resin; 5 to 100 parts by weight of a halogen-containing flame retarder; and, 1 to 30 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive contains antimony, and; a content of an antimony-containing flame retarder auxiliary is 0.5 parts by weight or less per 100 parts by weight of the thermoplastic resin.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: October 27, 2020
    Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Ryusuke Yamada, Takahiro Takano
  • Publication number: 20200224028
    Abstract: Provided is a thermoplastic resin composition capable of yielding a resin molding well suppressed from warping after heating, while successfully maintaining high mechanical strength, and such resin molding. Provided is a thermoplastic resin composition containing LDS and capable of yielding a resin molding on which a plating layer can be formed, and, well suppressed from warping after heating while successfully maintaining high mechanical strength, such resin molding, and methods for manufacturing a plated resin molding and a portable electronic device part. The thermoplastic resin composition containing 10 to 100 parts by mass of a reinforcing filler, per 100 parts by mass of a crystalline thermoplastic resin, the reinforcing filler containing a reinforcing fiber and a glass flake having a thickness of 0.1 to 2 ?m, with reinforcing fiber/glass flake, which is mass ratio of the reinforcing fiber and the glass flake, adjusted to 0.1 to 1.
    Type: Application
    Filed: September 28, 2018
    Publication date: July 16, 2020
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Ryusuke YAMADA, Yuki HIWATASHI
  • Patent number: 10619031
    Abstract: Provided is resin molded articles having large elastic modulus, and good appearance. A thermoplastic resin composition contains 80 to 120 parts by weight of a carbon fiber and 0.1 to 3.0 parts by weight of a black colorant, per 100 parts by weight of a (A) crystallizable thermoplastic resin which shows a semicrystallization time (ST (P)) of 20 to 500 seconds, wherein the semicrystallization time is measured by depolarization photometry, under conditions that a sample melting temperature is 20 to 40° C. higher than a melting point of the crystallizable thermoplastic resin, a sample melting time is 3 minutes, and an oil bath temperature for crystallization is 140° C.
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: April 14, 2020
    Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Takahiro Takano, Ryusuke Yamada
  • Publication number: 20200087459
    Abstract: Provided is a polyamide resin composition capable of providing a molded article having an excellent wear resistance while maintaining a high mechanical strength; a molded article; and a method for manufacturing a polyamide resin pellet. The polyamide resin composition includes a polyamide resin and an inorganic filler, wherein the polyamide resin includes diamine-derived constituent units and dicarboxylic acid derived constituent units; 70 mol % or more of the diamine-derived constituent units are derived from 1,4-bis(aminomethyl)cyclohexane; a molar ratio of cis:trans of the 1,4-bis(aminomethyl)cyclohexane is from 35:65 to 0:100; 70 mol % or more of the dicarboxylic acid-derived constituent units are derived from an ?,?-linear aliphatic dicarboxylic acid having from 8 to 12 carbons; and the polyamide resin includes phosphorus atoms in a ratio of from 20 to 100 mass ppm and comprises calcium atoms so as to be phosphorus atoms:calcium atoms of 1:0.3 to 0.7 in a molar ratio.
    Type: Application
    Filed: December 6, 2017
    Publication date: March 19, 2020
    Inventors: Hatsuki OGURO, Tomonori KATO, Ryusuke YAMADA
  • Patent number: 10472536
    Abstract: Making formation of a plated layer on a surface of a resin molded article possible, without adding the LDS additive to the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, the composition comprising a water-compatible organic substance, water, and a laser direct structuring additive. Further provided is a kit having the composition for forming a laser direct structuring layer and a method for manufacturing a resin molded article with a plated layer, which uses the composition for forming a laser direct structuring layer.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: November 12, 2019
    Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Masahide Sugiyama, Ryusuke Yamada, Tatsuya Kikuchi, Yasushi Yamanaka
  • Publication number: 20190135069
    Abstract: A stabilizer bushing installed on a stabilizer bar is made of two divided parts of rubber or the like to prevent or decrease generation of a gap in a bonding surface. The stabilizer bushing installed on an outer periphery of the stabilizer bar by adhesion includes divided rubber bushings of an upper rubber bushing and a lower rubber bushing. Before adhesion, both end portions of the upper and lower rubber bushings, respectively, in a circumferential direction are tapered so that an overlapping amount between the upper and lower rubber bushings increases toward the outer periphery side of the bushings.
    Type: Application
    Filed: November 5, 2018
    Publication date: May 9, 2019
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, Sumitomo Riko Company Limited
    Inventors: Yuji HOMMA, Taisuke NISHIMURA, Masami ENDO, Norimasa KUKI, Daiki MIMPO, Ryusuke YAMADA
  • Publication number: 20190077957
    Abstract: Provided is a polyamide resin composition capable of yielding highly abrasion-resistant molded article, while keeping high mechanical strength, and, a molded article using the polyamide resin composition. The polyamide resin composition contains (A) polyamide resin, (B) polyolef in wax, and (C) at least one metal salt selected from alkali metal salt and alkali earth metal salt, and the (A) polyamide resin contains (a-1) semiaromatic polyamide resin.
