Patents by Inventor Ryuta IKOMA

Ryuta IKOMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method for manufacturing same
    Patent number: 11127702
    Abstract: A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: September 21, 2021
    Assignee: DENSO CORPORATION
    Inventors: Mariko Fujieda, Kazuaki Mawatari, Ryuta Ikoma, Kazuya Hirasawa, Shinji Kawano
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
    Publication number: 20190252336
    Abstract: A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.
    Type: Application
    Filed: April 24, 2019
    Publication date: August 15, 2019
    Inventors: Mariko FUJIEDA, Kazuaki MAWATARI, Ryuta IKOMA, Kazuya HIRASAWA, Shinji KAWANO