    Type: Application
    Filed: March 6, 2017
    Publication date: March 14, 2019
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Ryusuke YAMADA, Takahiro TAKANO
  • Patent number: 10131781
    Abstract: The invention is a polyacetal resin composition containing a polyacetal resin (A) and a polyethylene resin (B), in which the blending proportion of the polyacetal resin (A) occupying in the total mass of the polyacetal resin (A) and the polyethylene resin (B) is 10 to 90 mass %, the melt flow rate of the polyacetal resin (A) measured at a condition of 190° C. and 2.16 kg load is 30 g/10 minutes or less, and the polyethylene resin (B) consists of a modified polyethylene resin and the modification rate is 0.01 mass % or more based on 100 mass % of the total mass of the polyethylene resin and the melt flow rate of the polyethylene resin (B) measured at a condition of 190° C. and 2.16 kg load is 2.5 g/10 minutes or less.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: November 20, 2018
    Assignees: MITSUBISHI ENGINEERING-PLASTICS CORPORATION, JAPAN POLYETHYLENE CORPORATION
    Inventors: Ryusuke Yamada, Masayuki Nagai, Satoshi Nagai, Kunihiko Fujimoto, Kei Takahashi
  • Publication number: 20180298190
    Abstract: Provided is a resin molding that uses a resin composition capable of achieving high platability, while being imparted flame retardant by the halogen-containing flame retarder, a method for manufacturing a plated resin molding, and a method for manufacturing an antenna-equipped portable electronic device part. The resin composition comprises 100 parts by weight of a thermoplastic resin; 5 to 100 parts by weight of a halogen-containing flame retarder; and, 1 to 30 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive contains antimony, and; a content of an antimony-containing flame retarder auxiliary is 0.5 parts by weight or less per 100 parts by weight of the thermoplastic resin.
    Type: Application
    Filed: October 5, 2016
    Publication date: October 18, 2018
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Ryusuke YAMADA, Takahiro TAKANO
  • Patent number: 9969877
    Abstract: Provided is a resin composition having higher platability. The resin composition contains at least two kinds of metals and also containing a conductive oxide having a resistivity of 5×103 ?·cm or less.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: May 15, 2018
    Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Tatsuya Kikuchi, Ryusuke Yamada, Yasushi Yamanaka
  • Publication number: 20170282447
    Abstract: Provided is a method of manufacturing a stabilizer bar with a rubber bush including manufacturing a rubber bush without an intermediate plate by subjecting a rubber composition containing butadiene rubber and natural rubber as a polymer to vulcanization molding; applying a thermosetting adhesive onto at least one of an inner peripheral surface of the rubber bush and an outer peripheral surface of the stabilizer bar, to thereby form a thermosetting adhesive layer; inserting and fitting the stabilizer bar into the rubber bush; holding the rubber bush with a fixing jig such that the rubber bush is compressed at a rate of 0% to 5%, at 25° C., in a direction of the stabilizer bar fitted into the rubber bush; and heating the rubber bush in the state to cure the thermosetting adhesive, to thereby bond and fix the rubber bush onto the stabilizer bar.
    Type: Application
    Filed: March 1, 2017
    Publication date: October 5, 2017
    Applicant: Sumitomo Riko Company Limited
    Inventors: Yasuo Suzuki, Takamitsu Hayashi, Norimasa Kuki, Ryusuke Yamada, Ryusuke Ohnishi
  • Publication number: 20170137660
    Abstract: Making formation of a plated layer on a surface of a resin molded article possible, without adding the LDS additive to the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, the composition comprising a water-compatible organic substance, water, and a laser direct structuring additive. Further provided is a kit having the composition for forming a laser direct structuring layer and a method for manufacturing a resin molded article with a plated layer, which uses the composition for forming a laser direct structuring layer.
    Type: Application
    Filed: June 26, 2015
    Publication date: May 18, 2017
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Masahide SUGIYAMA, Ryusuke YAMADA, Tatsuya KIKUCHI, Yasushi YAMANAKA
  • Publication number: 20160298242
    Abstract: Provided is a process for manufacturing a resin molded article, processes for manufacturing resin molded articles having high mechanical strength and low shielding properties that may be directly plated on their surfaces, a resin molded article having a plated layer obtained by the process. The process for manufacturing a resin molded article contains thermally molding a sheet containing a thermoplastic resin and a fiber together with a composition containing a thermoplastic resin belonging to a similar type to that of the thermoplastic resin of the sheet and a laser direct structuring additive.
    Type: Application
    Filed: November 5, 2014
    Publication date: October 13, 2016
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Kei MORIMOTO, Masaki TAMURA, Takahiro TAKANO, Ryusuke YAMADA
  • Publication number: 20160215124
    Abstract: Provided is a thermoplastic resin composition capable of producing a resin molded article having high resistance to soldering heat, good platability (appearance of plating layer), high thermal conductivity and high volume resistivity. The thermoplastic resin composition includes, per (A) 100 parts by weight of crystallizable thermoplastic resin showing a melting point of 250° C. or higher when measured by differential scanning colorimetry (DSC) at a temperature elevation rate of 10° C./min; (B) 40 to 150 parts by weight of insulating thermal conductive filler showing a thermal conductivity of 10 w/m·K or larger; (C) 3 to 20 parts by weight of laser direct structuring additive; and (D) 10 to 130 parts by weight of titanium oxide; wherein a total content of the (B) insulating thermal conductive filler, the (C) laser direct structuring additive and the (D) titanium oxide is 40 to 65% by weight of the resin composition.
    Type: Application
    Filed: September 3, 2014
    Publication date: July 28, 2016
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Takahiro TAKANO, Ryusuke YAMADA, Shinichi AYUBA